公开(公告)号：US20050280124A1

公开(公告)日：2005-12-22

申请号：US10871645

申请日：2004-06-18

申请人： Anthony Coyle ,  William Boyd ,  Chris Haga ,  Leland Swanson

发明人： Anthony Coyle ,  William Boyd ,  Chris Haga ,  Leland Swanson

IPC分类号： H01L23/433 ,  H01L23/495

CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device comprising a metallic leadframe (103) with a first surface (103a) and a second surface (103b). The leadframe includes a chip pad (104) and a plurality of segments (107); the chip pad is held by a plurality of straps (105), wherein each strap has a groove (106). A chip (101) is mounted on the chip pad and electrically connected to the segments. A heat spreader (110) is disposed on the first surface of the leadframe; the heat spreader has its central portion (110a) spaced above the chip connections (108), and also has positioning members (110b) extending outwardly from the edges of the central portion so that they rest in the grooves of the straps. Encapsulation material surrounds the chip, the electrical connections, and the spreader positioning members, and fills the space between the spreader and the chip, while leaving the second leadframe surface and the central spreader portion exposed.

摘要翻译： 一种半导体器件，包括具有第一表面（103a）和第二表面（103b）的金属引线框架（103）。 引线框架包括芯片焊盘（104）和多个段（107）; 芯片垫由多个带（105）保持，其中每个带具有凹槽（106）。 芯片（101）安装在芯片焊盘上并电连接到段上。 散热器（110）设置在引线框架的第一表面上; 散热器具有在芯片连接件（108）上方间隔开的中心部分（110a），并且还具有从中心部分的边缘向外延伸的定位构件（110b），使得它们搁置在带的凹槽中。 封装材料围绕芯片，电连接和扩展器定位构件，并且填充扩展器和芯片之间的空间，同时使第二引线框表面和中心扩展器部分露出。

公开(公告)号：US20070090533A1

公开(公告)日：2007-04-26

申请号：US11257252

申请日：2005-10-24

申请人： Chris Haga ,  Anthony Coyle

发明人： Chris Haga ,  Anthony Coyle

IPC分类号： H01L23/52

CPC分类号： H01L23/50 ,  H01L23/4334 ,  H01L23/552 ,  H01L24/34 ,  H01L24/37 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/16225 ,  H01L2224/2518 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37599 ,  H01L2224/45014 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： According to one or more aspects of the present invention, a flip chip BGA packaging or mounting arrangement is disclosed where a grounding connection of implemented on the back of the chip. The grounding connection comprises one or more metal strips that are situated between the back of the chip and a printed circuit board upon which the chip is operatively coupled via BGA, or between that back of the chip and a heat spreader that is itself operatively coupled to the printed circuit board. The backside grounding connection enhances stability in switching applications, for example, particularly where the chip includes silicon on insulator (SOI) wafer processing.

摘要翻译： 根据本发明的一个或多个方面，公开了一种倒装芯片BGA封装或安装装置，其中实现在芯片背面的接地连接。 接地连接包括位于芯片背面和印刷电路板之间的一个或多个金属条，其上芯片通过BGA可操作地耦合，或者在芯片的背面与散热器之间，散热器本身可操作地耦合到 印刷电路板。 背面接地连接增强了开关应用中的稳定性，例如，特别是在芯片包括绝缘体上硅（SOI）晶片处理的情况下。

公开(公告)号：US20060226521A1

公开(公告)日：2006-10-12

申请号：US11426166

申请日：2006-06-23

申请人： Anthony Coyle ,  William Boyd ,  Chris Haga ,  Leland Swanson

发明人： Anthony Coyle ,  William Boyd ,  Chris Haga ,  Leland Swanson

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device comprising a metallic leadframe (103) with a first surface (103a) and a second surface (103b). The leadframe includes a chip pad (104) and a plurality of segments (107); the chip pad is held by a plurality of straps (105), wherein each strap has a groove (106). A chip (101) is mounted on the chip pad and electrically connected to the segments. A heat spreader (110) is disposed on the first surface of the leadframe; the heat spreader has its central portion (110a) spaced above the chip connections (108), and also has positioning members (110b) extending outwardly from the edges of the central portion so that they rest in the grooves of the straps. Encapsulation material surrounds the chip, the electrical connections, and the spreader positioning members, and fills the space between the spreader and the chip, while leaving the second leadframe surface and the central spreader portion exposed.

摘要翻译： 一种半导体器件，包括具有第一表面（103a）和第二表面（103b）的金属引线框架（103）。 引线框架包括芯片焊盘（104）和多个段（107）; 芯片垫由多个带（105）保持，其中每个带具有凹槽（106）。 芯片（101）安装在芯片焊盘上并电连接到段上。 散热器（110）设置在引线框架的第一表面上; 散热器具有在芯片连接件（108）上方间隔开的中心部分（110a），并且还具有从中心部分的边缘向外延伸的定位构件（110b），使得它们搁置在带的凹槽中。 封装材料围绕芯片，电连接和扩展器定位构件，并且填充扩展器和芯片之间的空间，同时使第二引线框表面和中心扩展器部分露出。

公开(公告)号：US20050151268A1

公开(公告)日：2005-07-14

申请号：US10826713

申请日：2004-04-16

申请人： William Boyd ,  Chris Haga ,  Anthony Coyle ,  Leland Swanson ,  Quang Mai

发明人： William Boyd ,  Chris Haga ,  Anthony Coyle ,  Leland Swanson ,  Quang Mai

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L29/40

CPC分类号： H01L23/3114 ,  H01L23/4951 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/73253 ,  H01L2224/81193 ,  H01L2224/94 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method for assembling a whole semiconductor wafer (101) with a plurality of device units (120) having metal contact pads. Each contact pad has a patterned barrier metal layer and a metal stud (103, preferably copper or nickel) with an outer surface suitable to form metallurgical bonds without melting. A leadframe suitable for the whole wafer is provided, which has a plurality of segments groups (102), each group suitable for one device unit; each segment has first (102a) and second ends (102b) covered by solderable metal. A predetermined amount of solder paste (104) is placed on each of the first segment ends. The leadframe is then aligned with the wafer so that each of the paste-covered segment ends is aligned with the corresponding metal stud of the respective device unit. The leadframe is connected to the wafer and the whole wafer is encapsulated (105) so that the device units and the first segment ends are covered, while the second segment ends remain exposed. The encapsulated wafer is separated (110) into individual device units (120).

摘要翻译： 一种用于将整个半导体晶片（101）与具有金属接触焊盘的多个器件单元（120）组装的方法。 每个接触垫具有图案化的阻挡金属层和金属螺柱（103，优选铜或镍），其外表面适于形成冶金结合而不熔化。 提供了适用于整个晶片的引线框架，其具有多个段组（102），每个组适合于一个设备单元; 每个段具有由可焊接金属覆盖的第一（102a）和第二端（102b）。 将预定量的焊膏（104）放置在每个第一段末端上。 然后将引线框架与晶片对准，使得每个糊状覆盖的段端部与相应的器件单元的相应的金属钉对准。 引线框架连接到晶片，并且整个晶片被封装（105），使得器件单元和第一段端部被覆盖，而第二段端部保持暴露。 将封装的晶片分离成单独的器件单元（120）。

公开(公告)号：US07498203B2

公开(公告)日：2009-03-03

申请号：US11407836

申请日：2006-04-20

申请人： Chris Haga ,  Leland Swanson

发明人： Chris Haga ,  Leland Swanson

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/50 ,  H01L21/563 ,  H01L23/24 ,  H01L23/36 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01057 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/00

摘要： The invention provides thermally enhanced BGAs and methods for their fabrication with a ground ring suitable for operably coupling to either the frontside or backside, or both, of an IC chip mounted on a substrate. The methods and devices of the invention disclosed include the fabrication of a ground ring on the surface of a BGA substrate prepared for receiving the frontside of the chip. A heat spreader has ground ring corresponding to substrate round ring and is attached at the backside of the chip with a conductive material. A conductive material is interposed between the heat spreader and substrate ground rings, electrically coupling them. Thus, the backside of the chip may be electrically connected to the ground ring as well as, or instead of, the frontside.

摘要翻译： 本发明提供了热增强的BGA及其制造方法，该接地环适用于可操作地耦合到安装在基板上的IC芯片的前侧或后侧或两者。 所公开的本发明的方法和装置包括在准备接收芯片前侧的BGA衬底的表面上制造接地环。 散热器具有对应于衬底圆环的接地环，并且用导电材料附接在芯片的背面。 在散热器和基板接地环之间插入导电材料，将它们电耦合。 因此，芯片的背面可以电连接到接地环，也可以或者代替前端。

公开(公告)号：US20070246823A1

公开(公告)日：2007-10-25

申请号：US11407836

申请日：2006-04-20

申请人： Chris Haga ,  Leland Swanson

发明人： Chris Haga ,  Leland Swanson

IPC分类号： H01L23/34

CPC分类号： H01L23/50 ,  H01L21/563 ,  H01L23/24 ,  H01L23/36 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01057 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/00

摘要： The invention provides thermally enhanced BGAs and methods for their fabrication with a ground ring suitable for operably coupling to either the frontside or backside, or both, of an IC chip mounted on a substrate. The methods and devices of the invention disclosed include the fabrication of a ground ring on the surface of a BGA substrate prepared for receiving the frontside of the chip. A heat spreader has ground ring corresponding to substrate round ring and is attached at the backside of the chip with a conductive material. A conductive material is interposed between the heat spreader and substrate ground rings, electrically coupling them. Thus, the backside of the chip may be electrically connected to the ground ring as well as, or instead of, the frontside.

摘要翻译： 本发明提供了热增强的BGA及其制造方法，该接地环适用于可操作地耦合到安装在基板上的IC芯片的前侧或后侧或两者。 所公开的本发明的方法和装置包括在准备接收芯片前侧的BGA衬底的表面上制造接地环。 散热器具有对应于衬底圆环的接地环，并且用导电材料附接在芯片的背面。 在散热器和基板接地环之间插入导电材料，将它们电耦合。 因此，芯片的背面可以电连接到接地环，也可以或者代替前端。

公开(公告)号：US07084494B2

公开(公告)日：2006-08-01

申请号：US10871645

申请日：2004-06-18

申请人： Anthony L. Coyle ,  William D. Boyd ,  Chris Haga ,  Leland S. Swanson

发明人： Anthony L. Coyle ,  William D. Boyd ,  Chris Haga ,  Leland S. Swanson

IPC分类号： H01L23/34

CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device comprising a metallic leadframe (103) with a first surface (103a) and a second surface (103b). The leadframe includes a chip pad (104) and a plurality of segments (107); the chip pad is held by a plurality of straps (105), wherein each strap has a groove (106). A chip (101) is mounted on the chip pad and electrically connected to the segments. A heat spreader (110) is disposed on the first surface of the leadframe; the heat spreader has its central portion (110a) spaced above the chip connections (108), and also has positioning members (110b) extending outwardly from the edges of the central portion so that they rest in the grooves of the straps. Encapsulation material surrounds the chip, the electrical connections, and the spreader positioning members, and fills the space between the spreader and the chip, while leaving the second leadframe surface and the central spreader portion exposed.

摘要翻译： 一种半导体器件，包括具有第一表面（103a）和第二表面（103b）的金属引线框架（103）。 引线框架包括芯片焊盘（104）和多个段（107）; 所述芯片垫由多个带（105）保持，其中每个带具有凹槽（106）。 芯片（101）安装在芯片焊盘上并电连接到段上。 散热器（110）设置在引线框架的第一表面上; 散热器具有在芯片连接件（108）上方间隔开的中心部分（110a），并且还具有从中心部分的边缘向外延伸的定位构件（110b），使得它们搁置在带的凹槽中。 封装材料围绕芯片，电连接和扩展器定位构件，并且填充扩展器和芯片之间的空间，同时使第二引线框表面和中心扩展器部分露出。