公开(公告)号：US09234038B2

公开(公告)日：2016-01-12

申请号：US13353574

申请日：2012-01-19

申请人： Yong-Keun Jung ,  Sungmin Song

发明人： Yong-Keun Jung ,  Sungmin Song

IPC分类号： A61K38/08 ,  A61K38/04 ,  A61K38/17 ,  C07K7/06 ,  C07K16/28

CPC分类号： C07K16/283 ,  A61K38/04 ,  A61K38/08 ,  A61K38/1716 ,  A61K38/1774 ,  C07K7/06 ,  G01N2333/4709 ,  G01N2800/2821

摘要： Disclosed herein are methods of diagnosing, preventing and treating Alzheimer's disease based on the use of an inhibitor for the binding of amyloid-β (Aβ) to FcγRIIb, and a method of screening the inhibitor. The inhibitor is selected from the group consisting of an FcγRIIb protein or a variant thereof, an FcγRIIb extracellular domain, an anti-FcγRIIb antibody, an FcγRIIb-specific peptide and an FcγRIIb-specific siRNA. The inhibitor reduces the toxic signaling and intracellular translocation of Aβ and the neurotoxicity, neuronal cell death and memory impairment mediated by Aβ by inhibiting the binding between Aβ and FcγRIIb. Thus, the inhibitor is useful in the diagnosis, prevention and treatment of Alzheimer's disease.

摘要翻译： 本文公开了基于使用抑制剂结合淀粉样蛋白的方法来诊断，预防和治疗阿尔茨海默氏病; （A＆bgr））与FcγRIIb的结合，以及筛选抑制剂的方法。 抑制剂选自FcγRIIb蛋白或其变体，FcγRIIb细胞外结构域，抗FcγRIIb抗体，FcγRIIb特异性肽和FcγRIIb特异性siRNA。 该抑制剂可降低A＆bgr的毒性信号传导和细胞内易位; 以及由A＆Bgr介导的神经毒性，神经元细胞死亡和记忆障碍; 通过抑制A和Bgr之间的结合; 和FcγRIIb。 因此，该抑制剂可用于诊断，预防和治疗阿尔茨海默病。

公开(公告)号：US08779562B2

公开(公告)日：2014-07-15

申请号：US13071228

申请日：2011-03-24

申请人： SeongMin Lee ,  Sungmin Song ,  SeongHun Mun

发明人： SeongMin Lee ,  Sungmin Song ,  SeongHun Mun

IPC分类号： H01L23/552 ,  H01L23/31 ,  H01L25/10

CPC分类号： H01L23/3128 ,  H01L23/552 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a bottom substrate; attaching a first integrated circuit die to the bottom substrate; forming an interposer including: forming an intermediate substrate; forming a shield on the intermediate substrate; and applying a wire-in-film adhesive to the shield; and attaching the interposer to the first integrated circuit die with the wire-in-film adhesive.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供底部基板; 将第一集成电路管芯附接到底部基板; 形成中间层，包括：形成中间基板; 在中间基板上形成屏蔽; 以及将膜线胶粘剂施加到所述护罩上; 以及用所述线内胶粘剂将所述插入件附接到所述第一集成电路模具。

公开(公告)号：US20120241980A1

公开(公告)日：2012-09-27

申请号：US13071397

申请日：2011-03-24

申请人： WonJun Ko ,  Sungmin Song ,  Jong Wook Ju ,  JaEun Yun ,  Hye Ran Lee

发明人： WonJun Ko ,  Sungmin Song ,  Jong Wook Ju ,  JaEun Yun ,  Hye Ran Lee

IPC分类号： H01L25/065 ,  H01L21/98

CPC分类号： H01L25/105 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a central integrated circuit over the base substrate; mounting a side package having a side package substrate along a peripheral region of the base substrate and laterally peripheral to the central integrated circuit with the side package substrate coplanar with the central integrated circuit; and encapsulating the central integrated circuit and the side package above the base substrate with a base encapsulation to form a planar surface over the central integrated circuit and the side package facing away from the base substrate.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供基底; 在基底基板上安装中央集成电路; 沿着所述基底基板的周边区域安装具有侧封装基板的侧封装，并且所述侧封装具有与所述中央集成电路共面的侧封装基板的中央集成电路的横向周边; 并且用基底封装将中央集成电路和侧封装封装在基底衬底之上，以在中心集成电路和侧封装背面上形成平面，背面远离基底。

公开(公告)号：US20090085199A1

公开(公告)日：2009-04-02

申请号：US11865064

申请日：2007-09-30

申请人： In Sang Yoon ,  Sungmin Song

发明人： In Sang Yoon ,  Sungmin Song

IPC分类号： H01L23/34

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: providing a substrate; attaching an integrated circuit over the substrate; attaching an integrated circuit subassembly system having a perforated interposer over the substrate with the perforated interposer having a slot; and forming a package encapsulation over the integrated circuit subassembly system, the perforated interposer, the integrated circuit, and the substrate with the slot filled with the package encapsulation.

摘要翻译： 集成电路封装系统包括：提供衬底; 在衬底上附加集成电路; 将具有穿孔插入器的集成电路子组件系统附接到具有槽的穿孔插入件上; 以及在所述集成电路子组件系统，所述穿孔插入器，集成电路和衬底之间形成封装封装，所述插槽填充有封装封装。

公开(公告)号：US07482203B2

公开(公告)日：2009-01-27

申请号：US12005499

申请日：2007-12-26

申请人： Sungmin Song ,  Choong Bin Yim ,  SeongMin Lee ,  Jaehyun Lim ,  Joungin Yang ,  DongSam Park

发明人： Sungmin Song ,  Choong Bin Yim ,  SeongMin Lee ,  Jaehyun Lim ,  Joungin Yang ,  DongSam Park

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked integrated circuit package-in-package system is provided forming a first device having a first integrated circuit package comprises forming a first substrate with a first integrated circuit thereon, electrically connecting first electrical interconnects between the first integrated circuit and a top side of the first substrate, encapsulating a first top molding compound to cover the first electrical interconnects and a portion of the top side of the first substrate, and encapsulating a first bottom molding compound to cover the first integrated circuit and a bottom side the first substrate, and stacking a second device, having a second integrated circuit package, below the first device with a second top molding compound of the second device providing a space between the first device and the second device, wherein the second device includes the second top molding compound and a second bottom molding compound in a similar manner to the first device.

摘要翻译： 提供了一种堆叠式集成电路封装封装系统，其形成具有第一集成电路封装的第一器件，其包括在其上形成具有第一集成电路的第一衬底，电连接第一集成电路和第一集成电路的顶侧之间的第一电互连 第一基板，封装第一顶部模制化合物以覆盖第一电气互连和第一基板的顶侧的一部分，并且封装第一底部模制化合物以覆盖第一集成电路，底侧覆盖第一基板，并且堆叠 第二装置，具有第二集成电路封装，在第一装置下方具有第二装置的第二顶部模制化合物，其在第一装置和第二装置之间提供空间，其中第二装置包括第二顶部模塑料和第二装置 底部模塑料与第一装置类似。

公开(公告)号：US07312519B2

公开(公告)日：2007-12-25

申请号：US11331564

申请日：2006-01-12

申请人： Sungmin Song ,  Choong Bin Yim ,  Seongmin Lee ,  Jaehyun Lim ,  Joungin Yang ,  Dongsam Park

发明人： Sungmin Song ,  Choong Bin Yim ,  Seongmin Lee ,  Jaehyun Lim ,  Joungin Yang ,  Dongsam Park

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked integrated circuit package-in-package system is provided forming a first device having a first integrated circuit package comprises forming a first substrate with a first integrated circuit thereon, electrically connecting first electrical interconnects between the first integrated circuit and a top side of the first substrate, encapsulating a first top molding compound to cover the first electrical interconnects and a portion of the top side of the first substrate, and encapsulating a first bottom molding compound to cover the first integrated circuit and a bottom side the first substrate, and stacking a second device, having a second integrated circuit package, below the first device with a second top molding compound of the second device providing a space between the first device and the second device, wherein the second device includes the second top molding compound and a second bottom molding compound in a similar manner to the first device.

公开(公告)号：US20070158810A1

公开(公告)日：2007-07-12

申请号：US11331564

申请日：2006-01-12

申请人： Sungmin Song ,  Choong Yim ,  Seongmin Lee ,  Jaehyun Lim ,  Joungin Yang ,  Dongsam Park

发明人： Sungmin Song ,  Choong Yim ,  Seongmin Lee ,  Jaehyun Lim ,  Joungin Yang ,  Dongsam Park

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/0401 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A stacked integrated circuit package-in-package system is provided forming a first device having a first integrated circuit package comprises forming a first substrate with a first integrated circuit thereon, electrically connecting first electrical interconnects between the first integrated circuit and a top side of the first substrate, encapsulating a first top molding compound to cover the first electrical interconnects and a portion of the top side of the first substrate, and encapsulating a first bottom molding compound to cover the first integrated circuit and a bottom side the first substrate, and stacking a second device, having a second integrated circuit package, below the first device with a second top molding compound of the second device providing a space between the first device and the second device, wherein the second device includes the second top molding compound and a second bottom molding compound in a similar manner to the first device.

摘要翻译： 提供了一种堆叠式集成电路封装封装系统，其形成具有第一集成电路封装的第一器件，其包括在其上形成具有第一集成电路的第一衬底，电连接第一集成电路与第一集成电路的顶侧之间的第一电互连 第一基板，封装第一顶部模制化合物以覆盖第一电气互连和第一基板的顶侧的一部分，并且封装第一底部模制化合物以覆盖第一集成电路，底侧覆盖第一基板，并且堆叠 第二装置，具有第二集成电路封装，在第一装置下方具有第二装置的第二顶部模制化合物，其在第一装置和第二装置之间提供空间，其中第二装置包括第二顶部模塑料和第二装置 底部模塑料与第一装置类似。

公开(公告)号：US08772916B2

公开(公告)日：2014-07-08

申请号：US13536382

申请日：2012-06-28

申请人： Ki Youn Jang ,  Sungmin Song ,  JoHyun Bae

发明人： Ki Youn Jang ,  Sungmin Song ,  JoHyun Bae

IPC分类号： H01L23/31

CPC分类号： H01L23/3128 ,  H01L21/565 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15331 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system that includes: a support structure including an electrical contact; a solder mask over the support structure, the solder mask including a solder mask flange, the solder mask flange directly on a support structure first surface; an integrated circuit over the support structure; and encapsulant over the integrated circuit and in contact with the solder mask flange. A mold system that includes a first mold having a projection along a first mold bottom surface, the projection between a first cavity and a recess.

摘要翻译： 一种集成电路封装系统，包括：包括电触点的支撑结构; 在支撑结构上的焊料掩模，焊接掩模包括焊接掩模法兰，焊接掩模法兰直接在支撑结构的第一表面上; 在支撑结构上的集成电路; 以及封装在集成电路上并与焊盘法兰接触。 一种模具系统，其包括具有沿着第一模具底面的突起的第一模具，所述突起在第一腔和凹部之间。

公开(公告)号：US08765525B2

公开(公告)日：2014-07-01

申请号：US13162566

申请日：2011-06-16

申请人： In Sang Yoon ,  DeokKyung Yang ,  Sungmin Song

发明人： In Sang Yoon ,  DeokKyung Yang ,  Sungmin Song

IPC分类号： H01L21/00

CPC分类号： H01L23/481 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5385 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A method of manufacture of an integrated packaging system includes: providing a substrate; mounting an integrated circuit on the substrate; mounting an interposer substrate having an interposer pad on the integrated circuit; covering an encapsulant over the integrated circuit and the interposer substrate; forming a hole through the encapsulant aligned over the interposer pad; and placing a conductive connector on and in direct contact with the interposer pad.

摘要翻译： 一种集成包装系统的制造方法包括：提供基板; 在基板上安装集成电路; 在所述集成电路上安装具有插入器焊盘的插入器基板; 覆盖集成电路和插入器衬底上的密封剂; 通过所述密封剂形成穿过所述插入器衬垫的孔; 并且将导电连接器放置在与插入器垫直接接触的位置。

公开(公告)号：US08130512B2

公开(公告)日：2012-03-06

申请号：US12273541

申请日：2008-11-18

申请人： In Sang Yoon ,  SeongMin Lee ,  Sungmin Song

发明人： In Sang Yoon ,  SeongMin Lee ,  Sungmin Song

IPC分类号： H01R9/00

CPC分类号： H05K1/144 ,  H01L23/3128 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/09709 ,  H05K2201/09972 ,  H05K2201/10734 ,  H05K2203/049 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of manufacturing an integrated circuit package system including: providing a circuit board having an interconnect thereon; mounting a first device offset on the circuit board; and applying a first encapsulant of a first thickness over the first device, the first encapsulant of a second thickness thinner than the first thickness over the remainder of the circuit board with the interconnect exposed, or a second encapsulant of a third thickness over a second device on an opposite surface of the circuit board and differently offset from the first device.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供其上具有互连的电路板; 在电路板上安装第一设备偏移; 以及在所述第一装置上施加第一厚度的第一密封剂，所述第一密封剂的第二厚度比所述电路板的剩余部分薄于所述第一厚度，所述第一厚度在所述第一装置上暴露，或者在第二装置上具有第三厚度的第二密封剂 在电路板的相对表面上，并且与第一器件不同地偏移。