公开(公告)号：US20220403231A1

公开(公告)日：2022-12-22

申请号：US17807851

申请日：2022-06-20

Applicant: NICHIA CORPORATION

Inventor： Yuki SHIOTA ,  Keisho YAMASHITA ,  Shoji HOSOKAWA ,  Tomokazu YOSHIDA ,  Yohei YAMAUCHI ,  Naoto KIJIMA

IPC: C09K11/02 ,  C09K11/61 ,  C09K11/06 ,  H01L51/00 ,  F21V9/30 ,  F21V8/00 ,  B32B27/36 ,  B32B27/30 ,  B32B27/08 ,  B32B3/12

Abstract: A wavelength conversion member including a wavelength conversion layer containing a fluoride phosphor, quantum dots, a surfactant, and a resin. The fluoride phosphor contains fluoride particles having a specific composition and having particle size values within specific ranges. The quantum dots include at least one selected from a first crystalline nanoparticle and a second crystalline nanoparticle. The first crystalline nanoparticle has a specific composition. When irradiated with light having a wavelength of 450 nm, the first crystalline nanoparticle emits light having an emission peak at a wavelength in a range from 510 nm to 535 nm, and a full width at half maximum of the emission peak of the first crystalline nanoparticle is in a range from 10 nm to 30 nm. The second crystalline nanoparticle includes a chalcopyrite-type crystalline structure, and a full width at half maximum of the emission peak of the second crystalline nanoparticle is 45 nm or less.

公开(公告)号：US20160225961A1

公开(公告)日：2016-08-04

申请号：US15098975

申请日：2016-04-14

Applicant: NICHIA CORPORATION

Inventor： Masaki HAYASHI ,  Yuki SHIOTA

IPC: H01L33/50 ,  H01L25/075 ,  H01L33/62 ,  H01L33/56 ,  H01L33/58

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A light emitting device includes a first lead, a second lead, an insulating member, a diffusing agent-containing portion, a wavelength conversion portion and a lens portion. The insulating member is configured to fix the first lead and the second lead. A thickness of the insulating member is equal to the thickness of the first and second leads. A groove or a recessed portion is provided to retain the wavelength conversion portion in a specific region is formed in the first lead. A second groove portion or recessed portion is formed in the first lead inner side of the groove portion or the recessed portion, which is filled with the diffusing agent-containing portion.

Abstract translation: 发光装置包括第一引线，第二引线，绝缘构件，扩散剂容纳部，波长转换部和透镜部。 绝缘构件被构造成固定第一引线和第二引线。 绝缘构件的厚度等于第一和第二引线的厚度。 提供凹槽或凹陷部分以将特定区域中的波长转换部分保持在第一引线中。 第二槽部或凹部形成在槽部或凹部的第一引线内侧，填充有扩散剂容纳部。

公开(公告)号：US20160190399A1

公开(公告)日：2016-06-30

申请号：US14978670

申请日：2015-12-22

Applicant: Nichia Corporation

Inventor： Koji ABE ,  Yuki SHIOTA

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/56 ,  H01L33/00

CPC classification number: H01L33/486 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3142 ,  H01L33/005 ,  H01L33/502 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A package for mounting a light emitting element includes: a first lead electrode having, in a plan view, a first region, a second region surrounding a periphery of the first region having a width of 110 μm or more and a thickness greater than that of the first region, and a third region partially surrounding a periphery of the second region and having a thickness smaller than that of the second region; a second lead electrode spaced apart from the first lead electrode; and a resin molded body fixing a portion of each of the first and second lead electrodes. A portion of each of the first and second lead electrodes and a portion of the resin molded body exposed therebetween form a bottom surface of a recess.

Abstract translation: 用于安装发光元件的封装包括：第一引线电极，在平面图中具有第一区域，围绕第一区域的周边的第二区域，宽度为110μm以上，厚度大于 所述第一区域和第三区域部分地围绕所述第二区域的周边并且具有比所述第二区域的厚度小的厚度; 与所述第一引线电极间隔开的第二引线电极; 以及固定所述第一和第二引线电极中的每一个的一部分的树脂成型体。 第一和第二引线电极中的每一个的一部分和暴露在其间的树脂成型体的一部分形成凹部的底表面。

公开(公告)号：US20220102592A1

公开(公告)日：2022-03-31

申请号：US17548691

申请日：2021-12-13

Applicant: Nichia Corporation

Inventor： Koji ABE ,  Yuki SHIOTA

IPC: H01L33/48 ,  H01L33/00 ,  H01L33/56 ,  H01L33/50 ,  H01L21/56 ,  H01L23/31

Abstract: A package for mounting a light emitting element includes: a first lead electrode defining a portion of a bottom of a recess and comprising a base member and a plating disposed on the base member, and wherein the first lead electrode comprises, in a plan view: a first region, a second region surrounding a periphery of the first region, wherein, in a height direction, an upper surface of the base member in an entirety of the second region is higher than an upper surface of the base member in the first region, and a third region surrounding at least a portion of a periphery of the second region, wherein, in the height direction, an upper surface of the base member in the third region is lower than the upper surface of the base member in the entirety of the second region; a second lead electrode; and a resin molded body.

公开(公告)号：US20190393391A1

公开(公告)日：2019-12-26

申请号：US16449447

申请日：2019-06-24

Applicant: NICHIA CORPORATION

Inventor： Yuki SHIOTA

IPC: H01L33/62 ,  H01L33/48

Abstract: A package includes a first lead, a first molded body, a second lead, and a second molded body. The first lead includes a first portion which has a first recess portion or a first through hole passing through the first portion. The second lead is provided on the first lead to be bonded to the first lead such that a bonding side surface faces to the first lead. The second lead includes a second portion which overlaps with the first portion and which has a second recess portion on the bonding side surface or a second through hole passing through the second portion. The second recess portion communicates with the first through hole. The second through hole communicates with the first recess portion. The second molded body fills the first through hole and the second recess portion, or fills the first recess portion and the second through hole.

公开(公告)号：US20170222101A1

公开(公告)日：2017-08-03

申请号：US15417816

申请日：2017-01-27

Applicant: NICHIA CORPORATION

Inventor： Yuki SHIOTA

IPC: H01L33/50 ,  H01L33/62 ,  H01L33/58 ,  H01L33/54

CPC classification number: H01L33/507 ,  H01L33/486 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066

Abstract: A light emitting device has: a base; a light emitting element disposed on the base; a light-transmissive member having a pair of opposing portions, the light-transmissive member being disposed on the base such that the light emitting element is interposed between and spaced apart from the pair of opposing portions; a sealing member that contains a phosphor and covers the light emitting element, at least a portion of upper surfaces of the pair of opposing portions, and inner lateral surfaces thereof.

公开(公告)号：US20170162770A1

公开(公告)日：2017-06-08

申请号：US15437997

申请日：2017-02-21

Applicant: NICHIA CORPORATION

Inventor： Koji ABE ,  Yuki SHIOTA

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/52 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L33/62 ,  H01L21/4846 ,  H01L21/565 ,  H01L33/486 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A package for mounting a light emitting element includes a recess; a pair of lead electrodes exposed at a bottom surface of the recess; a plating layer covering a surface of each of the pair of lead electrodes; and a resin molded body retaining the pair of lead electrodes, and forming an area between the pair of lead electrodes at the bottom surface of the recess and a lateral surface of the recess. At least one of the lead electrodes has a front surface protrusion that is linearly formed along the resin molded body at the bottom surface of the recess and along a periphery of the bottom surface of the recess, and a back surface protrusion that is formed at a position at a back surface opposite to a position of the front surface protrusion, and at least a tip of each of the front surface protrusion and the back surface protrusion is exposed outside the plating layer.

公开(公告)号：US20210135075A1

公开(公告)日：2021-05-06

申请号：US17147455

申请日：2021-01-13

Applicant: NICHIA CORPORATION

Inventor： Yuki SHIOTA

IPC: H01L33/62 ,  H01L33/50 ,  H01L33/64 ,  H01L33/60

Abstract: A package includes a first lead including a first electrode terminal, a second lead including a second electrode terminal, a first molded body holding the first lead, and a second molded body holding the second lead. The second lead is provided on the first lead in an overlapping direction such that the first electrode terminal of the first lead overlaps with the second electrode terminal of the second lead when viewed in the overlapping direction. The first electrode terminal and the second electrode terminal are electrically connected to each other without adding additional material. A part of the first molded body and a part of the second molded body are in contact with each other.

公开(公告)号：US20200303357A1

公开(公告)日：2020-09-24

申请号：US16897270

申请日：2020-06-10

Applicant: NICHIA CORPORATION

Inventor： Masaki HAYASHI ,  Yuki SHIOTA ,  Junya NARITA ,  Keisuke KURASHITA ,  Takanori AKAISHI

IPC: H01L25/075

Abstract: Each of a plurality of light emitting elements has a hexagonal shape with a center. An interior angle at each of corners is less than 180°. The plurality of light emitting elements include a first light emitting element having a first lateral side surface and a second light emitting element having a second lateral side surface. An orientation of the hexagonal shape of the second light emitting element is rotated by 30 degrees plus 30°+60°×N (N is an integer) with respect to the center of the second light emitting element relative to an orientation of the hexagonal shape of the first light emitting element such that the second lateral side surface is not parallel to the first lateral side surface.

公开(公告)号：US20190393390A1

公开(公告)日：2019-12-26

申请号：US16449445

申请日：2019-06-24

Applicant: NICHIA CORPORATION

Inventor： Yuki SHIOTA

IPC: H01L33/62 ,  H01L33/60 ,  H01L33/64 ,  H01L33/50

Abstract: A package includes a first lead including a first electrode terminal, and a second lead including a second electrode terminal and provided on the first lead in an overlapping direction such that the first electrode terminal of the first lead overlaps with the second electrode terminal of the second lead when viewed in the overlapping direction. The first electrode terminal and the second electrode terminal are electrically connected to each other without adding additional material.