摘要:
A substrate is coated with a film to be recrystallized. A pattern of crystallization barriers is created in the film, for example, by etching voids in the film. An encapsulation layer is generally applied to protect the film, fill the voids and otherwise enhance a recrystallization process. Recrystallization is carried out such that certain orientations pass preferentially through the barrier, generally as a result of growth-velocity anisotropy. The result is a film of a specific predetermined crystallographic orientation, a range of orientations or a set of discrete orientations.
摘要:
To achieve a uniform texture, large crystalline grains or, in some cases, a single crystalline orientation in a thick (>1 .mu.m) film on a foreign substrate, the film is formed so as to be thin (
摘要:
Improvements on the graphoepitaxial process for obtaining epitaxial or preferred orientation films are described wherein a cap of material is formed over the film to be oriented, artificial surface-relief structure may be present in the substrate, the cap, or both, and the film may be heated by irradiation with electromagnetic radiation.
摘要:
A substrate, such as a film of thermally grown silicon dioxide on a silicon wafer is coated with a thin film of polycrystalline or amorphous silicon in the thickness range 0.05-10.mu. deposited by chemical vapor deposition. An encapsulation layer that is a composite of 2 .mu.m thickness SiO.sub.2, 30 nm of Si.sub.3 N.sub.4 is deposited on the thin film. A pattern of stripes is created on this encapsulation layer made of materials, such as titanium, silicon, silicon dioxide and photoresist. A long and narrow molten zone is created in the film with its long axis oriented perpendicular to the lines and is moved with a movable strip-heater over in a direction parallel to the lines in the recrystallization process to establish dislocation and crystalline defects in the film entrained to follow the pattern of the stripes at locations related to the stripes.
摘要翻译:诸如硅晶片上的热生长二氧化硅的薄膜的衬底涂覆有通过化学气相沉积沉积的厚度范围为0.05-10μm的多晶或非晶硅薄膜。 作为2μm厚的SiO 2,30nm的Si 3 N 4的复合体的封装层沉积在薄膜上。 在由诸如钛,硅,二氧化硅和光致抗蚀剂的材料制成的该封装层上形成条纹图案。 在膜中产生长而窄的熔融区,其长轴垂直于线,并且在可再循环过程中与可行的带状加热器在平行于线的方向上移动,以在膜中形成位错和晶体缺陷 夹带在与条纹相关的位置跟随条纹图案。
摘要:
Improvements to graphoepitaxy include use of irradiation by electrons, ions or electromagnetic or acoustic radiation to induce or enhance the influence of artificial defects on crystallographic orientation; use of single defects; and use of a relief structure that includes facets at 70.5 and/or 109.5 degrees.
摘要:
A process for entraining dislocations and other crystalline defects in a thin film includes coating a substrate, such as a layer of thermally grown silicon dioxide on a silicon wafer with the thin film of polycrystalline or amorphous silicon in the thickness range 0.05-10.mu. deposited by chemical vapor deposition. An encapsulation layer that is a composite of 2 .mu.m thickness SiO.sub.2, 30 nm of Si.sub.3 N.sub.4 is deposited on the thin film. A pattern of stripes is created on this encapsulation layer made of materials, such as titanium, silicon, silicon dioxide and photoresist. A long and narrow molten zone is created in the film with its long axis oriented perpendicular to the lines and is moved with a movable strip-heater over in a direction parallel to the lines in the recrystallization process to establish the dislocation and other crystalline defects in the film entrained to follow the pattern of stripes at locations related to the stripes.
摘要翻译:夹杂在薄膜中的位错和其它结晶缺陷的方法包括在硅晶片上涂覆基底,例如多晶硅或非晶硅薄膜,厚度范围为0.05-10微米的硅片上的一层热生长二氧化硅 化学气相沉积。 作为2μm厚的SiO 2,30nm的Si 3 N 4的复合体的封装层沉积在薄膜上。 在由诸如钛,硅,二氧化硅和光致抗蚀剂的材料制成的该封装层上形成条纹图案。 在薄膜中产生长而窄的熔融区,其长轴垂直于线,并且在可再循环过程中与可行的带状加热器在平行于线的方向上移动,以建立位错和其它结晶缺陷 电影夹带着跟踪条纹相关的条纹。
摘要:
A structure including a grating and a semiconductor nanocrystal layer on the grating, can be a laser. The semiconductor nanocrystal layer can include a plurality of semiconductor nanocrystals including a Group II-VI compound, the nanocrystals being distributed in a metal oxide matrix. The grating can have a periodicity from 200 nm to 500 nm.
摘要:
An array of Fresnel zone plates is illuminated by parallel beamlets of narrow-band electromagnetic radiation. The individual zone plates focus a significant fraction of the incident radiation to foci on a substrate located at least several micrometers distant. The beamlets are capable of being individually turned on or off by shutters, or by deflecting small mirrors that would otherwise direct a beamlet to its Fresnel zone plate. Pattern generation is accomplished by moving the substrate while multiplexing the individual beamlets on or off.
摘要:
X-ray masking apparatus includes a frame having a supporting rim surrounding an x-ray transparent region, a thin membrane of hard inorganic x-ray transparent material attached at its periphery to the supporting rim covering the x-ray transparent region and a layer of x-ray opaque material on the thin membrane inside the x-ray transparent region arranged in a pattern to selectively transmit x-ray energy entering the x-ray transparent region through the membrane to a predetermined image plane separated from the layer by the thin membrane. A method of making the masking apparatus includes depositing back and front layers of hard inorganic x-ray transparent material on front and back surfaces of a substrate, depositing back and front layers of reinforcing material on the back and front layers, respectively, of the hard inorganic x-ray transparent material, removing the material including at least a portion of the substrate and the back layers of an inside region adjacent to the front layer of hard inorganic x-ray transparent material, removing a portion of the front layer of reinforcing material opposite the inside region to expose the surface of the front layer of hard inorganic x-ray transparent material separated from the inside region by the latter front layer, and depositing a layer of x-ray opaque material on the surface of the latter front layer adjacent to the inside region.
摘要:
Soft carbon-K X-rays (38) expose a PMMA photoresist (31) on an oxide layer (32) of a silicon substrate (33) through a parent mask (30) separated a distance S from the resist by a spacer (34) with the parent mask slits (12, 17) defining a spatial period p to establish an intensity pattern of period p/n at the photomask with S=p.sup.2 /n.lambda., where .lambda. is the wavelength of the incident radiation and .lambda.