公开(公告)号：US20220158061A1

公开(公告)日：2022-05-19

申请号：US17588882

申请日：2022-01-31

Applicant: NICHIA CORPORATION

Inventor： Masato FUJITOMO ,  Hiroto TAMAKI ,  Shinji NISHIJIMA ,  Yuichiro TANDA ,  Tomohide MIKI

IPC: H01L33/62 ,  H01L23/00 ,  H01L33/48 ,  H01L31/0203 ,  H01L31/02 ,  H01L33/52

Abstract: A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

公开(公告)号：US20180069159A1

公开(公告)日：2018-03-08

申请号：US15805402

申请日：2017-11-07

Applicant: NICHIA CORPORATION

Inventor： Yuta OKA ,  Hiroto TAMAKI

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/50 ,  H01L33/54

CPC classification number: H01L33/486 ,  H01L33/502 ,  H01L33/54 ,  H01L33/60

Abstract: A light emitting device includes a mounting board, a light emitting element, first and second light reflecting members, a light transmissive member and a sealing member. The first light reflecting member surrounds a lateral surface of the light emitting element while a top surface of the light emitting element is exposed from the first light reflecting member. The second light reflecting member surrounds an outer periphery of the light emitting element in a plan view. The second light reflecting member is in contact with the first light reflecting member with at least a part of the second light reflecting member being positioned higher than the first light reflecting member. The light transmissive member is disposed inside the second light reflecting member. The light transmissive member includes a wavelength conversion substance. The sealing member covers the first and second light reflecting members and the light transmissive member.

公开(公告)号：US20170229624A1

公开(公告)日：2017-08-10

申请号：US15495822

申请日：2017-04-24

Applicant: NICHIA CORPORATION

Inventor： Suguru BEPPU ,  Yoichi BANDO ,  Hiroto TAMAKI ,  Takuya NAKABAYASHI

IPC: H01L33/60 ,  H01L33/50

CPC classification number: H01L33/60 ,  H01L33/50 ,  H01L2224/73253 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/0058

Abstract: A light emitting device includes a semiconductor light emitting element; and a light reflective member having a multilayer structure and covering the side faces of the semiconductor light emitting element. The light reflective member includes: a first layer disposed on an inner, semiconductor light emitting element side, the first layer comprising a light-transmissive resin containing a light reflective substance, and a second layer disposed in contact with an outer side of the first layer, the second layer comprising a light-transmissive resin containing the light reflective substance at a lower content than that of the first layer.

公开(公告)号：US20170098742A1

公开(公告)日：2017-04-06

申请号：US15383711

申请日：2016-12-19

Applicant: NICHIA CORPORATION

Inventor： Takeshi IKEGAMI ,  Hiroto TAMAKI

IPC: H01L33/50 ,  H01L33/48 ,  H01L33/54 ,  H01L33/46

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/20 ,  H01L33/32 ,  H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2933/0041

Abstract: A light emitting device includes at least one semiconductor light emitting element, and a wavelength conversion layer which is formed on a surface of the semiconductor light emitting element and which includes a resin layer containing a wavelength conversion member for converting a wavelength of light emitted from the semiconductor light emitting element. The wavelength conversion layer covers an upper surface or the upper surface and a side surface of the semiconductor light emitting element. A content of an inorganic material including the wavelength conversion member, or a content of an inorganic material including the wavelength conversion member and an inorganic filler, in the resin layer is 30% by mass or more and 99% by mass or less.

公开(公告)号：US20150340578A1

公开(公告)日：2015-11-26

申请号：US14716535

申请日：2015-05-19

Applicant: NICHIA CORPORATION

Inventor： Hiroto TAMAKI ,  Takuya NAKABAYASHI

IPC: H01L33/62 ,  H01L33/48

CPC classification number: H01L33/62 ,  H01L24/97 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/16225

Abstract: A light emitting device including; a base body having a base material that includes a first main face that has a lengthwise direction and a short-side direction that is perpendicular to the lengthwise direction, a second main face on the opposite side from the first main face, a first end face that extends in the lengthwise direction, and a second end face that extends in the short-side direction, and connection terminals that are provided on the first main face of the base material; and a light emitting element that is installed on the first main face and is connected to the connection terminals, the first end face of the base material has a recess that is contiguous with the first main face and the second end face and/or is contiguous with the second main face and the second end face, a length of the recess in a lengthwise direction is greater than a depth in a short-side direction, and the connection terminals are provided extending over the recess.

Abstract translation: 一种发光器件，包括： 具有基材的基体，该基材具有长度方向和与长度方向垂直的短边方向的第一主面，与第一主面相反一侧的第二主面，第一端面 沿长边方向延伸的第二端面和沿短边方向延伸的第二端面，以及设置在基材的第一主面上的连接端子; 以及发光元件，其安装在所述第一主面上并连接到所述连接端子，所述基材的第一端面具有与所述第一主面和所述第二端面邻接的凹部和/或连续的凹部 与第二主面和第二端面相对，凹部的长度方向的长度大于短边方向的深度，连接端子设置在凹部的上方。

公开(公告)号：US20150129918A1

公开(公告)日：2015-05-14

申请号：US14537947

申请日：2014-11-11

Applicant: NICHIA CORPORATION

Inventor： Takeshi IKEGAMI ,  Hiroto TAMAKI

IPC: H01L33/50 ,  H01L33/54

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/20 ,  H01L33/32 ,  H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2933/0041

Abstract: Provided is a light emitting device having a phosphor layer on a surface of a semiconductor light emitting element and achieving an even light distribution color, and a method of manufacturing the same. A method of manufacturing a light emitting device includes arranging a plurality of semiconductor light emitting elements spaced apart from each other on an expandable sheet, spraying a slurry containing a solvent, a thermosetting resin, and phosphor particles, onto an entire surface of the sheet having the arranged semiconductor light emitting elements to form a resin layer, pre-curing the resin layer, disuniting the resin layer formed on the surface of the semiconductor light emitting element from the resin layer formed on the sheet by expanding the sheet, and main curing the resin layer, which steps are performed in this order.

Abstract translation: 提供一种在半导体发光元件的表面上具有荧光体层并实现均匀的发光颜色的发光器件及其制造方法。 一种制造发光器件的方法包括在可膨胀片材上彼此间隔开的多个半导体发光元件布置，将含有溶剂，热固性树脂和荧光体颗粒的浆料喷射到具有 布置的半导体发光元件以形成树脂层，对树脂层进行预固化，通过使片材膨胀从由形成在片材上的树脂层分离形成在半导体发光元件的表面上的树脂层，并且主固化 树脂层，其顺序按此顺序进行。

公开(公告)号：US20140366369A1

公开(公告)日：2014-12-18

申请号：US14478086

申请日：2014-09-05

Applicant: NICHIA CORPORATION

Inventor： Ryohei YAMASHITA ,  Tomohide MIKI ,  Hiroto TAMAKI

IPC: H05K13/00

CPC classification number: H05K13/00 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49113 ,  H01L2924/181 ,  Y10T29/49124 ,  Y10T29/49126 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method for manufacturing a circuit board constituted by a light emitting device and a mounting board includes the steps of: conveying the light emitting device onto the mounting board in a state in which a top face is chucked by a nozzle so that the nozzle and an exposed part of a first terminal part of the light emitting device are in contact; and placing the light emitting device onto the mounting board so that the first terminal part and a wiring component are in contact in a state in which the top face is chucked by the nozzle.

Abstract translation: 一种用于制造由发光器件和安装板构成的电路板的方法，包括以下步骤：在顶表面由喷嘴卡住的状态下将发光器件传送到安装板上，使得喷嘴和 发光装置的第一端子部分的露出部分接触; 以及将所述发光器件放置在所述安装板上，使得所述第一端子部和所述布线部件在所述顶面被所述喷嘴卡住的状态下接触。

公开(公告)号：US20140252574A1

公开(公告)日：2014-09-11

申请号：US14196778

申请日：2014-03-04

Applicant: NICHIA CORPORATION

Inventor： Takuya NAKABAYASHI ,  Yoshitaka BANDO ,  Hiroto TAMAKI

IPC: H01L23/495

CPC classification number: H01L23/49537 ,  H01L21/4828 ,  H01L23/49503 ,  H01L23/49544 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49582 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A lead frame of high quality which can endure direct bonding to the electrodes of a semiconductor element and a metal member, and a semiconductor device of high reliability which utilizing the lead frame. The lead frame includes a pair of lead frame portions which are arranged spaced apart from and opposite to each other to be electrically connected to a pair of electrodes of a semiconductor element respectively, and a pair of support bars which are arranged spaced apart from the lead portions and extending from a side of either one of the lead portions to a side of the other lead portion.

Abstract translation: 可以承受与半导体元件和金属构件的电极的直接接合的高质量的引线框架，以及利用引线框架的高可靠性的半导体器件。 引线框架包括一对引线框架部分，它们彼此间隔开并相对设置，以分别与半导体元件的一对电极电连接;以及一对支撑杆，其与引线间隔开设置 部分并且从引导部分中的任一个的一侧延伸到另一个引线部分的一侧。

公开(公告)号：US20220241901A1

公开(公告)日：2022-08-04

申请号：US17723160

申请日：2022-04-18

Applicant: Laser Systems Inc. ,  NICHIA CORPORATION

Inventor： Kock Khuen SEET ,  Masayuki HAYASHIDA ,  Masakazu SAKAMOTO ,  Hiroto TAMAKI

IPC: B23K26/382 ,  H05K3/00 ,  B23K26/18 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/402

Abstract: A manufacturing method of a processed resin substrate includes: preparing a resin substrate including a resin layer and a metal layer that covers at least a part of one surface of the resin layer; and forming a through hole in the resin substrate by irradiating the resin substrate with pulsed laser light. In the forming of the through hole, an interval of irradiation of the pulsed laser light at each point on the resin substrate is 5 msec or more.

公开(公告)号：US20190305190A1

公开(公告)日：2019-10-03

申请号：US16428108

申请日：2019-05-31

Applicant: NICHIA CORPORATION

Inventor： Yuta OKA ,  Hiroto TAMAKI

IPC: H01L33/48 ,  H01L33/60

Abstract: A light emitting device includes a mounting board, a light emitting element, first and second light reflecting members, a light transmissive member, and a sealing member. The first light reflecting member surrounds a lateral surface of the light emitting element while a top surface is exposed. The second light reflecting member surrounds an outer periphery of the light emitting element, and is in contact with the first light reflecting member with at least a part of the second light reflecting member being positioned higher than the first light reflecting member. The light transmissive member includes a wavelength conversion substance, and is disposed inside the second light reflecting member and positioned higher than a lower surface of the light emitting element. The sealing member covers the second light reflecting member and the light transmissive member. An outer edge of the sealing member coincides with an outer edge of the mounting board.