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    Method and materials for through-mask electroplating and selective base removal
    7.
    发明授权
    Method and materials for through-mask electroplating and selective base removal 失效
    用于通孔电镀和选择性基底去除的方法和材料

    公开(公告)号：US06391773B2

    公开(公告)日：2002-05-21

    申请号：US09733188

    申请日：2000-12-09

    申请人： Panayotis Constantinou Andricacos ,  Cyril Cabral, Jr. ,  Roy Carruthers ,  Alfred Grill ,  Katherine Lynn Saenger

    发明人： Panayotis Constantinou Andricacos ,  Cyril Cabral, Jr. ,  Roy Carruthers ,  Alfred Grill ,  Katherine Lynn Saenger

    IPC分类号： H01L2144

    CPC分类号： H01L28/60 ,  H01L21/2885 ,  H01L28/75

    摘要： Multilayer metal materials are selected so that the materials will alloy or intermix under rapid thermal annealing conditions. The individual materials of the multilayers are preferably chosen such that at least one of the materials may be selectively etched with respect to the other material by wet chemical or electrochemical etching. For electroplating applications, the alloyed plating base material will assume some of the etch resistance of the original electrodeposit material such that a selective wet etch of the plating base can be performed without substantial undercutting. Furthermore, the graded composition alloy will exhibit other advantageous physical and chemical properties for electrode formation and use. The alloying or intermixing may be accomplished before or after patterning of the materials, for the instance wherein the materials deposited as blanket layers. Similarly, the alloying or intermixing may be accomplished before or after plating base removal for structures deposited by through-mask plating.

    摘要翻译： 选择多层金属材料，使得材料将在快速热退火条件下合金或混合。 优选选择多层的单个材料，使得可以通过湿化学或电化学蚀刻相对于其它材料选择性地蚀刻至少一种材料。 对于电镀应用，合金电镀基体材料将承受原始电沉积材料的一些耐蚀刻性，使得可以进行电镀基底的选择性湿法蚀刻而没有实质的底切。 此外，分级组合物合金对于电极的形成和使用将表现出其它有利的物理和化学性质。 合金化或混合可以在材料图案化之前或之后完成，例如其中作为覆盖层沉积的材料。 类似地，合金化或混合可以在通过通过掩模电镀沉积的结构的电镀基底去除之前或之后完成。

    Method and materials for through-mask electroplating and selective base removal
    8.
    发明授权
    Method and materials for through-mask electroplating and selective base removal 失效
    用于通孔电镀和选择性基底去除的方法和材料

    公开(公告)号：US06188120B1

    公开(公告)日：2001-02-13

    申请号：US08805403

    申请日：1997-02-24

    申请人： Panayotis Constantinou Andricacos ,  Cyril Cabral, Jr. ,  Roy Carruthers ,  Alfred Grill ,  Katherine Lynn Saenger

    发明人： Panayotis Constantinou Andricacos ,  Cyril Cabral, Jr. ,  Roy Carruthers ,  Alfred Grill ,  Katherine Lynn Saenger

    IPC分类号： H01L27108

    CPC分类号： H01L28/60 ,  H01L21/2885 ,  H01L28/75

    摘要： Multilayer metal materials are selected so that the materials will alloy or intermix under rapid thermal annealing conditions. The individual materials of the multilayers are preferably chosen such that at least one of the materials may be selectively etched with respect to the other material by wet chemical or electrochemical etching. For electroplating applications, the alloyed plating base material will assume some of the etch resistance of the original electrodeposit material such that a selective wet etch of the plating base can be performed without substantial undercutting. Furthermore, the graded composition alloy will exhibit other advantageous physical and chemical properties for electrode formation and use. The alloying or intermixing may be accomplished before or after patterning of the materials, for the instance wherein the materials deposited as blanket layers. Similarly, the alloying or intermixing may be accomplished before or after plating base removal for structures deposited by through-mask plating.

    摘要翻译： 选择多层金属材料，使得材料将在快速热退火条件下合金或混合。 优选选择多层的单个材料，使得可以通过湿化学或电化学蚀刻相对于其它材料选择性地蚀刻至少一种材料。 对于电镀应用，合金电镀基体材料将承受原始电沉积材料的一些耐蚀刻性，使得可以进行电镀基底的选择性湿法蚀刻而没有实质的底切。 此外，分级组合物合金对于电极的形成和使用将表现出其它有利的物理和化学性质。 合金化或混合可以在材料图案化之前或之后完成，例如其中作为覆盖层沉积的材料。 类似地，合金化或混合可以在通过通过掩模电镀沉积的结构的电镀基底去除之前或之后完成。