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14 条记录 (耗时 0.027 秒)

    Electronically integrated vehicle structure
    2.
    发明授权
    Electronically integrated vehicle structure 有权
    电子集成车辆结构

    公开(公告)号：US07102888B2

    公开(公告)日：2006-09-05

    申请号：US10828396

    申请日：2004-04-20

    申请人： Andrew Z. Glovatsky ,  Jay D. Baker ,  Richard Keith McMillan ,  Myron Lemecha ,  Daniel Roger Vander Sluis

    发明人： Andrew Z. Glovatsky ,  Jay D. Baker ,  Richard Keith McMillan ,  Myron Lemecha ,  Daniel Roger Vander Sluis

    IPC分类号： H05K7/20 ,  B62D25/14

    CPC分类号： B60R16/0207

    摘要： An integrated vehicle structure includes an electronic site in a plastic support structure. The electronic site has a flexible substrate with electronic components mounted thereon. The plastic support structure defines a plastic mounting surface which includes a plurality of elongated ribs projecting from the plastic support structure. Each of the ribs have a side edge forming a portion of the plastic mounting surface. The flexible substrate is mounted to the plastic mounting surface, and a plurality of air flow passageways are defined by adjacent ribs in the flexible substrate. A method support structure may also be provided which defines a metal mounting surface. One or more electronic sides may be attached to the metal and plastic mounting surfaces.

    摘要翻译： 集成车辆结构包括塑料支撑结构中的电子位置。 该电子站点具有安装在其上的电子部件的柔性基板。 塑料支撑结构限定了塑料安装表面，其包括从塑料支撑结构突出的多个细长肋。 每个肋具有形成塑料安装表面的一部分的侧边缘。 柔性基板安装到塑料安装表面，并且多个气流通道由柔性基板中的相邻肋限定。 也可以提供限定金属安装表面的方法支撑结构。 一个或多个电子侧可以附接到金属和塑料安装表面。

    Flexible circuit board splice clamp
    5.
    发明授权
    Flexible circuit board splice clamp 失效
    柔性电路板接头夹

    公开(公告)号：US06299469B1

    公开(公告)日：2001-10-09

    申请号：US09553204

    申请日：2000-04-20

    申请人： Andrew Zachary Glovatsky ,  Pawel Kalinowski ,  Richard Keith McMillan

    发明人： Andrew Zachary Glovatsky ,  Pawel Kalinowski ,  Richard Keith McMillan

    IPC分类号： H01R1362

    CPC分类号： F02M35/10144 ,  F02D9/02 ,  F02D41/187 ,  F02D41/3005 ,  F02D2200/0404 ,  F02D2400/18 ,  F02D2400/21 ,  F02M35/10019 ,  F02M35/10111 ,  F02M35/10242 ,  F02M35/10249 ,  F02M35/10321 ,  F02P3/02 ,  F05C2225/08 ,  G01F1/684 ,  H01R12/616 ,  H01R13/26 ,  H05K1/189

    摘要： Disclosed herein is a method and apparatus for splicing flexible circuit boards, particularly those having one or more flexible strip extensions with conductor runs. The splice clamp of the present invention has two hinged plates that clamp over unconnected ends of two flexible circuit board segments. The splice clamp includes alignment guides for aligning the segments in the clamp so that one or more jumpers contact and provide an electrical bridge between the conductors of the segments when the plates are clamped together. The jumpers contact conductive pads of larger size than the conductor runs to ensure electrical coupling between the flexible circuit board segments. The jumpers may have pointed tips that cut through insulation. The clamp includes flexible clasps on one plate that engage with catch surfaces on the other plate to lock the flexible circuit board segments spliced together.

    摘要翻译： 本文公开了一种用于拼接柔性电路板的方法和装置，特别是具有一个或多个具有导体线的柔性带延伸部的电路板。 本发明的接头夹具具有两个铰接板，其夹紧两个柔性电路板段的未连接端。 接头夹具包括用于对准夹具中的段的对准引导件，使得当板被夹在一起时，一个或多个跳线接触并且在段的导体之间提供电桥。 跳线接触比导体运行更大尺寸的导电焊盘，以确保柔性电路板段之间的电气耦合。 跳线可能有尖端的切口穿过绝缘。 夹具包括在一个板上的柔性扣环，其与另一个板上的卡扣表面接合，以将拼接在一起的柔性电路板段锁定。

    Anti-bridging solder ball collection zones
    8.
    发明授权
    Anti-bridging solder ball collection zones 失效
    抗桥接焊球收集区

    公开(公告)号：US06316736B1

    公开(公告)日：2001-11-13

    申请号：US09092821

    申请日：1998-06-08

    申请人： Vivek Amir Jairazbhoy ,  Richard Keith McMillan

    发明人： Vivek Amir Jairazbhoy ,  Richard Keith McMillan

    IPC分类号： H01R909

    CPC分类号： H05K3/3442 ,  H01L2224/10175 ,  H01L2924/384 ,  H01L2924/3841 ,  H05K1/111 ,  H05K3/3452 ,  H05K2201/0939 ,  H05K2201/0989 ,  H05K2201/10636 ,  H05K2201/10689 ,  Y02P70/611 ,  Y02P70/613

    摘要： There is disclosed herein a printed circuit board (PCB) having improved resistance against solder bridging and component decentering/tombstoning. The printed circuit board (PCB) includes a substrate 10 having a top surface 12; at least two mounting pads 14 disposed on the top surface in matched relation with terminations 26 of an electronic component 24; and a solder mask 16 disposed on the top surface and having at least two apertures 18 therethrough, wherein each aperture generally conforms in shape with and is arranged about a respective one of the mounting pads 14. Each aperture 18 has at least one inner aperture edge 22i generally within a projected footprint F of the electronic component and at least one outer aperture edge 22o generally outside the footprint F. Each aperture 18 includes a notch 20 in one or more of the at least one outer aperture edge 22o, wherein each notch 20 extends generally outward from its respective mounting pad 14. The notch 20 provides a reservoir in the solder mask aperture 18 about each pad 14, into which flux, other solder paste effluents, and solder balls may be channeled and remain contained.

    摘要翻译： 这里公开了具有改进的抗焊料桥接和元件偏心/墓碑的电阻的印刷电路板（PCB）。 印刷电路板（PCB）包括具有顶面12的基板10; 至少两个安装焊盘14，其配置在与电子部件24的端子26相匹配的顶表面上; 以及设置在顶表面上并且具有穿过其中的至少两个孔18的焊接掩模16，其中每个孔基本上与形状相配合并围绕相应的一个安装焊盘14布置。每个孔18具有至少一个内孔边缘 22i通常在电子部件的投影占地面积F内和通常在封面F外部的至少一个外部孔边缘22o中。每个孔口18包括位于至少一个外部孔口边缘22o中的一个或多个中的凹口20，其中每个凹口20 凹槽20围绕每个焊盘14在焊料掩模孔18中提供储存器，焊剂，其它焊膏流出物和焊球可以被引导并保持在其中。