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    Methods of forming three-dimensional structures having reduced stress and/or curvature
    4.
    发明授权
    Methods of forming three-dimensional structures having reduced stress and/or curvature 有权
    形成具有减小的应力和/或曲率的三维结构的方法

    公开(公告)号：US09540233B2

    公开(公告)日：2017-01-10

    申请号：US14194564

    申请日：2014-02-28

    Applicant: Microfabrica Inc.

    Inventor： Ananda H. Kumar ,  Jorge S. Albarran ,  Adam L. Cohen ,  Kieun Kim ,  Michael S. Lockard ,  Uri Frodis ,  Dennis R. Smalley

    IPC: B81C1/00 ,  C25D5/02

    CPC classification number: B81C1/00666 ,  C25D5/022

    Abstract: Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.

    Abstract translation: 用于生产单层或多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层包括当结构被释放时减少应力和/或曲率失真的操作 牺牲材料，其在形成期间包围它，并且可能当从其形成的基底释放时。 呈现了六个主要实施例的组，它们分为十一个主要实施例。 一些实施例尝试去除应力以最小化失真，而另一些实施例试图平衡应力以最小化失真。

    Counterfeiting deterrent and security devices, systems and methods
    5.
    发明授权
    Counterfeiting deterrent and security devices, systems and methods 有权
    假冒威慑和安全装置，系统和方法

    公开(公告)号：US09290854B2

    公开(公告)日：2016-03-22

    申请号：US14333458

    申请日：2014-07-16

    Applicant: MICROFABRICA INC.

    Inventor： Gregory P. Schmitz ,  Michael S. Lockard ,  Ming-Ting Wu ,  Eric C. Miller ,  Adam L. Cohen

    IPC: G06F19/00 ,  C25D1/00

    CPC classification number: C25D1/003 ,  B32B15/01 ,  B33Y10/00 ,  B33Y40/00 ,  B33Y70/00 ,  B33Y80/00 ,  C25D1/08 ,  C25D5/022 ,  C25D5/48 ,  C25D7/005

    Abstract: A counterfeiting deterrent device according to one implementation of the disclosure includes a plurality of layers formed by an additive process. Each of the layers may have a thickness of less than 100 microns. At least one of the layers has a series of indentations formed in an outer edge of the layer such that the indentations can be observed to verify that the device originated from a predetermined source. According to another implementation, a counterfeiting deterrent device includes at least one raised layer having outer edges in the shape of a logo. A light source is configured and arranged to shine a light through a slit in a substrate layer of the device and past an intermediate layer to light up the outer edge of the raised layer. The layers of the device are formed by an additive process and have a thickness of less than 100 microns each.

    Abstract translation: 根据本公开的一个实施方式的防伪装置包括通过添加过程形成的多个层。 每个层可以具有小于100微米的厚度。 层中的至少一个具有形成在层的外边缘中的一系列凹痕，使得可以观察到凹痕以验证装置源自预定源。 根据另一个实施方案，一种防伪装置包括至少一个具有标志形状的外边缘的凸起层。 光源被配置和布置成将光照射穿过设备的基底层中的狭缝并且经过中间层以照亮凸起层的外边缘。 装置的层通过添加工艺形成，并且具有小于每个100微米的厚度。

    Methods for Fabricating Metal Structures Incorporating Dielectric Sheets
    6.
    发明申请
    Methods for Fabricating Metal Structures Incorporating Dielectric Sheets 审中-公开
    制造介质片金属结构的方法

    公开(公告)号：US20150307997A1

    公开(公告)日：2015-10-29

    申请号：US14675431

    申请日：2015-03-31

    Applicant: Microfabrica Inc.

    Inventor： Michael S. Lockard ,  Adam L. Cohen ,  Dennis R. Smalley ,  Willa M. Larsen ,  Richard T. Chen

    IPC: C23C28/00 ,  C25D5/02 ,  C23C18/16 ,  C23F17/00 ,  C25D5/48 ,  C25D5/10

    CPC classification number: C25D5/022 ,  B81C1/00373 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/165 ,  C23C18/1657 ,  C23C18/1689 ,  C23C18/22 ,  C25D1/003 ,  C25D5/10 ,  C25D5/48

    Abstract: Embodiments of the present invention provide mesoscale or microscale three-dimensional structures (e.g. components, device, and the like). Embodiments relate to one or more of (1) the formation of such structures which incorporate dielectric material and/or wherein seed layer material used to allow deposition over dielectric material is removed via planarization operations; (2) the formation of such structures wherein masks used for at least some selective patterning operations are obtained through transfer plating of masking material to a surface of a substrate or previously formed layer, and/or (3) the formation of such structures wherein masks used for forming at least portions of some layers are patterned on the build surface directly from data representing the mask configuration, e.g. in some embodiments mask patterning is achieved by selectively dispensing material via a computer controlled inkjet nozzle or array or via a computer controlled extrusion device.

    Abstract translation: 本发明的实施例提供中尺度或微尺寸的三维结构（例如部件，装置等）。 实施例涉及以下一个或多个（1）形成这种结合电介质材料的结构和/或其中用于允许在电介质材料上沉积的种子层材料通过平面化操作去除; （2）形成这样的结构，其中用于至少一些选择性图案化操作的掩模通过将掩模材料转移到衬底或先前形成的层的表面获得，和/或（3）形成这样的结构，其中掩模 用于形成至少部分一些层的图案直接来自表示掩模配置的数据在构建表面上图案化，例如 在一些实施例中，通过经由计算机控制的喷墨喷嘴或阵列或经由计算机控制的挤出装置选择性地分配材料来实现掩模图案化。

    Electrochemical Fabrication Method Including Elastic Joining of Structures
    7.
    发明申请
    Electrochemical Fabrication Method Including Elastic Joining of Structures 有权
    包括结构弹性连接的电化学制造方法

    公开(公告)号：US20140239541A1

    公开(公告)日：2014-08-28

    申请号：US14194214

    申请日：2014-02-28

    Applicant: Microfabrica Inc.

    Inventor： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard ,  Dennis R. Smalley

    IPC: B29C65/56

    CPC classification number: B29C65/56 ,  B33Y10/00 ,  C25D5/02 ,  Y10T29/49885

    Abstract: Forming multi-layer 3D structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer 3D structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other element and wherein during normal use the first and second elements are configured relative to one another so that the loading region of the second element is not accessible to the retention region of the first element.

    Abstract translation: 形成多层3D结构，其涉及至少两个结构元件的接合，其中至少一个结构元件形成为多层3D结构，其中通过以下之一进行接合：（1）弹性变形和弹性恢复，（2 ）至少一个元件的初始部分相对于所述至少一个元件的另一部分的相对变形，直到所述至少两个元件处于期望的保持位置，之后所述变形被减少或消除，或者（3）移动保持 一个元件的区域进入到另一个元件的保持区域中，没有任何一个元件的变形，沿着包括另一个元件的加载区域的路径，并且其中在正常使用期间，第一和第二元件相对于彼此配置，使得负载 第二元件的区域不能被第一元件的保持区域访问。

    Buckling beam probe arrays and methods for making such arrays including forming probes with lateral positions matching guide plate hole positions
    9.
    发明授权
    Buckling beam probe arrays and methods for making such arrays including forming probes with lateral positions matching guide plate hole positions 有权

    公开(公告)号：US11821918B1

    公开(公告)日：2023-11-21

    申请号：US17240962

    申请日：2021-04-26

    Applicant: Microfabrica Inc.

    Inventor： Michael S. Lockard ,  Stefano Felici ,  Uri Frodis ,  Dennis R. Smalley

    IPC: G01R1/073 ,  G01R1/067

    CPC classification number: G01R1/06744 ,  G01R1/06761 ,  G01R1/07357

    Abstract: Embodiments are directed to the formation of buckling beam probe arrays having MEMS probes that are engaged with guide plates during formation or after formation of the probes while the probes are held in the array configuration in which they were formed. In other embodiments, probes may be formed in, or laterally aligned with, guide plate through holes. Guide plate engagement may occur by longitudinally locating guide plates on probes that are partially formed or fully formed with exposed ends, by forming probes within guide plate through holes, by forming guide plates around probes, or forming guide plates in lateral alignment with arrayed probes and then longitudinally engaging the probes and the through holes of the guide plates. Final arrays may include probes and a substrate to which the probes are bonded along with one or more guide plates while in other embodiments final arrays may include probes held by a plurality of guide plates (e.g. 2, 3, 4 or even more guide plates) with aligned or laterally shifted hole patterns.

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