Abstract:
An actinic ray-sensitive or radiation-sensitive resin composition contains a resin (A) having a glass transition temperature of 155° C. or higher, a compound (B) having a glass transition temperature of 150° C. or lower, and a solvent (C). A solid content in the actinic ray-sensitive or radiation-sensitive resin composition is 20% by mass or more. A softening point of the resist pattern formed using the actinic ray-sensitive or radiation-sensitive resin composition is from 130° C. to 170° C.
Abstract:
There is provided a pattern forming method which includes (I) a step of forming a first film by applying an active light-sensitive or radiation-sensitive resin composition which contains (A) a resin having a repeating unit having a group that is decomposed by the action of an acid and generates a polar group and (B) a compound that generates an acid by irradiation with active light or radiation to a substrate, (II) a step of exposing the first film, (III) a step of forming a line-and-space pattern by developing the exposed first film, and (IV) a step of coating the line-and-space pattern with a second film, in which the top width of the line pattern of the line-and-space pattern formed in Step (III) is larger than the bottom width thereof.
Abstract:
The present invention provides a pattern forming method which can be suitably applied to grayscale exposure since a deviation of the thickness among production lots is hardly generated, and an actinic ray-sensitive or radiation-sensitive resin composition. The pattern forming method of the present invention is a pattern forming method having a step A of forming a film having a thickness T on a substrate, using an actinic ray-sensitive or radiation-sensitive resin composition including a resin whose solubility in a developer changes by the action of an acid and an acid generator, a step B of exposing the film, and a step C of developing the exposed film using a developer to form a pattern, in which the film formed in the step A satisfies at least one of the following condition 1 or 2.Condition 1: In a case where the thickness T of the film is 800 nm or more, the value of γ is less than 10,000.Condition 2: In a case where the thickness T of the film is less than 800 nm, the value of γ is less than 5,000.
Abstract:
According to one embodiment, there is provided an actinic ray- or radiation-sensitive resin composition including (A) a compound represented by a general formula (1) below that generates an acid when exposed to actinic rays or radiation, and (B) a resin.
Abstract:
There is provided a pattern forming method including: (1) filtering, by using a filter, a resin solution containing (A) a resin capable of increasing its polarity by an action of an acid to decrease solubility in a developer including an organic solvent, and (C1) a solvent; (2) preparing an actinic ray-sensitive or radiation-sensitive resin composition containing the resin (A) obtained from the filtrating (1) and a solvent (C2) different from the solvent (C1); (3) filtering the actinic ray-sensitive or radiation-sensitive resin composition by using a filter; (4) forming a film by using a filtrate obtained by the filtering (3); (5) exposing the film; and (6) performing development using a developer containing an organic solvent to form a negative pattern, wherein an absolute value of the difference between solubility parameter (SPC1) of the solvent (C1) and solubility parameter (SPDEV) of the developer (C1), |SPC1−SPDEV|, is 1.00 (cal/cm3)1/2 or less.
Abstract:
According to one embodiment, there is provided an actinic ray- or radiation-sensitive resin composition containing (A) a resin containing a repeating unit represented by general formula (1) below and a repeating unit that is decomposed by an action of an acid to generate an alkali-soluble group, and (B) a compound that generates the acid when exposed to actinic rays or radiation, where L represents a bivalent connecting group, R1 represents a hydrogen atom or an alkyl group, and Z represents a cyclic acid anhydride structure.
Abstract:
Provided is an inspection method for simply measuring an ultra-small foreign substance in a composition selected from the group consisting of an actinic ray-sensitive or radiation-sensitive composition and a thermosetting composition. In addition, provided are a method for producing a composition and a method for verifying a composition, using the inspection method. The inspection method is an inspection method for a composition selected from the group consisting of an actinic ray-sensitive or radiation-sensitive composition and a thermosetting composition, the inspection method including a step X1 for applying the composition to a substrate X to form a coating film, a step X2 for removing the coating film from the substrate X using a removal solvent including an organic solvent, and a step X3 for measuring the number of defects on the substrate X after the removal of the coating film using a defect inspection device. In a case where the composition is the actinic ray-sensitive or radiation-sensitive composition, the step X2 is applied in a state where the coating film has not been subjected to an exposure treatment by irradiation with actinic rays or radiation, and in a case where the composition is the thermosetting composition, the step X2 is applied in a state where the coating film has not been subjected to a thermosetting treatment.
Abstract:
The pattern forming method of the invention includes (i) a step of forming a first film on a substrate using an actinic ray-sensitive or radiation-sensitive resin composition including a resin (A) capable of increasing the polarity by the action of an acid to decrease the solubility in a developer including an organic solvent; (ii) a step of exposing the first film; (iii) a step of developing the exposed first film using a developer including an organic solvent to form a negative tone pattern; and (iv) a step of forming a second film on the second substrate so as to cover the periphery of the negative tone pattern.
Abstract:
Provided is an actinic-ray- or radiation-sensitive resin composition, including any of compounds of general formula (1) below that when exposed to actinic rays or radiation, is decomposed to thereby generate an acid and a resin that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer.