公开(公告)号：US10704142B2

公开(公告)日：2020-07-07

申请号：US15661441

申请日：2017-07-27

Applicant: APPLIED MATERIALS, INC.

Inventor： Muhannad Mustafa ,  Muhammad M. Rasheed ,  Mario Dan Sanchez ,  Yu Chang ,  William Kuang ,  Vinod Konda Purathe ,  Manjunatha Koppa

IPC: C23C16/455 ,  G01K7/16 ,  C23C16/46 ,  G01K13/08 ,  G01K1/14 ,  C23C16/458

Abstract: Embodiments of the present disclosure are directed to a quick disconnect resistance temperature detector (RTD) heater assembly, that includes a first assembly comprising a pedestal, a pedestal shaft, an adapter, one or more heater power supply terminals, and at least one RTD, and a second assembly comprising a rotating module having a central opening, and a cable assembly partially disposed in the central opening and securely fastened to the rotating module, wherein the first assembly is removably coupled to the second assembly, wherein the cable assembly includes one or more power supply sockets that receive the heater power supply terminals when the first and second assemblies are coupled together, and wherein the cable assembly includes one or more spring loaded RTD pins that contact the at least one RTD disposed in the first assembly when the first and second assemblies are coupled together.

公开(公告)号：US09984911B2

公开(公告)日：2018-05-29

申请号：US14962446

申请日：2015-12-08

Applicant: APPLIED MATERIALS, INC.

Inventor： Ryan Hanson ,  Manjunatha Koppa ,  Vijay D. Parkhe ,  John C. Forster ,  Keith A. Miller

IPC: H02N13/00 ,  H01L21/683

CPC classification number: H01L21/6833 ,  H02N13/00

Abstract: An electrostatic chuck includes a puck having a support surface to support a substrate when disposed thereon and an opposing second surface, wherein one or more chucking electrodes are embedded in the puck, a body having a support surface coupled to the second surface of the puck to support the puck, a DC voltage sensing circuit disposed on support surface of the puck, and an inductor disposed in the body and proximate the support surface of the body, wherein the inductor is electrically coupled to DC voltage sensing circuit, and wherein the inductor is configured to filter high frequency current flow in order to accurately measure DC potential on the substrate.

公开(公告)号：US12016092B2

公开(公告)日：2024-06-18

申请号：US17106735

申请日：2020-11-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Pingyan Lei ,  Dien-Yeh Wu ,  Jallepally Ravi ,  Manjunatha Koppa ,  Ambarish Toorihal ,  Sandesh Yadamane ,  Vinod Konda Purathe ,  Xiaoxiong Yuan

IPC: H05B3/48 ,  C23C14/54 ,  C23C16/455 ,  C23C16/458 ,  H05B3/14

CPC classification number: H05B3/48 ,  C23C14/541 ,  C23C16/45565 ,  C23C16/4586 ,  H05B3/141

Abstract: Embodiments of a lid heater for a deposition chamber are provided herein. In some embodiments, a lid heater for a deposition chamber includes a ceramic heater body having a first side opposite a second side, wherein the ceramic heater body includes a first plurality of gas channels extending from one or more first gas inlets on the first side, wherein each of the one or more first gas inlets extend to a plurality of first gas outlets on the second side; a heating element embedded in the ceramic heater body; and an RF electrode embedded in the ceramic heater body proximate the second side, wherein the first plurality of gas channels extend through the RF electrode.

公开(公告)号：US10373860B2

公开(公告)日：2019-08-06

申请号：US14788127

申请日：2015-06-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Mukund Sundararajan ,  Ananthkrishna Jupudi ,  Manjunatha Koppa ,  Saket Rathi

IPC: F26B3/30 ,  F26B13/10 ,  H01L21/687

Abstract: Embodiments of batch processing apparatus and collapsible substrate support are provided herein. In some embodiments, a collapsible substrate support includes a base linearly moveable between a first position and a second position; and a first plurality of substrate support elements coupled to the base and including a lowermost substrate support element disposed in a fixed position with respect to the base and an uppermost substrate support element disposed above the lowermost substrate support element, wherein the uppermost substrate support element is linearly movable between a first position nearer to the lowermost substrate support element and a second position further from the lowermost substrate support element.

公开(公告)号：US09613846B2

公开(公告)日：2017-04-04

申请号：US14550106

申请日：2014-11-21

Applicant: Applied Materials, Inc.

Inventor： Govinda Raj ,  Cheng-Hsiung Tsai ,  Robert T. Hirahara ,  Kadthala R. Narendrnath ,  Manjunatha Koppa ,  Ross Marshall

IPC: H02H7/30 ,  H01L21/687 ,  H01L21/683

CPC classification number: H01L21/6875 ,  H01L21/6831 ,  Y10T428/24298 ,  Y10T428/24314

Abstract: Embodiments are directed to an electrostatic chuck surface having minimum contact area features. More particularly, embodiments of the present invention provide an electrostatic chuck assembly having a pattern of raised, elongated surface features for providing reduced particle generation and reduced wear of substrates and chucking devices.

公开(公告)号：US20250029816A1

公开(公告)日：2025-01-23

申请号：US18773859

申请日：2024-07-16

Applicant: Applied Materials, Inc.

Inventor： Douglas Long ,  Vinod Kumar Konda Purathe ,  Dien-Yeh Wu ,  Jallepally Ravi ,  Hideaki Goto ,  Manjunatha Koppa ,  Hiroyuki Takahama ,  Shih Yao Hsu ,  Sandesh Yadamane Dharmaiah

IPC: H01J37/32 ,  C23C16/455

Abstract: Gas distribution assemblies for a semiconductor manufacturing processing chamber comprising a first showerhead with a first flange and a second showerhead with a second flange. A first two-piece RF isolator comprises a first inner RF isolator spaced from a first outer RF isolator. The first inner RF isolator spaced from the first flange of the first showerhead to create a first flow path. A second two-piece RF isolator comprises a second inner RF isolator spaced from a second outer RF isolator. The second RF isolator spaced from the second flange of the second showerhead to create a second flow path. Processing chambers incorporating the gas distribution assemblies, and processing methods using the gas distribution assemblies are also described.

公开(公告)号：USD997893S1

公开(公告)日：2023-09-05

申请号：US29809529

申请日：2021-09-28

Applicant: Applied Materials, Inc.

Designer： Zubin Huang ,  Srinivas Tokur Mohana ,  Shreyas Patil Shanthaveeraswamy ,  Sandesh Yadamane ,  Jallepally Ravi ,  Harpreet Singh ,  Manjunatha Koppa

Abstract: FIG. 1 is a back isometric top left-side view of a shadow ring lift.
FIG. 2 is a back isometric bottom left-side view thereof.
FIG. 3 is a top plan view thereof.
FIG. 4 is a bottom plan view thereof.
FIG. 5 is a back-side view thereof.
FIG. 6 is a front-side view thereof.
FIG. 7 is a left-side view thereof; and,
FIG. 8 is a right-side view thereof.
The broken lines in the drawings illustrate portions of the shadow ring lift plate that form no part of the claimed design.

公开(公告)号：US11555244B2

公开(公告)日：2023-01-17

申请号：US17078664

申请日：2020-10-23

Applicant: APPLIED MATERIALS, INC.

Inventor： Pingyan Lei ,  Dien-Yeh Wu ,  Jallepally Ravi ,  Takashi Kuratomi ,  Xiaoxiong Yuan ,  Manjunatha Koppa ,  Vinod Konda Purathe

IPC: C23C16/40 ,  C23C16/455

Abstract: Embodiments of showerheads are provided herein. In some embodiments, a showerhead for use in a process chamber includes a gas distribution plate having an upper surface and a lower surface; a plurality of channels extending through the gas distribution plate substantially perpendicular to the lower surface; a plurality of first gas delivery holes extending from the upper surface to the lower surface between adjacent channels of the plurality of channels to deliver a first process gas through the gas distribution plate; and a plurality of second gas delivery holes extending from the plurality of channels to the lower surface to deliver a second process gas therethrough without mixing with the first process gas.

公开(公告)号：US20180197760A1

公开(公告)日：2018-07-12

申请号：US15863295

申请日：2018-01-05

Applicant: Applied Materials, Inc.

Inventor： Deepak Jadhav ,  Jallepally Ravi ,  Manjunatha Koppa ,  Vinod Konda Purathe ,  Sandesh Yadamane

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/677 ,  H01L21/687

CPC classification number: H01L21/67167 ,  H01J37/32357 ,  H01J37/32449 ,  H01J37/32743 ,  H01J37/32788 ,  H01J37/32816 ,  H01J37/32834 ,  H01J37/32862 ,  H01J37/32889 ,  H01J37/32899 ,  H01L21/67017 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/68707

Abstract: Processing platforms comprising a central transfer station having at least one robot and a dual chamber processing chamber connected to a side of the central transfer station through a gate valve are described. The dual chamber processing chamber comprises a first processing volume and a second processing volume connected to a shared vacuum pump.

公开(公告)号：US09888528B2

公开(公告)日：2018-02-06

申请号：US14634711

申请日：2015-02-27

Applicant: APPLIED MATERIALS, INC.

Inventor： Tomoharu Matsushita ,  Jallepally Ravi ,  Cheng-Hsiung Tsai ,  Aravind Kamath ,  Xiaoxiong Yuan ,  Manjunatha Koppa

IPC: H05B3/26 ,  H01L21/67

CPC classification number: H05B3/26 ,  H01L21/67103 ,  H05B2203/037

Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a body having a support surface; and a first heater disposed within the body and having a first heating coil and multiple heating zones, wherein a pitch of windings of the first heating coil vary among each of the multiple heating zones to define a predetermined heating ratio between the multiple heating zones.