公开(公告)号：US20190214168A1

公开(公告)日：2019-07-11

申请号：US16355307

申请日：2019-03-15

Applicant: EPCOS AG

Inventor： Uwe Wozniak ,  Thomas Feichtinger

IPC: H01C7/112 ,  B32B18/00 ,  H01C7/10 ,  H01C7/108 ,  H01C7/18 ,  H01C17/065 ,  H01C17/28 ,  C04B35/453 ,  H01C17/00 ,  C04B37/02 ,  H01C1/148

Abstract: A multilayer component and a mathod for producing a multilayer component are disclosed. In an embodiment a multilayer component includes a ceramic main element and at least one metal structure, wherein the metal structure is cosintered and wherein main element is a varistor ceramic having ≥90 mol % of ZnO, from 0.5 to 5 mol % of Sb2O3, from 0.05 to 2 mol % of Co3O4, Mn2O3, SiO2 and/or Cr2O3, and

公开(公告)号：US20150243865A1

公开(公告)日：2015-08-27

申请号：US14422673

申请日：2013-07-22

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Sebastian Brunner ,  Oliver Dernovsek ,  Klaus-Dieter Aichholzer ,  Georg Krenn ,  Axel Pecina ,  Christian Faistauer

IPC: H01L33/64

CPC classification number: H01L33/644 ,  H01L33/642 ,  H01L33/647

Abstract: A light-emitting diode device has a first carrier and at least one light-emitting diode chip, which is arranged on the first carrier. The first carrier has at least one first and one second carrier part, wherein the light-emitting diode chip rests only on the first carrier part. Furthermore, the first and second carrier parts each have a thermal conductivity. The thermal conductivity of the first carrier part is at least 1.5 times the thermal conductivity of the second carrier part. The first carrier part is surrounded laterally by the second carrier part.

Abstract translation: 发光二极管装置具有第一载体和布置在第一载体上的至少一个发光二极管芯片。 第一载体具有至少一个第一和第二载体部分，其中发光二极管芯片仅在第一载体部分上。 此外，第一和第二载体部分各自具有导热性。 第一载体部分的热导率为第二载体部分的热导率的至少1.5倍。 第一载体部分被第二载体部分横向包围。

公开(公告)号：US10566115B2

公开(公告)日：2020-02-18

申请号：US16355307

申请日：2019-03-15

Applicant: EPCOS AG

Inventor： Uwe Wozniak ,  Thomas Feichtinger

IPC: H01C7/112 ,  C04B35/453 ,  H01C1/148 ,  H01C7/10 ,  H01C7/108 ,  H01C7/18 ,  H01C17/065 ,  H01C17/28 ,  B32B18/00 ,  C04B37/02 ,  H01C17/00 ,  H01C7/102

Abstract: A multilayer component and a mathod for producing a multilayer component are disclosed. In an embodiment a multilayer component includes a ceramic main element and at least one metal structure, wherein the metal structure is cosintered and wherein main element is a varistor ceramic having ≥90 mol % of ZnO, from 0.5 to 5 mol % of Sb2O3, from 0.05 to 2 mol % of Co3O4, Mn2O3, SiO2 and/or Cr2O3, and

公开(公告)号：US09978912B2

公开(公告)日：2018-05-22

申请号：US15501162

申请日：2015-08-07

Applicant: EPCOS AG

Inventor： Thomas Feichtinger

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  H01C7/12 ,  H01L25/075

CPC classification number: H01L33/486 ,  H01C7/12 ,  H01L23/60 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/62 ,  H01L33/644

Abstract: A carrier for an LED is disclosed. In an embodiment, the carrier includes a main body, wherein the carrier has an upper side on which a first contact area for attaching an LED is arranged, and wherein a protective device for protecting the LED from electrostatic discharges is integrated in the main body.

公开(公告)号：US09693482B2

公开(公告)日：2017-06-27

申请号：US14646444

申请日：2013-10-29

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Franz Rinner

IPC: H05K7/20 ,  H01L23/34 ,  H01L23/498 ,  H01L33/64 ,  H01L25/16 ,  H01L23/367 ,  H01L23/373 ,  H01L23/00

CPC classification number: H05K7/205 ,  H01L23/34 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/02 ,  H01L24/32 ,  H01L25/16 ,  H01L25/167 ,  H01L33/64 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/023 ,  H01L2224/04042 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/83801 ,  H01L2924/12041 ,  H01L2924/1304 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor component on a carrier body that includes a ceramic body and a thermistor sensor structure directly connected to the ceramic body. The thermistor sensor structure is integrated into the carrier body and includes a heat sink, on which the carrier body is mounted.

公开(公告)号：US09418980B2

公开(公告)日：2016-08-16

申请号：US14403143

申请日：2013-04-17

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Oliver Dernovsek ,  Klaus-Dieter Aichholzer ,  Sebastian Brunner

IPC: H01L33/00 ,  H01L27/02 ,  H01L25/16 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64

Abstract: A light-emitting diode device includes a carrier having at least one cavity, a light-emitting diode chip is arranged in a manner at least partly recessed in the at least one cavity, and an ESD protection element, which is formed by a partial region of the carrier. Furthermore, a light-emitting diode device includes a carrier having at least one cavity, a light-emitting diode chip arranged on the carrier, and an electrical component arranged at least partly recessed in the at least one cavity. Furthermore, the light-emitting diode device includes an ESD protection element, which is formed by a partial region of the carrier.

公开(公告)号：US20150245481A1

公开(公告)日：2015-08-27

申请号：US14422676

申请日：2013-08-02

Applicant: EPCOS AG

Inventor： Sebastian Brunner ,  Thomas Feichtinger

IPC: H05K1/11 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/11 ,  H01C1/01 ,  H01C1/084 ,  H01C7/008 ,  H01C7/02 ,  H01C7/04 ,  H01C7/102 ,  H05K1/0206 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/116 ,  H05K1/181 ,  H05K2201/10106

Abstract: A component assembly and a method for manufacturing a component assembly are disclosed. In some embodiments a component assembly includes a carrier, a metallic structure arranged on the carrier, wherein the metallic structure comprises at least one cavity and an electrical component arranged at least in part in the cavity.

Abstract translation: 公开了一种组件组件和用于制造组件组件的方法。 在一些实施例中，部件组件包括载体，布置在载体上的金属结构，其中金属结构包括至少一个空腔和至少部分地布置在空腔中的电气部件。

公开(公告)号：US10667400B2

公开(公告)日：2020-05-26

申请号：US15508224

申请日：2015-08-31

Applicant: EPCOS AG

Inventor： Thomas Feichtinger

IPC: H05K1/14 ,  H05K3/12 ,  H05K1/18 ,  H05K3/32 ,  H01G4/224 ,  H01G4/232 ,  H01C1/028 ,  H01C7/02 ,  H01C7/10 ,  H01C1/148 ,  H01C7/18 ,  H01C7/04 ,  H01G4/30 ,  H01C1/14 ,  H01C7/00 ,  H01C17/00 ,  H01G4/005 ,  H01G4/12 ,  H01G4/248 ,  H05K1/09 ,  H05K1/11 ,  H01C7/112 ,  H05K1/03

Abstract: An electrical component for embedding into a carrier comprises a ceramic main body, an electrically insulating passivation layer which is applied to the main body, and at least one inner electrode. In addition, the electrical component comprises an outer electrode which is connected to the inner electrode, wherein the outer electrode comprises a first electrode layer comprising a metal and a second electrode layer which is arranged on the latter and comprises copper.

公开(公告)号：US20190131208A1

公开(公告)日：2019-05-02

申请号：US16095636

申请日：2017-02-16

Applicant: EPCOS AG

Inventor： Thomas Feichtinger ,  Franz Rinner ,  Günter Pudmich ,  Werner Rollett ,  Michael Weilguni

IPC: H01L23/373 ,  H01L23/498 ,  H05K1/03 ,  H01L33/62 ,  F21S41/141 ,  B60Q1/04

Abstract: A multi-layer carrier system and a method for producing a multi-layer carrier system are disclosed. In an embodiment a multi-layer carrier system includes at least one multi-layer ceramic substrate and at least one matrix module of heat-producing semiconductor components, wherein the semiconductor components are arranged on the multi-layer ceramic substrate, and wherein the matrix module is electrically conductively connected to a driver circuit by way of the multi-layer ceramic substrate.

公开(公告)号：US10278285B2

公开(公告)日：2019-04-30

申请号：US14422676

申请日：2013-08-02

Applicant: EPCOS AG

Inventor： Sebastian Brunner ,  Thomas Feichtinger

IPC: H05K1/11 ,  H01C1/01 ,  H01C1/084 ,  H01C7/00 ,  H01C7/02 ,  H01C7/04 ,  H01C7/102 ,  H05K1/03 ,  H05K1/18 ,  H05K1/02

Abstract: A component assembly is disclosed. In an embodiment the assembly includes a carrier, a metallic structure arranged on the carrier, wherein the metallic structure comprises at least one cavity and an electrical component arranged at least in part in the cavity, wherein the metallic structure comprises at least two part regions which are not connected to each other by any further part of the metallic structure, and wherein the cavity is located between the two part regions. The assembly further includes two contact areas located on the carrier, wherein the component is located on the two contact areas such that each part region of the two part regions is located on one of the two contact areas.