摘要:
A ceramic wiring substrate and a process for producing the same having a conductive layer, obtained by sintering a conductive paste comprising 85 to 97% by weight of a tungsten powder and 15 to 3% by weight of a sintering additive (for conductive metal) having a specified composition, on a mullite ceramic substrate.
摘要:
A ceramic substrate for densely integrated semiconductor arrays which is superior in a coefficient of thermal expansion, dielectric constant, strength of metallized bond, and mechanical strength, comprising a sintered body composed essentially of mullite crystals and a non-crystralline binder composed of SiO.sub.2, Al.sub.2 O.sub.3, and MgO, is provided.
摘要:
A ceramic substrate for densely integrated semiconductor arrays which is superior in a coefficient of thermal expansion, dielectric constant, strength of metallized bond, and mechanical strength, comprising a sintered body composed essentially of mullite crystals and a non-crystalline binder composed of SiO.sub.2, Al.sub.2 O.sub.3, and MgO, is provided.
摘要翻译:一种用于密集集成的半导体阵列的陶瓷衬底,其热膨胀系数,介电常数,金属化结合强度和机械强度优异,包括基本上由莫来石晶体组成的烧结体和由SiO 2,Al 2 O 3组成的非结晶粘合剂 ,和MgO。
摘要:
An electroconductive molybdenum paste comprising 100 parts by weight of a mixture consisting of 68.0 to 89.2% by weight of molybdenum powders having an average particle size of 0.5 to 10 .mu.m, 10.0 to 27.0% by weight of a solvent, and 0.8 to 5.0% by weight of a binder, 0.5 to 5.0 parts by weight of a gelling agent, and 0.5 to 4.0 parts by weight of a silane coupling agent can firmly fill throughholes of a green sheet without formation of clearances and hollows in the resulting conductors in the throughholes, with better surface roughness of the conductor surfaces in the throughholes, and without development of cracks near the throughholes.
摘要:
A ceramic wiring board comprising a silica board having pores of several ten to several hundred .ANG. in diameter amounting to 5 to 20 vol % of the insulating layer, and a process for producing the same, which comprises heat-treating a silicon alkoxide to form a fine silica powder and sintering the fine powder. This board has good mechanical characteristics and a high signal propagation speed.
摘要:
A ceramic wiring board which comprises ceramic part in which through-holes are made, sintered wiring pattern part provided on the surface of said ceramic part and sintered conductor part filled in said through-holes shows much decrease in cracks at the through-hole part caused by sintering and remarkable reduction in moisture absorbency when the ceramic part comprises ceramic containing a sintering assistant and the sintered conductor part comprises a metal containing the same sintering assistant as that present in said ceramic part.
摘要:
A ceramic multilayer circuit board is provided by sintering a multilayer wiring substrate containing alumina as a main component, which was prepared by the green sheet process, nickel plating and gold plating in this order on the superficial wiring conductor layer, printing a thick film conductor paste on the gold plating layer, firing the printed substrate and finally printing a thick film resistor paste on at least part of the thick film conductor layer and firing to form a thick film resistor layer.
摘要:
A ceramic multilayer wiring board is provided in which ceramic insulating layers and wiring patterns provided thereon are connected by conductors filling through-holes formed in the ceramic insulating layers. The through-holes are so formed that the superficial portions of each through-hole of the ceramic multilayer wiring board is smaller in diameter than the inside portion of the through-hole between the superficial portion. This can prevent the board from being cracked around the through-holes.
摘要:
A wiring circuit board with a fine wiring pattern free from disconnection and poor insulation is produced by forming an insulating layer consisting of at least two insulating substances having different dissociation energies for metalization, including metal elements, on a substrate and irradiating the insulating layer with an energizing beam by scanning, thereby forming a wiring pattern as desired.
摘要:
There is provided a method of producing a ceramic represented by the general formula of ABO.sub.3, wherein A includes Pb and at least one element selected from the group consisting of Ba and Sr and B is either of Zr or both of Zr and Ti, by hot-pressing a complex oxide obtained by calcining the mixture of the oxides of A and B characterized by that a solid solution of the oxides of Ba and/or Sr and the oxide of the element constituting B, such as BaTiO.sub.3, SrZrO.sub.3 or (Ba, Sr)ZrO.sub.3, is used as the starting oxides of Ba and/or Sr, and that the starting material contains PbO in an amount of 3 - 20 mol% in excess of that calculated for the objective composition of the final product. Ceramics produced by the method of the present invention have ferroelectric properties and are optically transparent.