公开(公告)号：US08613136B2

公开(公告)日：2013-12-24

申请号：US12614576

申请日：2009-11-09

申请人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

发明人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC分类号： H01K3/10

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/0231 ,  H05K1/188 ,  H05K3/382 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

摘要翻译： 通过提供具有第一绝缘层和导电膜的层叠体的方法制造印刷线路板。 通过去除导电膜的至少一部分，在层压体中形成对准标记。 将电子部件放置在基于对准标记确定的位置上设置在第一绝缘层上的粘合剂层上。 在将电子部件封装在第二绝缘层的开口内之后，在基于用于确定电子部件的位置的对准标记确定的位置处形成暴露电子部件的端子的通孔。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

公开(公告)号：US08568819B2

公开(公告)日：2013-10-29

申请号：US13120842

申请日：2009-09-24

申请人： Kazuhiro Yoshikawa ,  Akihiro Mikajiri

发明人： Kazuhiro Yoshikawa ,  Akihiro Mikajiri

IPC分类号： A23D7/00

CPC分类号： C11B13/00 ,  A23K20/158 ,  A23L17/40 ,  A61K35/612 ,  C11B1/06 ,  Y02W30/74

摘要： The present invention relates to a method for efficiently extracting and producing lipid components from crustaceans. A method for producing lipids, characterized by obtaining a squeezed liquid by squeezing a whole crustacean or a part thereof, heating the squeezed liquid to a temperature at which proteins contained in the squeezed liquid coagulate, carrying out solid-liquid separation so as to separate the heated squeezed liquid into a solid component that contains lipid components and an aqueous component that contains water-soluble components, washing the resulting solid containing lipids or a dried product thereof with water, dehydrating and/or drying, and then extracting lipids from the solid containing lipids or the dried product thereof.

摘要翻译： 本发明涉及一种有效提取和生产甲壳类动物脂质成分的方法。 一种生产脂质的方法，其特征在于通过挤压整个甲壳类或其一部分获得挤压液体，将挤压的液体加热到挤压液体中所含的蛋白质凝固的温度，进行固液分离， 加热挤压的液体成为含有脂质组分的固体组分和含有水溶性组分的水性组分，用水洗涤所得固体含有脂质或其干燥产物，脱水和/或干燥，然后从含有 脂类或其干燥产物。

公开(公告)号：US08148645B2

公开(公告)日：2012-04-03

申请号：US12189852

申请日：2008-08-12

申请人： Kazuhiro Yoshikawa

发明人： Kazuhiro Yoshikawa

IPC分类号： H05K1/16 ,  H05K7/06

CPC分类号： H05K1/162 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3511 ,  H05K1/113 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09309 ,  H05K2201/09718 ,  H05K2201/10515 ,  H05K2201/10712

摘要： A wiring substrate and method of forming a wiring substrate. The wiring substrate includes a base substrate, a first resin insulating layer provided on the base substrate and a laminated capacitor formed within the first resin insulating layer. The laminated capacitor includes a plurality of capacitors laminated to each other by adhesive, each capacitor including a first electrode, a second electrode opposing the first electrode and a dielectric layer interposed between the first and second electrodes. A first via conductor electrically connects the first electrodes of the plurality of capacitors to each other, and a second via conductor electrically connects the second electrodes of the plurality of capacitors to each other. A first external terminal electrically connects to the first via conductor, and a second external terminal electrically connects to the second via conductor.

摘要翻译： 布线基板以及布线基板的形成方法。 布线基板包括基底基板，设置在基底基板上的第一树脂绝缘层和形成在第一树脂绝缘层内的叠层电容器。 层叠电容器包括通过粘合剂彼此层叠的多个电容器，每个电容器包括第一电极，与第一电极相对的第二电极和介于第一和第二电极之间的电介质层。 第一通孔导体将多个电容器的第一电极彼此电连接，并且第二通孔导体将多个电容器的第二电极彼此电连接。 第一外部端子电连接到第一通孔导体，第二外部端子电连接到第二通孔导体。

公开(公告)号：US20100043942A1

公开(公告)日：2010-02-25

申请号：US12614576

申请日：2009-11-09

申请人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

发明人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC分类号： B32B38/00 ,  B32B38/10

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/0231 ,  H05K1/188 ,  H05K3/382 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

摘要翻译： 通过提供具有第一绝缘层和导电膜的层叠体的方法制造印刷线路板。 通过去除导电膜的至少一部分，在层压体中形成对准标记。 将电子部件放置在基于对准标记确定的位置上设置在第一绝缘层上的粘合剂层上。 在将电子部件封装在第二绝缘层的开口内之后，在基于用于确定电子部件的位置的对准标记确定的位置处形成暴露电子部件的端子的通孔。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

公开(公告)号：US20090266594A1

公开(公告)日：2009-10-29

申请号：US12189852

申请日：2008-08-12

申请人： Kazuhiro Yoshikawa

发明人： Kazuhiro Yoshikawa

IPC分类号： H05K1/16 ,  H01B13/00

CPC分类号： H05K1/162 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3511 ,  H05K1/113 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09309 ,  H05K2201/09718 ,  H05K2201/10515 ,  H05K2201/10712

摘要： A wiring substrate and method of forming a wiring substrate. The wiring substrate includes a base substrate, a first resin insulating layer provided on the base substrate and a laminated capacitor formed within the first resin insulating layer. The laminated capacitor includes a plurality of capacitors laminated to each other by adhesive, each capacitor including a first electrode, a second electrode opposing the first electrode and a dielectric layer interposed between the first and second electrodes. A first via conductor electrically connects the first electrodes of the plurality of capacitors to each other, and a second via conductor electrically connects the second electrodes of the plurality of capacitors to each other. A first external terminal electrically connects to the first via conductor, and a second external terminal electrically connects to the second via conductor.

摘要翻译： 布线基板以及布线基板的形成方法。 布线基板包括基底基板，设置在基底基板上的第一树脂绝缘层和形成在第一树脂绝缘层内的叠层电容器。 层叠电容器包括通过粘合剂彼此层叠的多个电容器，每个电容器包括第一电极，与第一电极相对的第二电极和介于第一和第二电极之间的电介质层。 第一通孔导体将多个电容器的第一电极彼此电连接，并且第二通孔导体将多个电容器的第二电极彼此电连接。 第一外部端子电连接到第一通孔导体，第二外部端子电连接到第二通孔导体。

公开(公告)号：US20060152001A1

公开(公告)日：2006-07-13

申请号：US10519673

申请日：2003-07-09

申请人： Ryo Matsuhashi ,  Kazuhiro Suetsugu ,  Hideyuki Miyagawa ,  Toshio Kita ,  Kyota Sogabe ,  Kazuhiro Yoshikawa ,  Akihiro Morimoto ,  Jyunji Sato ,  Kunihiko Daido ,  Hisatoshi Akamoto ,  Yoshiki Kimura

发明人： Ryo Matsuhashi ,  Kazuhiro Suetsugu ,  Hideyuki Miyagawa ,  Toshio Kita ,  Kyota Sogabe ,  Kazuhiro Yoshikawa ,  Akihiro Morimoto ,  Jyunji Sato ,  Kunihiko Daido ,  Hisatoshi Akamoto ,  Yoshiki Kimura

IPC分类号： F16L19/06

CPC分类号： C22C38/46 ,  C22C38/001 ,  C22C38/42 ,  C22C38/44 ,  F16J15/102 ,  F16K7/123 ,  F16K27/0236 ,  F16K31/122 ,  F16L19/0218 ,  F16L19/103 ,  F16L58/184

摘要： A specified metal member included among the components of a valve, coupling or like fluid handling part for use in piping and fluid control devices is made of an alloy comprising, in % by weight, 0.001 to 0.01% of C, up to 5% of Si, up to 2% of Mn, up to 0.03% of P, up to 100 ppm of S, up to 50 ppm of O, 18 to 25% of Cr, 15 to 25% of Ni, 4.5 to 7.0% of Mo, 0.5 to 3.0% of Cu, 0.1 to 0.3% of N, and the balance substantially Fe and other inevitable impurities, the alloy having a CRI (crevice corrosion resistance index) value in the range of 40≦CRI≦55, as determined from the expression CRI=[Cr]+4×[Mo]+30×[N] wherein the amount of alloy components present in combination in the alloy to ensure crevice corrosion resistance are expressed in % by weight.

摘要翻译： 包括在用于管道和流体控制装置的阀，联接器或类似流体处理部件的部件中的特定金属构件由合金制成，其包含以重量％计的0.001至0.01％的C，至多5％的 Si，高达2％的Mn，高达0.03％的P，高达100ppm的S，至多50ppm的O，18至25％的Cr，15至25％的Ni，4.5至7.0％的Mo ，0.5〜3.0％的Cu，0.1〜0.3％的N，余量基本上为Fe和其他不可避免的杂质，该合金的CRI（缝隙耐腐蚀指数）值在40 <= CRI <= 55的范围内，为 由CrI = [Cr] + 4x [Mo] + 30x [N]的表达式确定，其中合金中组合存在的合金组分的量确保耐缝隙腐蚀性以重量％表示。

公开(公告)号：US20060102868A1

公开(公告)日：2006-05-18

申请号：US10519675

申请日：2003-07-09

申请人： Ryo Matsuhashi ,  Kazuhiro Suetsugu ,  Hideyuki Miyagawa ,  Toshio Kita ,  Kyota Sogabe ,  Kazuhiro Yoshikawa ,  Akihiro Morimoto ,  Jyunji Sato ,  Kunihiko Daido ,  Masahiko Sogao ,  Yoshiaki Chikaike

发明人： Ryo Matsuhashi ,  Kazuhiro Suetsugu ,  Hideyuki Miyagawa ,  Toshio Kita ,  Kyota Sogabe ,  Kazuhiro Yoshikawa ,  Akihiro Morimoto ,  Jyunji Sato ,  Kunihiko Daido ,  Masahiko Sogao ,  Yoshiaki Chikaike

IPC分类号： F16K25/00

CPC分类号： F16K27/0236 ,  C22C38/001 ,  C22C38/42 ,  C22C38/44 ,  F16K27/00 ,  F16L19/103 ,  F16L58/184

摘要： A specified metal member (e.g., a bolt) 5 included among a plurality of components 2, 3, 4, 5, 6 of a fluid handling part and having a surface exposed on an exterior of the fluid handling part is made of an alloy comprising, in % by weight, 0.001 to 0.01% of C, up to 5% of Si, up to 2% of Mn, up to 0.03% of P, up to 100 ppm of S, up to 50 ppm of O, 18 to 25% of Cr, 15 to 25% of Ni, 4.5 to 7.0% of Mo, 0.5 to 3.0% of Cu, 0.1 to 0.3% of N, and the balance substantially Fe and other inevitable impurities.

摘要翻译： 包括在流体处理部分的多个部件2,3,4,5,6中并且具有暴露在流体处理部分的外部上的表面的特定金属部件（例如，螺栓）5由合金制成，该合金包括 ，以重量％计，C：0.001〜0.01％，Si：5％以下，Mn：0.2％以下，P：0.03以下，S：100ppm以下，O：18〜 25％的Cr，15〜25％的Ni，4.5〜7.0％的Mo，0.5〜3.0％的Cu，0.1〜0.3％的N，余量基本上是Fe和其他不可避免的杂质。

公开(公告)号：US20060091672A1

公开(公告)日：2006-05-04

申请号：US10519672

申请日：2003-07-09

申请人： Ryo Matsuhashi ,  Kazuhiro Suetsugu ,  Hideyuki Miyagawa ,  Toshio Kita ,  Kyota Sogabe ,  Kazuhiro Yoshikawa ,  Akihiro Morimoto ,  Jyunji Sato ,  Kunihiko Shimomura ,  Yoshinori Shimomura ,  Takayasu Nakahama

发明人： Ryo Matsuhashi ,  Kazuhiro Suetsugu ,  Hideyuki Miyagawa ,  Toshio Kita ,  Kyota Sogabe ,  Kazuhiro Yoshikawa ,  Akihiro Morimoto ,  Jyunji Sato ,  Kunihiko Shimomura ,  Yoshinori Shimomura ,  Takayasu Nakahama

IPC分类号： F16L37/00

CPC分类号： F16L19/061 ,  C22C38/001 ,  C22C38/42 ,  C22C38/44 ,  F16L19/08

摘要： A pipe coupling 30 comprises a tubular body 31 for a pipe 32 to be inserted in through the rear end thereof, a front ring 33 and a back ring 34 to be fitted around the pipe 32 projecting from the rear end of the body 31, and a cap nut 35 for tightening up the front and back rings 33, 34 to fix the pipe 32 to the body 31. The back ring 34 is made of an alloy comprising, in % by weight, 0.001 to 0.01% of C, up to 5% of Si, up to 2% of Mn, up to 0.03% of P, up to 100 ppm of S, up to 50 ppm of O, 18 to 25% of Cr, 15 to 25% of Ni, 4.5 to 7.0% of Mo, 0.5 to 3.0% of Cu, 0.1 to 0.3% of N, and the balance substantially Fe and other inevitable impurities.

摘要翻译： 管接头30包括用于管32的管状体31，其通过其后端插入，前环33和后环34围绕从主体31的后端突出的管32配合，以及 用于紧固前后环33,34以将管32固定到主体31的盖螺母35。 后环34由以重量％计含有0.001至0.01％C，至多5％Si，至多2％Mn，至多0.03％P，至多100ppm S ，高达50ppm的O，18〜25％的Cr，15〜25％的Ni，4.5〜7.0％的Mo，0.5〜3.0％的Cu，0.1〜0.3％的N，余量基本上是Fe等 不可避免的杂质。

公开(公告)号：US5678803A

公开(公告)日：1997-10-21

申请号：US684695

申请日：1996-07-22

申请人： Tsutomu Shinohara ,  Nobukazu Ikeda ,  Kazuhiro Yoshikawa ,  Tetsuya Kojima

发明人： Tsutomu Shinohara ,  Nobukazu Ikeda ,  Kazuhiro Yoshikawa ,  Tetsuya Kojima

IPC分类号： F16K7/17 ,  F16K7/14 ,  F16K25/00 ,  F16K41/10 ,  F16K41/12 ,  F16K31/00

CPC分类号： F16K7/14 ,  F16K25/005 ,  F16K41/10 ,  F16K41/12

摘要： Flaws in a fluid controller caused by nonmetallic inclusions in material during machining of a contact surface of a valve seat are prevented by forming the valve seat of corrosion-resistant high-cleanliness material. The valve seat of the fluid controller is formed from corrosion-resistant alloy with 0.05% or less cleanliness and containing in weight ratio 12.90-15.00% Ni, 16.50-18.00% Cr, 2.00-3.00% Mo, 0.02% or less C, 0.30% or less Si, 0.40% or less Mn, 0.03% or less P, 0.003% or less S, 0.25% or less Cu, and 0.01% or less Al. Fluid leakage is almost completely prevented (100%) by such a valve seat.

摘要翻译： 通过形成耐腐蚀的高清洁度材料的阀座来防止在阀座的接触表面的加工期间在材料中的非金属夹杂物引起的流体控制器中的裂纹。 流体控制器的阀座由具有0.05％以下清洁度的耐腐蚀合金形成，重量比为12.90-15.00％Ni，16.50-18.00％Cr，2.00-3.00％Mo，0.02％以下C，0.30 Si：0.40％以下，0.03％以下，P：0.003％以下，Cu：0.25％以下，Al：0.01％以下。 通过这种阀座几乎可以完全防止流体泄漏（100％）。

公开(公告)号：US20150140690A1

公开(公告)日：2015-05-21

申请号：US14564227

申请日：2014-12-09

申请人： Takeshi Sakai ,  Tatsuro Yoshida ,  Kazuhiro Yoshikawa ,  Shigetoshi Sugawa

发明人： Takeshi Sakai ,  Tatsuro Yoshida ,  Kazuhiro Yoshikawa ,  Shigetoshi Sugawa

IPC分类号： H01L21/306 ,  H01L21/66

CPC分类号： H01L21/30604 ,  H01L21/6708 ,  H01L22/26 ,  H01L27/1464 ,  H01L27/14687

摘要： There is provided an etching method for a semiconductor product. The semiconductor product having, on a substrate, an SiO2 layer, and an Si layer with a free surface and directly stacked on the SiO2 layer is prepared. The Si layer is etched. Etching is performed while supplying an etching solution from a side of the free surface using high-concentration fluonitric acid as the etching solution, and etching is continued by switching to fluonitric acid having a concentration lower than that of the fluonitric acid immediately before or after at least part of a surface of the SiO2 layer immediately under the Si layer is exposed.

摘要翻译： 提供了半导体产品的蚀刻方法。 制备在衬底上具有SiO 2层和具有自由表面并直接层叠在SiO 2层上的Si层的半导体产品。 Si层被蚀刻。 使用高浓度氟酸作为蚀刻溶液从自由表面侧供给蚀刻溶液进行蚀刻，并且在紧接着在之前或之后切换到浓度低于荧光酮浓度的氟硝酸继续蚀刻 露出Si层正下方的SiO 2层表面的最少部分。