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公开(公告)号：US20080296716A1
公开(公告)日：2008-12-04
申请号：US12151570
申请日：2008-05-07
CPC分类号： H01L21/56 , H01L23/3114 , H01L27/14618 , H01L27/14683 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01079 , H01L2924/15311 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A sensor semiconductor device and a manufacturing method thereof are disclosed. The method includes: providing a light-permeable carrier board with a plurality of metallic circuits; electrically connecting the metallic circuits to a plurality of sensor chips through conductive bumps formed on the bond pads of the sensor chips, wherein the sensor chips have been previously subjected to thinning and chip probing; filling a first dielectric layer between the sensor chips to cover the metallic circuits and peripheries of the sensor chips; forming a second dielectric layer on the sensor chips and the first dielectric layer; forming grooves between the sensor chips for exposing the metallic circuits such that a plurality of conductive traces electrically connected to the metallic circuits can be formed on the second dielectric layer; and singulating the sensor chips to form a plurality of sensor semiconductor devices. The present invention overcomes the drawbacks of breakage of trace connection due to a sharp angle formed at joints, poor electrical connection and chip damage due to an alignment error in cutting from the back of the wafer, as well as an increased cost due to multiple sputtering processes for forming traces.
摘要翻译： 公开了一种传感器半导体器件及其制造方法。 该方法包括：提供具有多个金属电路的透光性载板; 通过形成在传感器芯片的接合焊盘上的导电凸块将金属电路电连接到多个传感器芯片，其中传感器芯片已经预先经受了薄化和芯片探测; 在传感器芯片之间填充第一电介质层以覆盖金属电路和传感器芯片的周边; 在所述传感器芯片和所述第一介电层上形成第二电介质层; 在所述传感器芯片之间形成用于暴露所述金属电路的槽，使得可以在所述第二介电层上形成电连接到所述金属电路的多个导电迹线; 并且分离传感器芯片以形成多个传感器半导体器件。 本发明克服了由于在接头处形成的尖角导致的迹线连接断裂的缺点，由于从晶片背面的切割中的对准误差导致的不良电连接和芯片损坏以及由于多次溅射而导致的成本增加 形成痕迹的过程。
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公开(公告)号：US20090057799A1
公开(公告)日：2009-03-05
申请号：US12229651
申请日：2008-08-26
CPC分类号： H01L31/0203 , H01L31/02164 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： A sensor semiconductor device and a method for fabricating the same are provided. At least one sensor chip is mounted and electrically connected to a lead frame. A first and a second encapsulation molding processes are sequentially performed to form a transparent encapsulant for encapsulating the sensor chip and a part of the lead frame and to form a light-impervious encapsulant for encapsulating the transparent encapsulant. The transparent encapsulant has a light-pervious portion formed at a position corresponding to and above a sensor zone of the sensor chip. The light-pervious portion is exposed from the light-impervious encapsulant. Light may penetrate the light-pervious portion, without using an additional cover board, thereby reducing manufacturing steps and costs. The above arrangement avoids prior-art problems of poor reliability caused by a porous encapsulant and poor signal reception caused by interference of ambient light entering into a conventional chip only encapsulated by a transparent encapsulant.
摘要翻译： 提供一种传感器半导体器件及其制造方法。 至少一个传感器芯片被安装并电连接到引线框架。 依次执行第一和第二封装成型工艺以形成用于封装传感器芯片和引线框架的一部分的透明密封剂，并形成用于封装透明密封剂的不透光密封剂。 透明密封剂具有形成在对应于传感器芯片的传感器区域上方的位置处的透光部分。 透光部分从不透光的密封剂暴露出来。 光可以穿透透光部分，而不使用附加的盖板，从而减少制造步骤和成本。 上述布置避免了由多孔密封剂引起的可靠性差的现有技术问题，以及由仅通过透明密封剂封装的传统芯片的环境光的干扰引起的差信号接收。
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公开(公告)号：US20080303111A1
公开(公告)日：2008-12-11
申请号：US12156901
申请日：2008-06-05
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L31/0203 , H01L23/24 , H01L31/18 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The invention discloses a sensor package and a method for fabricating the same. The sensor package includes: a substrate with an opening; a sensor chip disposed in the opening and electrically connected to the substrate; an encapsulant filling spacing between the sensor chip and the opening so as to secure the sensor chip to the substrate; and a transparent cover attached to the substrate via an adhesive layer, wherein the adhesive layer covers the sensor chip and bonding wires and is formed with an opening for exposing sensor region of the sensor chip. Securing the sensor chip in the opening of the substrate reduces the height of the sensor package, and meanwhile the process cost is reduced by eliminating the need of formation of conductive bumps on the sensor chip or the transparent cover and eliminating the need of specially designed substrate.
摘要翻译： 本发明公开了一种传感器封装及其制造方法。 传感器封装包括：具有开口的基板; 传感器芯片，其布置在所述开口中并电连接到所述基板; 传感器芯片和开口之间的密封剂填充间隔，以将传感器芯片固定到基板上; 以及通过粘合剂层附着到基板的透明盖，其中粘合剂层覆盖传感器芯片和接合线，并且形成有用于暴露传感器芯片的传感器区域的开口。 将传感器芯片固定在基板的开口中，降低传感器封装的高度，同时通过消除在传感器芯片或透明盖上形成导电凸块的需要降低工艺成本，并且不需要特别设计的基板 。
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公开(公告)号：US20080197438A1
公开(公告)日：2008-08-21
申请号：US12070003
申请日：2008-02-14
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L31/0203 , H01L21/78 , H01L27/14618 , H01L27/14687 , H01L2224/94
摘要： This invention discloses a sensor semiconductor device and a manufacturing method thereof, including: providing a wafer having a plurality of sensor chips, forming a plurality of grooves between bond pads on active surfaces of the adjacent sensor chips; forming conductive traces in the grooves for electrically connecting the bond pads; mounting a transparent medium on the wafer for covering sensing areas of the sensor chips; thinning the sensor chips from the non-active surfaces down to the grooves, thereby exposing the conductive traces; cutting the wafer to separate the sensor chips; mounting the sensor chips on a substrate module having a plurality of substrates, electrically connecting the conductive traces to the substrates; providing an insulation material on the substrate module and between the sensor chips so as to encapsulate the sensor chips but expose the transparent medium; and cutting the substrate module to separate a plurality of resultant sensor semiconductor devices.
摘要翻译： 本发明公开了一种传感器半导体器件及其制造方法，包括：提供具有多个传感器芯片的晶片，在相邻传感器芯片的有源表面上的接合焊盘之间形成多个沟槽; 在沟槽中形成导电迹线以电连接接合焊盘; 在所述晶片上安装透明介质以覆盖所述传感器芯片的感测区域; 将传感器芯片从非活性表面减薄到凹槽，从而暴露导电迹线; 切割晶片以分离传感器芯片; 将传感器芯片安装在具有多个基板的基板模块上，将导电迹线电连接到基板; 在衬底模块上和传感器芯片之间提供绝缘材料，以封装传感器芯片，但暴露透明介质; 以及切割所述基板模块以分离多个所得传感器半导体器件。
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公开(公告)号：US20080079105A1
公开(公告)日：2008-04-03
申请号：US11904648
申请日：2007-09-27
IPC分类号： H01L31/0203 , H01L21/02
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , H01L2924/16195 , H01L2224/85 , H01L2924/00014
摘要： A sensor-type package and a fabrication method thereof are provided. A sensor-type chip is mounted on a substrate and is electrically connected to the substrate via bonding wires. A light-pervious body is attached to the sensor-type chip, and has one surface covered with a covering layer and another surface formed with an adhesive layer. An encapsulant encapsulates the light-pervious body. As an adhesive force between the covering layer and the encapsulant is greater than that between the covering layer and the light-pervious body, the covering layer and a portion of the encapsulant located on the covering layer can be concurrently removed, such that the light-pervious body is exposed and light can pass through the light-pervious body to be captured by the sensor-type chip. The above arrangement eliminates the need of using a dam structure as in the prior art and provides a compact sensor-type package with improved fabrication reliability.
摘要翻译： 提供了传感器型封装及其制造方法。 传感器型芯片安装在基板上，并通过接合线与基板电连接。 透光体附着在传感器型芯片上，其一个表面被覆盖层和形成有粘合剂层的另一表面覆盖。 密封剂封装透光体。 由于覆盖层和密封剂之间的粘合力大于覆盖层和透光体之间的粘合力，所以可以同时去除位于覆盖层上的覆盖层和密封剂的一部分， 透光体被曝光，光可以通过透光体，由传感器型芯片捕获。 上述布置消除了如现有技术中使用坝结构的需要，并且提供了具有改进的制造可靠性的紧凑型传感器型封装。
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公开(公告)号：US20090261476A1
公开(公告)日：2009-10-22
申请号：US12148319
申请日：2008-04-18
IPC分类号： H01L23/482 , H01L21/60
CPC分类号： H01L24/19 , H01L21/6835 , H01L23/3114 , H01L24/24 , H01L24/82 , H01L25/105 , H01L2221/68345 , H01L2224/24226 , H01L2224/82001 , H01L2225/1035 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/15311
摘要： A semiconductor device and a manufacturing method thereof are disclosed. The method includes the steps of providing a carrier board having conductive circuits disposed thereon and a plurality of chips with active surfaces having solder pads disposed thereon, wherein conductive bumps are disposed on the solder pads; mounting chips on the carrier board; filling the spacing between the chips with a dielectric layer and forming openings in the dielectric layer at periphery of each chip to expose the conductive circuits; forming a metal layer in the openings of the dielectric layer and at periphery of the active surface of the chips for electrically connecting the conductive bumps and the conductive circuits; and cutting along the dielectric layer between the chips and removing the carrier board to separate each chip and exposing the conductive circuits from the non-active surface.
摘要翻译： 公开了一种半导体器件及其制造方法。 该方法包括以下步骤：提供具有布置在其上的导电电路的载体板和具有设置在其上的焊料焊盘的有源表面的多个芯片，其中导电凸块设置在焊盘上; 将芯片安装在载板上; 用电介质层填充芯片之间的间隔，并在每个芯片周边的电介质层中形成开口以露出导电电路; 在所述电介质层的开口部和所述芯片的有源面的外围形成金属层，用于电连接所述导电凸块和所述导电电路; 并沿着芯片之间的电介质层切割并去除载体板以分离每个芯片并使导电电路与非活性表面相接触。
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公开(公告)号：US20080237767A1
公开(公告)日：2008-10-02
申请号：US12080002
申请日：2008-03-31
IPC分类号： H01L31/0203 , H01L31/18
CPC分类号： H01L27/14618 , B81C1/00888 , B81C2203/0118 , H01L23/3114 , H01L24/11 , H01L27/14683 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05184 , H01L2224/05548 , H01L2224/05569 , H01L2224/05644 , H01L2224/05655 , H01L2924/14 , H01L2924/00 , H01L2924/00014 , H01L2924/01074 , H01L2924/01023
摘要： A sensor-type semiconductor device and manufacturing method thereof are disclosed. The method includes providing a wafer comprising a plurality of sensor chips; forming concave grooves between the solder pads formed on the active surface of adjacent sensor chips; filling a filling material into the concave grooves and forming first conductive circuits electrically connecting the solder pads of adjacent sensor chips; mounting a light permeable body on the active surface of the wafer and thinning the non-active surface of the wafer to expose the filling material; mounting the wafer on a carrier board with second conductive circuits formed thereon corresponding in position to the filling material; forming first openings by cutting the light permeable body and the wafer to a position at which the second conductive circuits are located; forming metallic layers in the first openings by electroplating, the metallic layers electrically connecting the first and second conductive circuits of adjacent sensor chips; forming second openings by cutting the metallic layers to break the first conductive circuit connections and the second conductive circuit connections of adjacent sensor chips and meanwhile keep the first and second conductive circuits of each sensor chip still electrically connected through the metallic layers; filling a dielectric material into the second openings and removing the carrier board; and separating each of the sensor chips to form a plurality of sensor-type semiconductor devices. The invention overcomes the drawbacks of the prior art such as slanting notches formed on the non-active surface of the wafer, displacement of the notches due to the difficulty in precise alignment, as well as broken joints caused by concentrated stress generated in the slanting notches and exposed circuits.
摘要翻译： 公开了一种传感器型半导体器件及其制造方法。 该方法包括提供包括多个传感器芯片的晶片; 在形成在相邻传感器芯片的有效表面上的焊盘之间形成凹槽; 将填充材料填充到凹槽中并形成电连接相邻传感器芯片的焊盘的第一导电电路; 将透光体安装在晶片的活性表面上并使晶片的非活性表面变薄以暴露填充材料; 将晶片安装在载体板上，其上形成有对应于位于填充材料的第二导电电路; 通过将透光体和晶片切割到第二导电电路所在的位置来形成第一开口; 通过电镀在第一开口中形成金属层，金属层电连接相邻传感器芯片的第一和第二导电电路; 通过切割金属层来形成第二开口，以破坏相邻传感器芯片的第一导电电路连接和第二导电电路连接，同时保持每个传感器芯片的第一和第二导电电路通过金属层电连接; 将电介质材料填充到第二开口中并移除载体板; 并分离每个传感器芯片以形成多个传感器型半导体器件。 本发明克服了现有技术的缺点，例如在晶片的非活性表面上形成的倾斜凹口，由于难以精确对准而导致的凹口位移以及由倾斜凹口产生的集中应力引起的断裂接头 和暴露电路。
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公开(公告)号：US20090102063A1
公开(公告)日：2009-04-23
申请号：US12287936
申请日：2008-10-14
申请人： Chun-Yuan Lee , Chien Ping Huang , Yu-Ting Lai , Cheng-Hsu Hsiao , Chun-Chi Ke
发明人： Chun-Yuan Lee , Chien Ping Huang , Yu-Ting Lai , Cheng-Hsu Hsiao , Chun-Chi Ke
CPC分类号： H01L23/49827 , H01L21/486 , H01L21/6835 , H01L23/3128 , H01L24/16 , H01L24/48 , H01L24/97 , H01L2221/68345 , H01L2224/16237 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： This invention provides a semiconductor package and a method for fabricating the same. The method includes: forming a first resist layer on a metal carrier; forming a plurality of openings penetrating the first resist layer; forming a conductive metal layer in the openings; removing the first resist layer; covering the metal carrier having the conductive metal layer with a dielectric layer; forming blind vias in the dielectric layer to expose a portion of the conductive metal layer; forming conductive circuit on the dielectric layer and conductive posts in the blind vias, such that the conductive circuit is electrically connected to the conductive metal layer via the conductive posts; electrically connecting at least one chip to the conductive circuit; forming an encapsulant for encapsulating the chip and the conductive circuit; and removing the metal carrier, thereby allowing a semiconductor package to be formed without a chip carrier. Given the conductive posts, both the conductive circuit and conductive metal layer are efficiently coupled to the dielectric layer to prevent delamination. Further, downsizing the blind vias facilitates the fabrication process and cuts the fabrication cost.
摘要翻译： 本发明提供一种半导体封装及其制造方法。 该方法包括：在金属载体上形成第一抗蚀剂层; 形成穿过所述第一抗蚀剂层的多个开口; 在所述开口中形成导电金属层; 去除第一抗蚀剂层; 用介电层覆盖具有导电金属层的金属载体; 在介电层中形成盲孔以暴露导电金属层的一部分; 在介电层上形成导电电路和在盲孔中的导电柱，使得导电电路经由导电柱电连接到导电金属层; 将至少一个芯片电连接到所述导电电路; 形成用于封装所述芯片和所述导电电路的密封剂; 并且去除金属载体，从而允许在没有芯片载体的情况下形成半导体封装。 给定导电柱，导电电路和导电金属层都有效地耦合到电介质层以防止分层。 此外，缩小盲孔通孔有助于制造工艺并降低制造成本。
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公开(公告)号：US20080105941A1
公开(公告)日：2008-05-08
申请号：US11982514
申请日：2007-11-02
IPC分类号： H01L31/0203 , H01L21/00
CPC分类号： H01L31/0203 , H01L23/3128 , H01L24/97 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/15311 , H01L2924/16235 , H01L2924/181 , H01L2924/1815 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The invention provides a sensor-type semiconductor package and fabrication method thereof. The fabrication method includes steps of: attaching a sensor chip to a chip carrier; electrically connecting the sensor chip and a chip carrier via a plurality of bonding wires; mounting a light-permeable body to the sensor chip with an adhesive layer as a partition therebetween, wherein the planar size of the light-permeable body is larger than a predefined planar size of the sensor-type semiconductor package to be formed; forming an encapsulant on the chip carrier for encapsulating the sensor chip and the bonding wires with the upper surface of the light-permeable body being exposed from the encapsulant; and cutting through the light-permeable body, the encapsulant and the chip carrier according to the predefined planar size. Accordingly the contacting area between the cut light-permeable body and the cut encapsulant increased and the bonding therebetween is reinforced.
摘要翻译： 本发明提供一种传感器型半导体封装及其制造方法。 该制造方法包括以下步骤：将传感器芯片附接到芯片载体; 经由多根接合线电连接传感器芯片和芯片载体; 将透光体安装到传感器芯片上，其中粘合剂层作为其间的隔板，其中透光体的平面尺寸大于要形成的传感器型半导体封装的预定平面尺寸; 在所述芯片载体上形成密封剂，用于封装所述传感器芯片，并且所述接合线与所述透光体的上表面暴露于所述密封剂; 并根据预定的平面尺寸切穿透光体，密封剂和芯片载体。 因此，切割的透光体和切割的密封剂之间的接触面积增加，并且增强了它们之间的粘结。
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公开(公告)号：US20070164386A1
公开(公告)日：2007-07-19
申请号：US11648045
申请日：2006-12-28
IPC分类号： H01L31/0203 , H01L21/56
CPC分类号： H01L27/14687 , H01L24/97 , H01L27/14618 , H01L2224/48091 , H01L2224/48227 , H01L2224/8592 , H01L2224/97 , H01L2924/01033 , H01L2924/15311 , H01L2924/16195 , H01L2224/85 , H01L2924/00014
摘要： A semiconductor device and the fabrication method thereof are provided. The fabrication method includes providing a substrate module plate having a plurality of substrates; attaching at least one sensor chip to each of the substrates of the substrate module plate; electrically connecting each of the sensor chips to each of the substrates through bonding wires; forming an insulating layer between each sensor chip on the substrate module plate, wherein the height of the insulating layers are not greater than the thickness of the sensor chips so as to prevent flash from the insulating layers from contaminating the sensor chips; forming an adhesive lip on the insulating layer or forming a second insulating layer followed by forming the adhesive layer, wherein the adhesive layer or the second insulating layer is higher than the highest loop-height of the bonding wires; adhering a light transmitting cover to each adhesive layer to cover the sensor chip; and cutting the substrate module plate to separate the substrates to form a plurality of semiconductor devices each integrated with at least one sensor chip. As the adhesive layers are not in contact with the bonding wires, the problems of damaging or breaking the bonding wires can be prevented in the process of adhering the light transmitting cover.
摘要翻译： 提供半导体器件及其制造方法。 该制造方法包括提供具有多个基板的基板模块板; 将至少一个传感器芯片附接到所述基板模块板的每个基板; 通过接合线将每个传感器芯片电连接到每个基板; 在衬底模块板上的每个传感器芯片之间形成绝缘层，其中绝缘层的高度不大于传感器芯片的厚度，以防止来自绝缘层的闪光污染传感器芯片; 在所述绝缘层上形成粘合剂唇缘或形成第二绝缘层，接着形成所述粘合剂层，其中所述粘合剂层或所述第二绝缘层高于所述接合线的最高环高度; 将透光盖粘附到每个粘合剂层以覆盖传感器芯片; 以及切割所述基板模块板以分离所述基板以形成多个半导体器件，每个半导体器件与至少一个传感器芯片集成。 由于粘合层不与接合线接触，所以在粘接透光罩的过程中可以防止损坏或断裂接合线的问题。
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