公开(公告)号：US07189658B2

公开(公告)日：2007-03-13

申请号：US11123501

申请日：2005-05-04

申请人： Annamalai Lakshmanan ,  Deenesh Padhi ,  Ganesh Balasubramanian ,  Zhenjiang David Cui ,  Daemian Raj ,  Juan Carlos Rocha-Alvarez ,  Francimar Schmitt ,  Bok Hoen Kim

发明人： Annamalai Lakshmanan ,  Deenesh Padhi ,  Ganesh Balasubramanian ,  Zhenjiang David Cui ,  Daemian Raj ,  Juan Carlos Rocha-Alvarez ,  Francimar Schmitt ,  Bok Hoen Kim

IPC分类号： H01L21/31

CPC分类号： C23C16/029 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02274 ,  H01L21/02304 ,  H01L21/31633 ,  H01L21/76801 ,  H01L21/76829 ,  Y10S438/931

摘要： A method of processing a substrate including depositing a transition layer and a dielectric layer on a substrate in a processing chamber are provided. The transition layer is deposited from a processing gas including an organosilicon compound and an oxidizing gas. The flow rate of the organosilicon compound is ramped up during the deposition of the transition layer such that the transition layer has a carbon concentration gradient and an oxygen concentration gradient. The transition layer improves the adhesion of the dielectric layer to an underlying barrier layer on the substrate.

摘要翻译： 提供了一种处理衬底的方法，包括在处理室中的衬底上沉积过渡层和电介质层。 过渡层由包括有机硅化合物和氧化气体的处理气体沉积。 在沉积过渡层期间，有机硅化合物的流速升高，使得过渡层具有碳浓度梯度和氧浓度梯度。 过渡层改善了介电层对基底上的下层阻挡层的粘合性。

公开(公告)号：US07259111B2

公开(公告)日：2007-08-21

申请号：US11142124

申请日：2005-06-01

申请人： Deenesh Padhi ,  Ganesh Balasubramanian ,  Annamalai Lakshmanan ,  Zhenjiang Cui ,  Juan Carlos Rocha-Alvarez ,  Bok Hoen Kim ,  Hichem M'Saad ,  Steven Reiter ,  Francimar Schmitt

发明人： Deenesh Padhi ,  Ganesh Balasubramanian ,  Annamalai Lakshmanan ,  Zhenjiang Cui ,  Juan Carlos Rocha-Alvarez ,  Bok Hoen Kim ,  Hichem M'Saad ,  Steven Reiter ,  Francimar Schmitt

IPC分类号： H01L21/469

CPC分类号： H01L21/31633 ,  C23C16/029 ,  C23C16/401 ,  C23C16/45523 ,  C23C16/5096 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02274

摘要： A method of depositing a organosilicate dielectric layer exhibiting high adhesion strength to an underlying substrate disposed within a single processing chamber without plasma arcing. The method includes positioning a substrate within a processing chamber having a powered electrode, flowing an interface gas mixture into the processing chamber, the interface gas mixture comprising one or more organosilicon compounds and one or more oxidizing gases, depositing a silicon oxide layer on the substrate by varying process conditions, wherein DC bias of the powered electrode varies less than 60 volts.

摘要翻译： 一种在没有等离子体放电的情况下将布置在单个处理室内的下面的衬底上沉积显示出高粘合强度的有机硅酸盐介电层的方法。 该方法包括将衬底定位在具有动力电极的处理室内，将界面气体混合物流入处理室，界面气体混合物包含一种或多种有机硅化合物和一种或多种氧化性气体，在衬底上沉积氧化硅层 通过改变工艺条件，其中电源电极的DC偏压变化小于60伏特。

公开(公告)号：US07572337B2

公开(公告)日：2009-08-11

申请号：US11131010

申请日：2005-05-16

申请人： Juan Carlos Rocha-Alvarez ,  Ganesh Balasubramanian ,  Tom K. Cho ,  Deenesh Padhi ,  Thomas Nowak ,  Bok Hoen Kim ,  Hichem M'Saad ,  Daemian Raj

发明人： Juan Carlos Rocha-Alvarez ,  Ganesh Balasubramanian ,  Tom K. Cho ,  Deenesh Padhi ,  Thomas Nowak ,  Bok Hoen Kim ,  Hichem M'Saad ,  Daemian Raj

IPC分类号： C23C16/455 ,  C23F1/00 ,  H01L21/306 ,  C23C16/06 ,  C23C16/22

CPC分类号： C23C16/45574 ,  C23C16/4405 ,  C23C16/45565 ,  H01J37/3244 ,  H01J37/32449

摘要： Apparatus and methods for distributing gases into a processing chamber are disclosed. In one embodiment, the apparatus includes a gas distribution plate having a plurality of apertures disposed therethrough and a blocker plate having both a plurality of apertures disposed therethrough and a plurality of feed through passageways disposed therein. A first gas pathway delivers a first gas through the plurality of apertures in the blocker plate and the gas distribution plate. A bypass gas pathway delivers a second gas through the plurality of feed through passageways in the blocker plate and to areas around the blocker plate prior to the second gas passing through the gas distribution plate.

摘要翻译： 公开了将气体分配到处理室中的装置和方法。 在一个实施例中，该装置包括一个气体分配板，该气体分配板具有穿过其中的多个孔，以及一个阻挡板，其具有设置在其间的多个孔和设置在其中的多个进给通道。 第一气体通道通过阻挡板和气体分配板中的多个孔传送第一气体。 旁路气体通道在第二气体通过气体分配板之前，通过多个进料通过阻挡板中的通道和阻塞板周围的区域输送第二气体。

公开(公告)号：US20060252273A1

公开(公告)日：2006-11-09

申请号：US11123501

申请日：2005-05-04

申请人： Annamalai Lakshmanan ,  Deenesh Padhi ,  Ganesh Balasubramanian ,  Zhenjiang Cui ,  Daemian Raj ,  Juan Rocha-Alvarez ,  Francimar Schmitt ,  Bok Kim

发明人： Annamalai Lakshmanan ,  Deenesh Padhi ,  Ganesh Balasubramanian ,  Zhenjiang Cui ,  Daemian Raj ,  Juan Rocha-Alvarez ,  Francimar Schmitt ,  Bok Kim

IPC分类号： H01L21/31 ,  H01L21/469

CPC分类号： C23C16/029 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02274 ,  H01L21/02304 ,  H01L21/31633 ,  H01L21/76801 ,  H01L21/76829 ,  Y10S438/931

摘要： A method of processing a substrate including depositing a transition layer and a dielectric layer on a substrate in a processing chamber are provided. The transition layer is deposited from a processing gas including an organosilicon compound and an oxidizing gas. The flow rate of the organosilicon compound is ramped up during the deposition of the transition layer such that the transition layer has a carbon concentration gradient and an oxygen concentration gradient. The transition layer improves the adhesion of the dielectric layer to an underlying barrier layer on the substrate.

摘要翻译： 提供了一种处理衬底的方法，包括在处理室中的衬底上沉积过渡层和电介质层。 过渡层由包括有机硅化合物和氧化气体的处理气体沉积。 在沉积过渡层期间，有机硅化合物的流速升高，使得过渡层具有碳浓度梯度和氧浓度梯度。 过渡层改善了介电层对基底上的下层阻挡层的粘合性。

公开(公告)号：US20060160376A1

公开(公告)日：2006-07-20

申请号：US11142124

申请日：2005-06-01

申请人： Deenesh Padhi ,  Ganesh Balasubramanian ,  Annamalai Lakshmanan ,  Zhenjiang Cui ,  Juan Rocha-Alvarez ,  Bok Kim ,  Hichem M'Saad ,  Steven Reiter ,  Francimar Schmitt

发明人： Deenesh Padhi ,  Ganesh Balasubramanian ,  Annamalai Lakshmanan ,  Zhenjiang Cui ,  Juan Rocha-Alvarez ,  Bok Kim ,  Hichem M'Saad ,  Steven Reiter ,  Francimar Schmitt

IPC分类号： H01L21/31

CPC分类号： H01L21/31633 ,  C23C16/029 ,  C23C16/401 ,  C23C16/45523 ,  C23C16/5096 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02274

摘要： A method of depositing a organosilicate dielectric layer exhibiting high adhesion strength to an underlying substrate disposed within a single processing chamber without plasma arcing. The method includes positioning a substrate within a processing chamber having a powered electrode, flowing an interface gas mixture into the processing chamber, the interface gas mixture comprising one or more organosilicon compounds and one or more oxidizing gases, depositing a silicon oxide layer on the substrate by varying process conditions, wherein DC bias of the powered electrode varies less than 60 volts.

摘要翻译： 一种在没有等离子体放电的情况下将布置在单个处理室内的下面的衬底上沉积显示出高粘合强度的有机硅酸盐介电层的方法。 该方法包括将衬底定位在具有动力电极的处理室内，将界面气体混合物流入处理室，界面气体混合物包含一种或多种有机硅化合物和一种或多种氧化性气体，在衬底上沉积氧化硅层 通过改变工艺条件，其中电源电极的DC偏压变化小于60伏特。

公开(公告)号：US08679987B2

公开(公告)日：2014-03-25

申请号：US13468776

申请日：2012-05-10

申请人： Patrick Reilly ,  Shahid Shaikh ,  Tersem Summan ,  Deenesh Padhi ,  Sanjeev Baluja ,  Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Bok Hoen Kim ,  Derek R. Witty

发明人： Patrick Reilly ,  Shahid Shaikh ,  Tersem Summan ,  Deenesh Padhi ,  Sanjeev Baluja ,  Juan Carlos Rocha-Alvarez ,  Thomas Nowak ,  Bok Hoen Kim ,  Derek R. Witty

IPC分类号： H01L21/47 ,  H01L21/312

CPC分类号： H01L21/02527 ,  C23C16/26 ,  C23C16/56 ,  H01L21/02115 ,  H01L21/02274 ,  H01L21/02348 ,  H01L21/02592 ,  H01L21/0262 ,  H01L21/31144

摘要： Embodiments described herein relate to a method for processing a substrate. In one embodiment, the method includes introducing a gas mixture comprising a hydrocarbon source and a diluent gas into a deposition chamber located within a processing system, generating a plasma from the gas mixture in the deposition chamber at a temperature between about 200° C. and about 700° C. to form a low-hydrogen content amorphous carbon layer on the substrate, transferring the substrate into a curing chamber located within the processing system without breaking vacuum, and exposing the substrate to UV radiation within the curing chamber at a curing temperature above about 200° C.

摘要翻译： 本文所述的实施例涉及一种用于处理衬底的方法。 在一个实施方案中，该方法包括将包含烃源和稀释气体的气体混合物引入位于处理系统内的沉积室中，在沉积室中从约200℃至约200℃的温度和 约700℃以在基底上形成低氢含量的无定形碳层，将基底转移到位于处理系统内的固化室中，而不破坏真空，并在固化温度下将基底暴露于固化室内的UV辐射 高于约200℃

公开(公告)号：US08778813B2

公开(公告)日：2014-07-15

申请号：US13102846

申请日：2011-05-06

申请人： Ramprakash Sankarakrishnan ,  Ganesh Balasubramanian ,  Juan Carlos Rocha-Alvarez ,  Dale R. Du Bois ,  Mark Fodor ,  Jianhua Zhou ,  Amit Bansal ,  Mohamad A. Ayoub ,  Shahid Shaikh ,  Patrick Reilly ,  Deenesh Padhi ,  Thomas Nowak

发明人： Ramprakash Sankarakrishnan ,  Ganesh Balasubramanian ,  Juan Carlos Rocha-Alvarez ,  Dale R. Du Bois ,  Mark Fodor ,  Jianhua Zhou ,  Amit Bansal ,  Mohamad A. Ayoub ,  Shahid Shaikh ,  Patrick Reilly ,  Deenesh Padhi ,  Thomas Nowak

IPC分类号： H01L21/31 ,  H01L21/469 ,  H01L21/00 ,  H01J37/32 ,  C23C16/46 ,  C23C16/509 ,  H01L21/67 ,  H01L21/30 ,  H01L21/42 ,  C23C16/00 ,  B05C11/11

CPC分类号： H01L21/6719 ,  C23C16/46 ,  C23C16/5096 ,  H01J37/32495 ,  H01J37/32568 ,  H01J37/32651 ,  H01J37/32715

摘要： An apparatus for plasma processing a substrate is provided. The apparatus comprises a processing chamber, a substrate support disposed in the processing chamber, a shield member disposed in the processing chamber below the substrate support, and a lid assembly coupled to the processing chamber. The lid assembly comprises a conductive gas distributor coupled to a power source, and an electrode separated from the conductive gas distributor and the chamber body by electrical insulators. The electrode is also coupled to a source of electric power. The substrate support is formed with a stiffness that permits very little departure from parallelism. The shield member thermally shields a substrate transfer opening in the lower portion of the chamber body. A pumping plenum is located below the substrate support processing position, and is spaced apart therefrom.

摘要翻译： 提供了一种用于等离子体处理衬底的装置。 该设备包括处理室，设置在处理室中的衬底支撑件，设置在衬底支撑件下方的处理室中的屏蔽构件以及耦合到处理室的盖组件。 盖组件包括耦合到电源的导电气体分配器和通过电绝缘体与导电气体分配器和室主体分离的电极。 电极也耦合到电源。 衬底支撑件形成有允许很少偏离平行度的刚度。 屏蔽构件对室主体的下部的基板传送开口进行热屏蔽。 泵送气室位于基板支撑处理位置下方并与其间隔开。

公开(公告)号：US20110294303A1

公开(公告)日：2011-12-01

申请号：US13102846

申请日：2011-05-06

申请人： Ramprakash Sankarakrishnan ,  Ganesh Balasubramanian ,  Juan Carlos Rocha-Alvarez ,  Dale R. Du Bois ,  Mark Fodor ,  Jianhua Zhou ,  Amit Bansal ,  Mohamad A. Ayoub ,  Shahid Shaikh ,  Patrick Reilly ,  Deenesh Padhi ,  Thomas Nowak

发明人： Ramprakash Sankarakrishnan ,  Ganesh Balasubramanian ,  Juan Carlos Rocha-Alvarez ,  Dale R. Du Bois ,  Mark Fodor ,  Jianhua Zhou ,  Amit Bansal ,  Mohamad A. Ayoub ,  Shahid Shaikh ,  Patrick Reilly ,  Deenesh Padhi ,  Thomas Nowak

IPC分类号： C23C16/44 ,  H01L21/30 ,  C23C16/509

CPC分类号： H01L21/6719 ,  C23C16/46 ,  C23C16/5096 ,  H01J37/32495 ,  H01J37/32568 ,  H01J37/32651 ,  H01J37/32715

摘要： An apparatus for plasma processing a substrate is provided. The apparatus comprises a processing chamber, a substrate support disposed in the processing chamber, a shield member disposed in the processing chamber below the substrate support, and a lid assembly coupled to the processing chamber. The lid assembly comprises a conductive gas distributor coupled to a power source, and an electrode separated from the conductive gas distributor and the chamber body by electrical insulators. The electrode is also coupled to a source of electric power. The substrate support is formed with a stiffness that permits very little departure from parallelism. The shield member thermally shields a substrate transfer opening in the lower portion of the chamber body. A pumping plenum is located below the substrate support processing position, and is spaced apart therefrom.

摘要翻译： 提供了一种用于等离子体处理衬底的装置。 该设备包括处理室，设置在处理室中的衬底支撑件，设置在衬底支撑件下方的处理室中的屏蔽构件以及耦合到处理室的盖组件。 盖组件包括耦合到电源的导电气体分配器和通过电绝缘体与导电气体分配器和室主体分离的电极。 电极也耦合到电源。 衬底支撑件形成有允许很少偏离平行度的刚度。 屏蔽构件对室主体的下部的基板传送开口进行热屏蔽。 泵送气室位于基板支撑处理位置下方并与其间隔开。

公开(公告)号：US07802538B2

公开(公告)日：2010-09-28

申请号：US11608333

申请日：2006-12-08

申请人： Deenesh Padhi ,  Sohyun Park ,  Ganesh Balasubramanian ,  Juan Carlos Rocha-Alvarez ,  Li-Qun Xia ,  Derek R. Witty ,  Hichem M'Saad

发明人： Deenesh Padhi ,  Sohyun Park ,  Ganesh Balasubramanian ,  Juan Carlos Rocha-Alvarez ,  Li-Qun Xia ,  Derek R. Witty ,  Hichem M'Saad

IPC分类号： C23C16/00 ,  C23C16/30 ,  C23C16/455 ,  C23C16/52

CPC分类号： H01L21/31633 ,  C23C16/029 ,  C23C16/401 ,  C23C16/45523 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02274 ,  H01L21/02304 ,  H01L21/76841

摘要： A method of forming a graded dielectric layer on an underlying layer including flowing a mixture of a silicon-carbon containing gas, an oxygen containing gas and a carrier gas through a showerhead comprising a blocking plate and a faceplate to form an oxide rich portion of the graded dielectric layer, where the silicon-carbon containing gas has an initial flow rate, flowing the silicon-carbon containing gas at a first intermediate flow rate for about 0.5 seconds or longer, where the first intermediate flow rate is higher than the initial flow rate, and flowing the silicon-carbon containing gas at a fastest flow rate higher than the first intermediate flow rate to form a carbon rich portion of the graded dielectric layer.

摘要翻译： 一种在下层上形成渐变电介质层的方法，包括使含硅碳的气体，含氧气体和载体气体的混合物流过包括阻挡板和面板的喷头，以形成氧化物富集部分 其中含硅碳的气体具有初始流速，使含硅碳的气体以第一中间流速流动约0.5秒或更长，其中第一中间流速高于初始流速 并且使含硅碳的气体以比第一中间流速高的最快流速流动，以形成渐变电介质层的富碳部分。

公开(公告)号：US07166544B2

公开(公告)日：2007-01-23

申请号：US10931609

申请日：2004-09-01

申请人： Deenesh Padhi ,  Sohyun Park ,  Ganesh Balasubramanian ,  Juan Carlos Rocha-Alvarez ,  Li-Qun Xia ,  Derek R. Witty ,  Hichem M'Saad

发明人： Deenesh Padhi ,  Sohyun Park ,  Ganesh Balasubramanian ,  Juan Carlos Rocha-Alvarez ,  Li-Qun Xia ,  Derek R. Witty ,  Hichem M'Saad

IPC分类号： H01L21/31

CPC分类号： H01L21/31633 ,  C23C16/029 ,  C23C16/401 ,  C23C16/45523 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02274 ,  H01L21/02304 ,  H01L21/76841

摘要： A method of forming a graded dielectric layer on an underlying layer including flowing a mixture of a silicon-carbon containing gas, an oxygen containing gas and a carrier gas through a showerhead comprising a blocking plate and a faceplate to form an oxide rich portion of the graded dielectric layer, where the silicon-carbon containing gas has an initial flow rate, flowing the silicon-carbon containing gas at a first intermediate flow rate for about 0.5 seconds or longer, where the first intermediate flow rate is higher than the initial flow rate, and flowing the silicon-carbon containing gas at a fastest flow rate higher than the first intermediate flow rate to form a carbon rich portion of the graded dielectric layer.

摘要翻译： 一种在下层上形成渐变电介质层的方法，包括使含硅碳的气体，含氧气体和载体气体的混合物流过包括阻挡板和面板的喷头，以形成氧化物富集部分 其中含硅碳的气体具有初始流速，使含硅碳的气体以第一中间流速流动约0.5秒或更长，其中第一中间流速高于初始流速 并且使含硅碳的气体以比第一中间流速高的最快流速流动，以形成渐变电介质层的富碳部分。