公开(公告)号：US20080010819A1

公开(公告)日：2008-01-17

申请号：US11775294

申请日：2007-07-10

申请人： Hidehiro NAKAMURA ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

发明人： Hidehiro NAKAMURA ,  Akishi Nakaso ,  Shigeharu Arike ,  Fumio Inoue ,  Tetsuya Enomoto ,  Norio Moriike ,  Kousuke Hiroki

IPC分类号： H05K3/30

CPC分类号： H05K3/4617 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/0097 ,  H05K3/06 ,  H05K3/244 ,  H05K3/4038 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4647 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0384 ,  H05K2203/0733 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

摘要翻译： 本发明提供一种由一层或两层以上的绝缘树脂组合物层形成的连接板，以及形成为在其绝缘树脂组合物层的厚度方向上形成的连接导体， 连接导体电路，并且使用多层布线板，半导体封装用基板和使用该连接基板的半导体封装，以及其制造方法。

公开(公告)号：US20070161228A1

公开(公告)日：2007-07-12

申请号：US11683714

申请日：2007-03-08

申请人： Hidehiro NAKAMURA ,  Tetsuya ENOMOTO ,  Toshio YAMAZAKI ,  Hiroshi KAWAZOE

发明人： Hidehiro NAKAMURA ,  Tetsuya ENOMOTO ,  Toshio YAMAZAKI ,  Hiroshi KAWAZOE

IPC分类号： H01L29/84 ,  H01L21/4763

CPC分类号： H01L21/568 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/498 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/4007 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A wiring substrate (1) comprises an insulating base (10) with connection holes (11), buried conductors (12) provided in the connection holes (11) without reaching a rear surface of the insulating base (10), and wiring layers 14 connected to the buried conductors (12). The buried conductors (12) thicken the wiring layers (14), and can form aligning parts (110) on the rear surface of the connection holes (11) to be used for three-dimensional mounting structure. Each wiring layer (14) includes thin terminals (14A), wirings (14B) and thick electrodes (14C). Not only the terminals (14A) and wirings (14B) but also the buried conductors (12) are raised by the same manufacturing process. A semiconductor element (2) is attached to the electrodes (14C) of the wiring substrate (1).

摘要翻译： 布线基板（1）包括具有连接孔（11）的绝缘基座（10），设置在连接孔（11）中的埋入导体（12），而不到达绝缘基座（10）的后表面，并且布线层14 连接到埋地导体（12）。 掩埋导体（12）使布线层（14）变厚，并且可以在用于三维安装结构的连接孔（11）的后表面上形成对准部分（110）。 每个布线层（14）包括薄端子（14A），布线（14B）和厚电极（14C）。 不仅端子（14A）和布线（14B）以及埋地导体（12）都通过相同的制造工艺升高。 半导体元件（2）附着到布线基板（1）的电极（14C）上。

公开(公告)号：US20100136803A1

公开(公告)日：2010-06-03

申请号：US12573979

申请日：2009-10-06

申请人： Hidehiro NAKAMURA

发明人： Hidehiro NAKAMURA

IPC分类号： H01R12/00 ,  B32B37/12

CPC分类号： H05K1/142 ,  H05K1/147 ,  H05K3/365 ,  H05K2201/09781 ,  H05K2201/10681 ,  Y10T156/10

摘要： There is provided a wiring board insertion connector having only a small restriction on the structure of a wiring board to be inserted to the connector, having high connection reliability such as high durability against repetitive insertion and pullout, and having a relatively simple structure.The wiring board insertion connector includes: a first substrate; a second substrate; a spacer layer that is located between the first substrate and the second substrate; and openings for accommodating a wiring board at predetermined positions in the spacer layer. The first substrate has a wiring layer, a deformable layer, a rigid layer, and a resin layer formed in this order from the side of the spacer layer. The rigid layer has window portions formed at the regions corresponding to the openings, when seen from a thickness direction of the connector. The wiring layer extends at least to the regions corresponding to the window portions when seen from the thickness direction of the connector, the wiring layer protruding toward opening regions at the window portions.

摘要翻译： 提供了一种布线板插入连接器，其对插入连接器的布线板的结构只有很小的限制，具有高的连续可靠性，例如对重复插入和拔出的高耐久性，并且具有相对简单的结构。 布线板插入连接器包括：第一基板; 第二基板; 位于所述第一基板和所述第二基板之间的间隔层; 以及用于将布线板容纳在间隔层中的预定位置的开口。 第一基板具有布线层，可变形层，刚性层和从间隔层的侧面依次形成的树脂层。 当从连接器的厚度方向看时，刚性层具有形成在与开口对应的区域处的窗口部分。 当从连接器的厚度方向看时，布线层至少延伸到对应于窗口部分的区域，布线层朝窗口部分的开口区域突出。

公开(公告)号：US20100263462A1

公开(公告)日：2010-10-21

申请号：US12762510

申请日：2010-04-19

申请人： Hidehiro NAKAMURA

发明人： Hidehiro NAKAMURA

IPC分类号： H05K1/00 ,  G01D21/00 ,  H01R43/02

CPC分类号： H05K13/00 ,  G01D1/00 ,  G01D15/00 ,  H05K1/028 ,  H05K1/118 ,  H05K3/3447 ,  H05K3/365 ,  H05K3/4602 ,  H05K3/4635 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/09127 ,  H05K2201/09163 ,  H05K2201/09318 ,  H05K2201/0969 ,  H05K2201/10151 ,  H05K2201/10189 ,  H05K2201/10598 ,  H05K2203/061 ,  H05K2203/167

摘要： There is provided a method of manufacturing a concave connector substrate that has high connection accuracy, a low manufacturing cost, and high flexibility in design, can ensure stable repeated use, and significantly improve use convenience.A method of manufacturing a concave connector substrate includes: a step of preparing a guide substrate having a guide/holding region that guides a plate-shaped connector to a connection position and holds the plate-shaped connector at the connection position and a cut portion for removing a section having a shape corresponding to the guide/holding region on at least one side; a step of arranging and aligning two wiring substrates, each having wiring lines and through hole connection portions that are electrically connected to the wiring lines, with both surfaces of the guide substrate, and applying an adhesive to a predetermined region of the guide substrate to bond the wiring substrates to the guide substrate; a step of bending a portion of the wiring substrate toward the inside of the cut portion of the guide substrate and bringing the wiring lines disposed in the bent portion into pressure contact with the inside of the cut portion; and a step of removing a section inside the cut portion to form the guide/holding region.

摘要翻译： 提供了一种制造具有高连接精度，低制造成本和高设计灵活性的凹形连接器基板的方法，可以确保稳定的重复使用，并且显着提高使用方便性。 一种制造凹形连接器基板的方法包括：准备具有引导/保持区域的导向基板的步骤，该导向基板将板状连接器引导到连接位置并将板状连接器保持在连接位置， 在至少一个侧面上移除具有与所述引导/保持区域相对应的形状的部分; 在导向基板的两个表面上布置和对准两个布线基板，每个布线基板具有布线和与布线电连接的通孔连接部分，并且将粘合剂施加到引导基板的预定区域以键合 布线基板到引导基板; 将布线基板的一部分朝向引导基板的切断部的内侧弯曲并使配置在弯曲部的布线与切断部的内部压力接触的步骤; 以及去除切割部分内的部分以形成引导/保持区域的步骤。