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    Circuitized substrate with internal cooling structure and electrical assembly utilizing same
    4.
    发明授权
    Circuitized substrate with internal cooling structure and electrical assembly utilizing same 失效
    具有内部冷却结构的电路化基板和利用其的电气组件

    公开(公告)号：US07738249B2

    公开(公告)日：2010-06-15

    申请号：US11976468

    申请日：2007-10-25

    Applicant: Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

    Inventor： Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

    IPC: H05K7/20

    CPC classification number: H05K1/0206 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/44 ,  H05K2201/064 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00

    Abstract: An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation. The thermal cooling structure is adapted for having cooling fluid pass there-through during operation of the assembly. A method of making the substrate is also provided.

    Abstract translation: 一种电气组件，其包括电路化衬底，其包括以层叠取向交替取向的第一多个电介质和导电电路层，结合到所述电介质层之一的热冷结构和安装在所述电路化衬底上的至少一个电气部件。 电路化衬底包括位于其中的多个导电和导热通孔，选择的导热通孔热耦合到电气部件并延伸穿过第一多个电介质和导电电路层，并且 热耦合到热冷却结构，这些选择的导热通孔中的每一个在组装操作期间提供从电气部件到热冷却结构的热路径。 热冷却结构适于在组件的操作期间使冷却流体通过。 还提供了制造基板的方法。

    Substrate having internal capacitor and method of making same
    6.
    发明授权
    Substrate having internal capacitor and method of making same 有权
    具有内部电容器的基板及其制造方法

    公开(公告)号：US08607445B1

    公开(公告)日：2013-12-17

    申请号：US13517776

    申请日：2012-06-14

    Applicant: Rabindra N. Das ,  Frank D. Egitto ,  John M. Lauffer ,  How T. Lin

    Inventor： Rabindra N. Das ,  Frank D. Egitto ,  John M. Lauffer ,  How T. Lin

    IPC: H05K3/30

    CPC classification number: H01G4/206 ,  H01G4/232 ,  H01G4/33 ,  H05K1/162 ,  H05K3/0032 ,  H05K3/107 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/09236 ,  H05K2201/09309 ,  H05K2201/09881 ,  H05K2203/0108 ,  H05K2203/066

    Abstract: A method of making a circuitized substrate which includes at least one and possibly several capacitors as part thereof. In one embodiment, the substrate is produced by forming a layer of capacitive dielectric material on a dielectric layer and thereafter forming channels with the capacitive material, e.g., using a laser. The channels are then filled with conductive material, e.g., copper, using selected deposition techniques, e.g., sputtering, electro-less plating and electroplating. A second dielectric layer is then formed atop the capacitor and a capacitor “core” results. This “core” may then be combined with other dielectric and conductive layers to form a larger, multilayered PCB or chip carrier. In an alternative approach, the capacitive dielectric material may be photo-imageable, with the channels being formed using conventional exposure and development processing known in the art.

    Abstract translation: 一种制造电路化衬底的方法，其包括至少一个可能的几个电容器作为其一部分。 在一个实施例中，通过在电介质层上形成电容电介质材料层，然后用电容材料形成通道，例如使用激光来制造衬底。 然后使用所选择的沉积技术，例如溅射，无电镀和电镀，用导电材料（例如铜）填充通道。 然后在电容器顶部形成第二电介质层，并产生电容器“芯”。 然后，该“芯”可以与其它电介质层和导电层组合以形成较大的多层PCB或芯片载体。 在替代方法中，电容介电材料可以是可光成像的，其中通道是使用本领域已知的常规曝光和显影处理形成的。

    Capacitive substrate
    7.
    发明授权
    Capacitive substrate 失效
    电容衬底

    公开(公告)号：US07897877B2

    公开(公告)日：2011-03-01

    申请号：US11438424

    申请日：2006-05-23

    Applicant: Rabindra N. Das ,  Frank D. Egitto ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

    Inventor： Rabindra N. Das ,  Frank D. Egitto ,  John M. Lauffer ,  How T. Lin ,  Voya R. Markovich

    IPC: H05K1/16

    CPC classification number: H05K1/162 ,  H01L27/12 ,  H01L28/40 ,  H05K1/0306 ,  H05K3/125 ,  H05K3/4667 ,  H05K2201/0187 ,  H05K2201/09509 ,  H05K2203/013

    Abstract: A capacitive substrate and method of making same in which first and second glass layers are used. A first conductor is formed on a first of the glass layers and a capacitive dielectric material is positioned over the conductor. The second conductor is then positioned on the capacitive dielectric and the second glass layer positioned over the second conductor. Conductive thru-holes are formed to couple to the first and second conductors, respectively, such that the conductors and capacitive dielectric material form a capacitor when the capacitive substrate is in operation.

    Abstract translation: 电容性基板及其制造方法，其中使用第一和第二玻璃层。 第一导体形成在第一玻璃层上，并且电容电介质材料位于导体上方。 然后将第二导体定位在电容电介质上，并且第二玻璃层位于第二导体上。 形成导电通孔以分别耦合到第一和第二导体，使得当电容基板工作时，导体和电容电介质材料形成电容器。

    MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEM
    8.
    发明申请
    MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEM 审中-公开
    具有计算机系统的模块化，可分离的计算机叶片

    公开(公告)号：US20120260063A1

    公开(公告)日：2012-10-11

    申请号：US13082599

    申请日：2011-04-08

    Applicant: Voya R. Markovich ,  How T. Lin ,  Benson Chan ,  Frank D. Egitto

    Inventor： Voya R. Markovich ,  How T. Lin ,  Benson Chan ,  Frank D. Egitto

    IPC: G06F15/76 ,  G06F9/02

    CPC classification number: H05K3/365 ,  H01L2924/0002 ,  H05K1/148 ,  H05K2201/047 ,  H05K2201/10159 ,  H05K2201/209 ,  H01L2924/00

    Abstract: A detachable, logic leaf module having dendritic projections on a surface is connected to a recessed area on the surface of a cluster interface board. The projections are used for electrically connecting the logic module device to the cluster interface board or the like, the projections on the surface of the logic leaf being flexibly and conductively wired to the receiving area on the surface of the cluster interface board. The logic leaf connector is removable without the need for solder softening thermal cycles or special tools, and permits the simple removal or replacement of an individual leaf at any time.

    Abstract translation: 在表面上具有树状突起的可拆卸的逻辑叶片模块连接到集群接口板的表面上的凹陷区域。 突起用于将逻辑模块设备电连接到集群接口板等，逻辑叶片的表面上的突起被灵活地和导电地连接到集群接口板的表面上的接收区域。 逻辑叶片连接器是可移动的，不需要焊料软化热循环或特殊工具，并且允许在任何时间简单地移除或更换单个叶片。

    Circuitized substrate with internal cooling structure and electrical assembly utilizing same
    10.
    发明申请
    Circuitized substrate with internal cooling structure and electrical assembly utilizing same 失效
    具有内部冷却结构的电路化基板和利用其的电气组件

    公开(公告)号：US20090109624A1

    公开(公告)日：2009-04-30

    申请号：US11976468

    申请日：2007-10-25

    Applicant: Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

    Inventor： Benson Chan ,  Frank D. Egitto ,  How T. Lin ,  Roy H. Magnuson ,  Voya R. Markovich ,  David L. Thomas

    IPC: H05K7/20 ,  H05K3/20

    CPC classification number: H05K1/0206 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/0061 ,  H05K3/44 ,  H05K2201/064 ,  H05K2201/09745 ,  H05K2201/10674 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T428/24917 ,  H01L2924/00

    Abstract: An electrical assembly which includes a circuitized substrate including a first plurality of dielectric and electrically conductive circuit layers alternatively oriented in a stacked orientation, a thermal cooling structure bonded to one of the dielectric layers and at least one electrical component mounted on the circuitized substrate. The circuitized substrate includes a plurality of electrically conductive and thermally conductive thru-holes located therein, selected ones of the thermally conductive thru-holes thermally coupled to the electrical component(s) and extending through the first plurality of dielectric and electrically conductive circuit layers and being thermally coupled to the thermal cooling structure, each of these selected ones of thermally conductive thru-holes providing a thermal path from the electrical component to the thermal cooling structure during assembly operation. The thermal cooling structure is adapted for having cooling fluid pass there-through during operation of the assembly. A method of making the substrate is also provided.

    Abstract translation: 一种电气组件，其包括电路化衬底，其包括以层叠取向交替取向的第一多个电介质和导电电路层，结合到所述电介质层之一的热冷结构和安装在所述电路化衬底上的至少一个电气部件。 电路化衬底包括位于其中的多个导电和导热通孔，选择的导热通孔热耦合到电气部件并延伸穿过第一多个电介质和导电电路层，并且 热耦合到热冷却结构，这些选择的导热通孔中的每一个在组装操作期间提供从电气部件到热冷却结构的热路径。 热冷却结构适于在组件的操作期间使冷却流体通过。 还提供了制造基板的方法。

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