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    Solid composition containing lipids from crustaceans
    9.
    发明授权
    Solid composition containing lipids from crustaceans 有权
    含有甲壳动物脂质的固体组合物

    公开(公告)号：US08568819B2

    公开(公告)日：2013-10-29

    申请号：US13120842

    申请日：2009-09-24

    申请人： Kazuhiro Yoshikawa ,  Akihiro Mikajiri

    发明人： Kazuhiro Yoshikawa ,  Akihiro Mikajiri

    IPC分类号： A23D7/00

    CPC分类号： C11B13/00 ,  A23K20/158 ,  A23L17/40 ,  A61K35/612 ,  C11B1/06 ,  Y02W30/74

    摘要： The present invention relates to a method for efficiently extracting and producing lipid components from crustaceans. A method for producing lipids, characterized by obtaining a squeezed liquid by squeezing a whole crustacean or a part thereof, heating the squeezed liquid to a temperature at which proteins contained in the squeezed liquid coagulate, carrying out solid-liquid separation so as to separate the heated squeezed liquid into a solid component that contains lipid components and an aqueous component that contains water-soluble components, washing the resulting solid containing lipids or a dried product thereof with water, dehydrating and/or drying, and then extracting lipids from the solid containing lipids or the dried product thereof.

    摘要翻译： 本发明涉及一种有效提取和生产甲壳类动物脂质成分的方法。 一种生产脂质的方法，其特征在于通过挤压整个甲壳类或其一部分获得挤压液体，将挤压的液体加热到挤压液体中所含的蛋白质凝固的温度，进行固液分离， 加热挤压的液体成为含有脂质组分的固体组分和含有水溶性组分的水性组分，用水洗涤所得固体含有脂质或其干燥产物，脱水和/或干燥，然后从含有 脂类或其干燥产物。

    Wiring substrate and method of manufacturing the same
    10.
    发明授权
    Wiring substrate and method of manufacturing the same 有权
    接线基板及其制造方法

    公开(公告)号：US08148645B2

    公开(公告)日：2012-04-03

    申请号：US12189852

    申请日：2008-08-12

    申请人： Kazuhiro Yoshikawa

    发明人： Kazuhiro Yoshikawa

    IPC分类号： H05K1/16 ,  H05K7/06

    CPC分类号： H05K1/162 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3511 ,  H05K1/113 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09309 ,  H05K2201/09718 ,  H05K2201/10515 ,  H05K2201/10712

    摘要： A wiring substrate and method of forming a wiring substrate. The wiring substrate includes a base substrate, a first resin insulating layer provided on the base substrate and a laminated capacitor formed within the first resin insulating layer. The laminated capacitor includes a plurality of capacitors laminated to each other by adhesive, each capacitor including a first electrode, a second electrode opposing the first electrode and a dielectric layer interposed between the first and second electrodes. A first via conductor electrically connects the first electrodes of the plurality of capacitors to each other, and a second via conductor electrically connects the second electrodes of the plurality of capacitors to each other. A first external terminal electrically connects to the first via conductor, and a second external terminal electrically connects to the second via conductor.

    摘要翻译： 布线基板以及布线基板的形成方法。 布线基板包括基底基板，设置在基底基板上的第一树脂绝缘层和形成在第一树脂绝缘层内的叠层电容器。 层叠电容器包括通过粘合剂彼此层叠的多个电容器，每个电容器包括第一电极，与第一电极相对的第二电极和介于第一和第二电极之间的电介质层。 第一通孔导体将多个电容器的第一电极彼此电连接，并且第二通孔导体将多个电容器的第二电极彼此电连接。 第一外部端子电连接到第一通孔导体，第二外部端子电连接到第二通孔导体。