公开(公告)号：US20090205859A1

公开(公告)日：2009-08-20

申请号：US12351929

申请日：2009-01-12

申请人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

发明人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC分类号： H05K1/16 ,  H05K3/30

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/0231 ,  H05K1/188 ,  H05K3/382 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

摘要翻译： 通过提供具有第一绝缘层和导电膜的层叠体的方法制造印刷线路板。 通过去除导电膜的至少一部分，在层压体中形成对准标记。 将电子部件放置在基于对准标记确定的位置上设置在第一绝缘层上的粘合剂层上。 在将电子部件封装在第二绝缘层的开口内之后，在基于用于确定电子部件的位置的对准标记确定的位置处形成暴露电子部件的端子的通孔。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

公开(公告)号：US20090205202A1

公开(公告)日：2009-08-20

申请号：US12351954

申请日：2009-01-12

申请人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

发明人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83132 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K1/036 ,  H05K1/188 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0352 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49165

摘要： A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

摘要翻译： 通过提供具有第一绝缘层，第二绝缘层和导电膜的基底基板的方法制造印刷电路板。 在基于对准标记确定的位置处将电子部件放置在第一绝缘层上。 在将电子部件封闭在第二绝缘层的开口内之后，在基于对准标记确定的位置处形成暴露电子部件的端子的通孔，该位置用于确定电子部件的位置。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

公开(公告)号：US07935893B2

公开(公告)日：2011-05-03

申请号：US12351929

申请日：2009-01-12

申请人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

发明人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC分类号： H05K1/16

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/0231 ,  H05K1/188 ,  H05K3/382 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

摘要翻译： 通过提供具有第一绝缘层和导电膜的层叠体的方法制造印刷线路板。 通过去除导电膜的至少一部分，在层压体中形成对准标记。 将电子部件放置在基于对准标记确定的位置上设置在第一绝缘层上的粘合剂层上。 在将电子部件封装在第二绝缘层的开口内之后，在基于用于确定电子部件的位置的对准标记确定的位置处形成暴露电子部件的端子的通孔。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

公开(公告)号：US08613136B2

公开(公告)日：2013-12-24

申请号：US12614576

申请日：2009-11-09

申请人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

发明人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC分类号： H01K3/10

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/0231 ,  H05K1/188 ,  H05K3/382 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

摘要翻译： 通过提供具有第一绝缘层和导电膜的层叠体的方法制造印刷线路板。 通过去除导电膜的至少一部分，在层压体中形成对准标记。 将电子部件放置在基于对准标记确定的位置上设置在第一绝缘层上的粘合剂层上。 在将电子部件封装在第二绝缘层的开口内之后，在基于用于确定电子部件的位置的对准标记确定的位置处形成暴露电子部件的端子的通孔。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

公开(公告)号：US20100043942A1

公开(公告)日：2010-02-25

申请号：US12614576

申请日：2009-11-09

申请人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

发明人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC分类号： B32B38/00 ,  B32B38/10

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/0231 ,  H05K1/188 ,  H05K3/382 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A printed wiring board is manufactured by a method in which a laminate body having a first insulation layer and a conductive film is provided. An alignment mark is formed in the laminate body by removing at least a portion of the conductive film. An electronic component is placed on an adhesive layer provided on the first insulation layer at a position determined based on the alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

摘要翻译： 通过提供具有第一绝缘层和导电膜的层叠体的方法制造印刷线路板。 通过去除导电膜的至少一部分，在层压体中形成对准标记。 将电子部件放置在基于对准标记确定的位置上设置在第一绝缘层上的粘合剂层上。 在将电子部件封装在第二绝缘层的开口内之后，在基于用于确定电子部件的位置的对准标记确定的位置处形成暴露电子部件的端子的通孔。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

公开(公告)号：US08336205B2

公开(公告)日：2012-12-25

申请号：US13209052

申请日：2011-08-12

申请人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

发明人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC分类号： H01K3/10

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83132 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K1/036 ,  H05K1/188 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0352 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49165

摘要： A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

摘要翻译： 通过提供具有第一绝缘层，第二绝缘层和导电膜的基底基板的方法制造印刷线路板。 在基于对准标记确定的位置处将电子部件放置在第一绝缘层上。 在将电子部件封闭在第二绝缘层的开口内之后，在基于对准标记确定的位置处形成暴露电子部件的端子的通孔，该位置用于确定电子部件的位置。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

公开(公告)号：US20110289773A1

公开(公告)日：2011-12-01

申请号：US13209052

申请日：2011-08-12

申请人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

发明人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83132 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K1/036 ,  H05K1/188 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0352 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49165

摘要： A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

摘要翻译： 通过提供具有第一绝缘层，第二绝缘层和导电膜的基底基板的方法制造印刷线路板。 在基于对准标记确定的位置处将电子部件放置在第一绝缘层上。 在将电子部件封闭在第二绝缘层的开口内之后，在基于对准标记确定的位置处形成暴露电子部件的端子的通孔，该位置用于确定电子部件的位置。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

公开(公告)号：US08024858B2

公开(公告)日：2011-09-27

申请号：US12351954

申请日：2009-01-12

申请人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

发明人： Hironori Tanaka ,  Kazuhiro Yoshikawa ,  Naoaki Fujii ,  Atsunari Yamashita

IPC分类号： H01K3/10

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/54426 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/83132 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K1/036 ,  H05K1/188 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4611 ,  H05K2201/0352 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0969 ,  H05K2201/09918 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49146 ,  Y10T29/49165

摘要： A printed wiring board is manufactured by a method in which a base substrate having a first insulation layer, a second insulation layer, and a conductive film is provided. An electronic component is placed on the first insulation layer at a position determined based on an alignment mark. After the electronic component is enclosed inside an opening of the second insulation layer, a via hole exposing a terminal of the electronic component is formed at a position determined based on the alignment mark, which is used to determine the position of the electronic component. A via conductor is formed in the via hole, and a conductive layer is formed on the conductive film and patterned to form a conductive circuit connected to the via conductor.

摘要翻译： 通过提供具有第一绝缘层，第二绝缘层和导电膜的基底基板的方法制造印刷线路板。 在基于对准标记确定的位置处将电子部件放置在第一绝缘层上。 在将电子部件封闭在第二绝缘层的开口内之后，在基于对准标记确定的位置处形成暴露电子部件的端子的通孔，该位置用于确定电子部件的位置。 通孔导体形成在通孔中，导电层形成在导电膜上并被图案化以形成连接到通孔导体的导电电路。

公开(公告)号：US08568819B2

公开(公告)日：2013-10-29

申请号：US13120842

申请日：2009-09-24

申请人： Kazuhiro Yoshikawa ,  Akihiro Mikajiri

发明人： Kazuhiro Yoshikawa ,  Akihiro Mikajiri

IPC分类号： A23D7/00

CPC分类号： C11B13/00 ,  A23K20/158 ,  A23L17/40 ,  A61K35/612 ,  C11B1/06 ,  Y02W30/74

摘要： The present invention relates to a method for efficiently extracting and producing lipid components from crustaceans. A method for producing lipids, characterized by obtaining a squeezed liquid by squeezing a whole crustacean or a part thereof, heating the squeezed liquid to a temperature at which proteins contained in the squeezed liquid coagulate, carrying out solid-liquid separation so as to separate the heated squeezed liquid into a solid component that contains lipid components and an aqueous component that contains water-soluble components, washing the resulting solid containing lipids or a dried product thereof with water, dehydrating and/or drying, and then extracting lipids from the solid containing lipids or the dried product thereof.

摘要翻译： 本发明涉及一种有效提取和生产甲壳类动物脂质成分的方法。 一种生产脂质的方法，其特征在于通过挤压整个甲壳类或其一部分获得挤压液体，将挤压的液体加热到挤压液体中所含的蛋白质凝固的温度，进行固液分离， 加热挤压的液体成为含有脂质组分的固体组分和含有水溶性组分的水性组分，用水洗涤所得固体含有脂质或其干燥产物，脱水和/或干燥，然后从含有 脂类或其干燥产物。

公开(公告)号：US08148645B2

公开(公告)日：2012-04-03

申请号：US12189852

申请日：2008-08-12

申请人： Kazuhiro Yoshikawa

发明人： Kazuhiro Yoshikawa

IPC分类号： H05K1/16 ,  H05K7/06

CPC分类号： H05K1/162 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3511 ,  H05K1/113 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09309 ,  H05K2201/09718 ,  H05K2201/10515 ,  H05K2201/10712

摘要： A wiring substrate and method of forming a wiring substrate. The wiring substrate includes a base substrate, a first resin insulating layer provided on the base substrate and a laminated capacitor formed within the first resin insulating layer. The laminated capacitor includes a plurality of capacitors laminated to each other by adhesive, each capacitor including a first electrode, a second electrode opposing the first electrode and a dielectric layer interposed between the first and second electrodes. A first via conductor electrically connects the first electrodes of the plurality of capacitors to each other, and a second via conductor electrically connects the second electrodes of the plurality of capacitors to each other. A first external terminal electrically connects to the first via conductor, and a second external terminal electrically connects to the second via conductor.

摘要翻译： 布线基板以及布线基板的形成方法。 布线基板包括基底基板，设置在基底基板上的第一树脂绝缘层和形成在第一树脂绝缘层内的叠层电容器。 层叠电容器包括通过粘合剂彼此层叠的多个电容器，每个电容器包括第一电极，与第一电极相对的第二电极和介于第一和第二电极之间的电介质层。 第一通孔导体将多个电容器的第一电极彼此电连接，并且第二通孔导体将多个电容器的第二电极彼此电连接。 第一外部端子电连接到第一通孔导体，第二外部端子电连接到第二通孔导体。