摘要:
A driver for a semiconductor chip, the driver having a drain wire with a first end and a second end and p and n-type transistors each with a source, gate and drain. The source of the p-type transistors connected to a positive power supply line, the source of the n-type transistors connected to a ground power supply line. The gates of the p and n-type transistors connected to a first and second input signals respectively. The drains of the p and n-type transistors connected to the drain wire. The p and n-type transistors arranged so that a difference between a number of n-type transistors connected to the drain wire and a number of p-type transistors connected to the drain wire between the first end of the drain wire and all distances along the drain wire being less than two.
摘要:
Among other things, one or more techniques for graded dummy insertion and a resulting array are provided herein. For example an array is a metal oxide semiconductor (MOS) array, a metal oxide metal (MOM) array, or a resistor array. In some embodiments, a first region and a second region are identified based on a density gradient between a first pattern density associated with the first region and a second pattern density associated with the second region. For example, the first pattern density and the second pattern density are gate densities and/or poly densities. To this end, a dummy region is inserted between the first region and the second region, the dummy region includes a graded pattern density based on a first adjacent pattern density and a second adjacent pattern density. In this manner, graded dummy insertion is provided, thus enhancing edge cell performance for an array, for example.
摘要:
An embodiment is an integrated circuit. The integrated circuit comprises a clock generator and data transmission lines. The clock generator generates clock signals. At least some of the clock signals have a phase difference from an input clock signal input into the clock generator, and at least some of the clock signals have a different phase difference with respect to at least another of the clock signals. Each of the data transmission lines is triggered at least in part by at least one of the clock signals.
摘要:
This invention relates to an insulator for a multi-power system, which is used to resolve the current leakage which comes from each power supplied to the corresponding devices which are not being correctly operated. The isolating device includes: a first power supply for providing an operating power to the isolating device; a level detector for detecting the voltage level of the operating power; a signal isolation controller for changing the output level of the circuit supplied by the operating power based on the operating power detected; and a second power for supplying a real-time power to circuit for power saving operation based on the changed output level.
摘要:
A latch-up protection circuit for an integrated circuit powered through a first power rail and a second power rail is disclosed, the integrated circuit having at least one semiconductor bulk of a conductivity type. The latch-up protection circuit comprises a control circuit and a switch circuit. The control circuit is connected to the first power rail and the second power rail for detecting a relative voltage therebetween and generating a first control signal and a second control signal. The switch circuit connected to the first power rail and the control circuit. When the relative voltage is greater than a first predetermined value, the switch circuit in response to the first control signal electrically connects the first power rail with the at least one semiconductor bulk. When the relative voltage is smaller than the first predetermined value, the switch in response to the first control signal electrically disconnects the first power rail from the at least one semiconductor bulk.
摘要:
A built-in self-test (BIST) circuit for a liquid crystal display (LCD) source driver includes at least one digital-to-analog converter (DAC) and at least one buffer coupled to the respective DAC, wherein the buffer is reconfigurable as a comparator. A first input signal and a second input signal are coupled to the comparator. The first input signal is a predetermined reference voltage level. The second input signal is a test offset voltage in a test range.
摘要:
A system and method for modeling microelectromechanical devices is disclosed. An embodiment includes separating the microelectromechanical design into separate regions and modeling the separate regions separately. Parametric parameters or parametric equations may be utilized in the separate models. The separate models may be integrated into a MEMS device model. The MEMS device model may be tested and calibrated, and then may be used to model new designs for microelectromechanical devices.
摘要:
A circuit design system includes a schematic design tool configured to generate schematic information and pre-coloring information for a circuit. The circuit design system also includes a netlist file configured to store the schematic information and the pre-coloring information on a non-transitory computer readable medium and an extraction tool configured to extract the pre-coloring information from the netlist file. A layout design tool, included in the circuit design system, is configured to design at least one mask based on the schematic information and the pre-coloring information. The circuit design system further includes a layout versus schematic comparison tool configured to compare the at least one mask to the schematic information and the pre-coloring information.
摘要:
A micro-electro-mechanical system (MEMS) includes a micro-mechanical structure that is capable of generating a first electrical signal. An analog-to-digital converter (ADC) is coupled with the micro-mechanical structure. The MEMS is free from including any amplifier between the micro-mechanical structure and the ADC.
摘要:
Some aspects of this disclosure provide for electronic design automation (EDA) techniques that check whether individual blocks, such as transistors or other semiconductor devices, are connected to their correct power domains during design. In this way, the disclosed EDA techniques can limit or prevent overstress conditions applied to blocks and help to improve reliability of integrated circuits, when manufactured.