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公开(公告)号：US10667429B2
公开(公告)日：2020-05-26
申请号：US15699713
申请日：2017-09-08
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Shakti Singh Chauhan , Hendrik Pieter Jacobus De Bock , Graham Charles Kirk , Stanton Earl Weaver, Jr. , David Shannon Slaton , Tao Deng , Pramod Chamarthy
Abstract: A system, such as a heat exchange assembly includes a support structure having a recess, a first support end, a second support end, and a support portion extending between the first and second support ends. The support structure further includes a plurality of projections protruding from a portion of a surface of the support structure, corresponding to the support portion. The support structure is a primary heat sink. The heat exchange assembly includes a vapor chamber having a casing and a wick disposed within the casing. The vapor chamber is disposed within the recess and coupled to a surface of the support structure such that the plurality of projections surrounds the vapor chamber. The casing includes a mid projected portion disposed at an evaporator portion of the vapor chamber. The first and second support ends, and the mid projected portion include a non-uniform surface configured to contact the circuit card.
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公开(公告)号：US09333599B2
公开(公告)日：2016-05-10
申请号：US14135678
申请日：2013-12-20
Applicant: General Electric Company
Inventor： Hendrik Pieter Jacobus de Bock , Stanton Earl Weaver, Jr. , Tao Deng , Jay Todd Labhart , Pramod Chamarthy , Shakti Singh Chauhan , Graham Charles Kirk , Brian Patrick Hoden
CPC classification number: B23P15/26 , B23P2700/09 , B23P2700/10 , F28D15/0266 , F28D15/0275 , H05K7/20681 , H05K9/0062 , Y10T29/49826
Abstract: An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.
Abstract translation: 提供电子底盘。 电子机箱包括限定内部空间的多个面板。 所述多个面板中的一个面板具有具有内表面和外表面的复合区段。 电子底盘还包括导电热路径，其从复合段的内表面延伸穿过面板到复合段的外表面。
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公开(公告)号：US09331477B2
公开(公告)日：2016-05-03
申请号：US14060168
申请日：2013-10-22
Applicant: General Electric Company
Inventor： Ramanujam Ramabhadran , Charles Erklin Seeley , John Stanley Glaser , Robert James Thomas , Stanton Earl Weaver, Jr.
IPC: F21V29/02 , H01L23/467 , H02H9/04 , F21Y101/02 , F21V29/63
CPC classification number: H02H9/04 , F21V29/63 , F21Y2115/10 , H02H9/041
Abstract: A cooling system includes a synthetic jet having a first synthetic jet lead and a second synthetic jet lead. The cooling system also includes a capacitor having a first capacitor lead and a second capacitor lead. The first capacitor lead is coupled to the first synthetic jet lead. The synthetic jet is configured to be powered via an alternating current (AC) power source coupled to the second capacitor lead and to the second synthetic jet lead.
Abstract translation: 冷却系统包括具有第一合成射流引线和第二合成射流引线的合成射流。 冷却系统还包括具有第一电容器引线和第二电容器引线的电容器。 第一电容器引线耦合到第一合成射流引线。 合成射流被配置为通过耦合到第二电容器引线和第二合成射流引线的交流（AC）电源来供电。
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4.发明授权公开(公告)号：US11503704B2
公开(公告)日：2022-11-15
申请号：US16730435
申请日：2019-12-30
Applicant: General Electric Company
IPC: H05K1/02 , H05K1/03 , H05K1/09 , H05K1/11 , H05K1/14 , H05K1/16 , H05K1/18 , H05K3/10 , H05K3/32 , H05K3/36 , H05K3/42 , H05K3/46 , H01L21/02 , H01L21/48 , H01L21/50 , H01L21/56 , H01L23/00 , H01L23/12 , H01L23/13 , H01L23/16 , H01L23/31 , H01L23/48 , H01L23/52 , H01L23/58 , H01L23/66 , H01L23/485 , H01L23/498 , H01L23/538
Abstract: An electronics package is disclosed. The electronics package includes a first radio frequency (RF) substrate layer, a second RF substrate layer, and a plurality of conductive layers disposed adjacent to at least one of the first RF substrate layer and the second RF substrate layer and including an inner conductive layer disposed between and adjacent to both the first RF substrate layer and the second RF substrate layer. The inner conductive layer bonds the first RF substrate layer to the second RF substrate layer. The electronics package also includes a plurality of conductive interconnects extending through the first RF substrate layer and the second RF substrate layer and electrically coupled between at least two of the plurality of conductive layers.
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Patent Agency Ranking
公开(公告)号：US20150108899A1
公开(公告)日：2015-04-23
申请号：US14060168
申请日：2013-10-22
Applicant: General Electric Company
Inventor： Ramanujam Ramabhadran , Charles Erklin Seeley , John Stanley Glaser , Robert James Thomas , Stanton Earl Weaver, Jr.
CPC classification number: H02H9/04 , F21V29/63 , F21Y2115/10 , H02H9/041
Abstract: A cooling system includes a synthetic jet having a first synthetic jet lead and a second synthetic jet lead. The cooling system also includes a capacitor having a first capacitor lead and a second capacitor lead. The first capacitor lead is coupled to the first synthetic jet lead. The synthetic jet is configured to be powered via an alternating current (AC) power source coupled to the second capacitor lead and to the second synthetic jet lead.
Abstract translation: 冷却系统包括具有第一合成射流引线和第二合成射流引线的合成射流。 冷却系统还包括具有第一电容器引线和第二电容器引线的电容器。 第一电容器引线耦合到第一合成射流引线。 合成射流被配置为通过耦合到第二电容器引线和第二合成射流引线的交流（AC）电源来供电。
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公开(公告)号：US09303858B2
公开(公告)日：2016-04-05
申请号：US13779822
申请日：2013-02-28
Applicant: General Electric Company
Inventor： Charles Erklin Seeley , Stanton Earl Weaver, Jr. , Brian Magann Rush , Mark Howard Giammattei
IPC: B60Q1/06 , F21V29/00 , F04B43/04 , H01L23/467 , F04B43/09 , F04B45/027 , F21V29/63
CPC classification number: F15D1/007 , F04B43/046 , F04B43/095 , F04B45/027 , F21V29/60 , F21V29/63 , H01L23/467 , H01L2924/0002 , H01L2924/00
Abstract: A cooling system is provided. The cooling system includes an enclosure. The enclosure is defined by walls among which at least one is movable. The enclosure further includes at least one aperture on at least one wall. The system further includes an amplification element that is coupled with at least one walls of the enclosure. Further, the cooling system includes an actuation unit mechanically coupled with the amplification element. The actuation unit includes at least one actuation signal triggered actuator configured to cause a displacement the amplification element. In the cooling system, the amplification element is configured to amplify the actuator caused displacement through to the at least one wall of the enclosure such that fluid enters and exits the enclosure from the at least one aperture.
Abstract translation: 提供冷却系统。 冷却系统包括一个外壳。 外壳由墙壁限定，其中至少一个是可移动的。 外壳还包括至少一个壁上的至少一个孔。 该系统还包括与外壳的至少一个壁耦合的放大元件。 此外，冷却系统包括与放大元件机械耦合的致动单元。 致动单元包括至少一个致动信号触发的致动器，其构造成使放大元件发生位移。 在冷却系统中，放大元件被配置为放大致动器，使得位移通过至壳体的至少一个壁，使得流体从至少一个孔进入和离开外壳。
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7.发明授权公开(公告)号：US08912643B2
公开(公告)日：2014-12-16
申请号：US13709469
申请日：2012-12-10
Applicant: General Electric Company
Inventor： Hendrik Pieter Jacobus de Bock , Stanton Earl Weaver, Jr. , Raj Bahadur , Eric Ayres Browne , Gary Dwayne Mandrusiak
IPC: H01L23/34 , F28F13/18 , H01L23/473
CPC classification number: H01L23/4735 , H01L2924/0002 , H01L2924/00
Abstract: An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet.
Abstract translation: 提供了一种集成电路装置，其包括具有第一表面的基板的模具和与第一表面相对的第二表面。 模具包括位于第一表面上的至少一个电路元件。 形成在第二表面上，是一种润湿特征，其包括间隔开的纳米尺度结构的阵列和/或间隔开的微结构的阵列。 润湿特征还包括施加到第二表面的至少一部分的润湿性涂层。 集成电路器件包括耦合到与第二表面相邻的管芯的间隔件。 此外，喷射器板联接到间隔件。 喷射器板包括至少一个微喷射器和至少一个通过喷射器板限定的出射孔。 所述至少一个出口孔邻近所述至少一个微型喷射器定位。
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公开(公告)号：US10244778B2
公开(公告)日：2019-04-02
申请号：US14933367
申请日：2015-11-05
Applicant: General Electric Company
Inventor： James Lee Armstrong , Stanton Earl Weaver, Jr. , Sabrina Marie Hannah , Nandini Nagraj , Manuel Alfredo Palacios
Abstract: A method for monitoring cooking in an oven appliance includes drawing cooking vapors or gases from a cooking chamber to a fluid analysis assembly of the oven appliance during a gas or vapor analysis cooking cycle, determining a cooking status of the food item within the cooking chamber with the controller of the oven appliance based upon a response pattern of a plurality of fluid sensors of the fluid analysis assembly to the cooking vapors or gases during the gas or vapor analysis cooking cycle, and activating an alert with the controller of the oven appliance when the cooking status of the food item within the cooking chamber is a particular cooking status.
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9.发明申请公开(公告)号：US20140160677A1
公开(公告)日：2014-06-12
申请号：US13709469
申请日：2012-12-10
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Hendrik Pieter Jacobus de Bock , Stanton Earl Weaver, Jr. , Raj Bahadur , Eric Ayres Browne , Gary Dwayne Mandrusiak
CPC classification number: H01L23/4735 , H01L2924/0002 , H01L2924/00
Abstract: An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet.
Abstract translation: 提供了一种集成电路装置，其包括具有第一表面的基板的模具和与第一表面相对的第二表面。 模具包括位于第一表面上的至少一个电路元件。 形成在第二表面上，是一种润湿特征，其包括间隔开的纳米尺度结构的阵列和/或间隔开的微结构的阵列。 润湿特征还包括施加到第二表面的至少一部分的润湿性涂层。 集成电路器件包括耦合到与第二表面相邻的管芯的间隔件。 此外，喷射器板联接到间隔件。 喷射器板包括至少一个微喷射器和至少一个通过喷射器板限定的出射孔。 所述至少一个出口孔邻近所述至少一个微型喷射器定位。
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