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公开(公告)号：US5136365A
公开(公告)日：1992-08-04
申请号：US588889
申请日：1990-09-27
IPC分类号： B23K35/22 , B23K35/363 , C09J11/04 , C09J11/06 , C09J163/00 , C09J167/00 , H01B1/22 , H01L21/52 , H01L21/56 , H01L21/60 , H01L23/482 , H01L23/498 , H05K3/32 , H05K3/34
CPC分类号： H01L24/83 , H01L21/563 , H01L23/4828 , H01L23/49883 , H01L24/29 , H01L24/81 , H05K3/323 , H01L2224/13111 , H01L2224/16 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29309 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/2932 , H01L2224/29339 , H01L2224/73203 , H01L2224/81801 , H01L2224/83191 , H01L2224/83192 , H01L2224/83855 , H01L2224/83862 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H05K2201/0145 , H05K3/321 , H05K3/3489
摘要： An adhesive material 220 including a fluxing agent and metal particles 240 is applied to either a substrate 200 having a metallization pattern 210 or an electrical component 230. The component 230 is positioned on the substrate 210 and heated. During the heating step, the fluxing agent promotes adhesion of the metal particles 240 to the substrate metallization pattern 210 and the component, and the adhesive material 220 is cured, to mechanically interconnect and encapsulate the substrate 210 and the component 230.
摘要翻译： 将包含助熔剂和金属颗粒240的粘合剂材料220施加到具有金属化图案210或电气部件230的基板200上。部件230定位在基板210上并加热。 在加热步骤期间，助熔剂促进金属颗粒240与基底金属化图案210和部件的粘附，并且粘合剂材料220被固化，以机械地互连和封装基底210和部件230。
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公开(公告)号：US5132778A
公开(公告)日：1992-07-21
申请号：US583751
申请日：1990-09-17
CPC分类号： C08G59/4014 , H01L23/293 , H01L2924/0002
摘要： Briefly, according to the invention, a transfer molding compound is made from an epoxide resin, a cyanate ester, and a catalyst. The molding compound is used to encapsulate semiconductor devices to fabricate individual packages or to encapsulate devices mounted directly on a circuit carrying substrate.
摘要翻译： 简言之，根据本发明，传递模塑料由环氧树脂，氰酸酯和催化剂制成。 模塑料用于封装半导体器件以制造单个封装或者将直接安装在承载电路的衬底上的器件封装。
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公开(公告)号：US5288769A
公开(公告)日：1994-02-22
申请号：US935360
申请日：1992-08-28
IPC分类号： C09J9/02 , H01L21/58 , H01L23/373 , B32B5/16 , B32B15/02
CPC分类号： H01L24/83 , C09J9/02 , H01L23/3737 , H01L24/29 , H01L2224/2929 , H01L2224/29347 , H01L2224/29386 , H01L2224/29447 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/8319 , H01L2224/8385 , H01L24/48 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04941 , H01L2924/0665 , H01L2924/07802 , H01L2924/181 , Y10S428/901 , Y10T428/2991 , Y10T428/2993
摘要： Thermally conductive particles (14) for use in a polymeric resin are provided. The particles (10) are aluminum nitride coated with copper (12). The thermally conductive particles (14) are incorporated into a polymer (38) in order to provide, for example, a thermally conductive adhesive (36). The thermally conductive adhesive is used to bond an electronic component (32) to a circuit carrying substrate (34) in order to dissipate heat from the electronic component.
摘要翻译： 提供了用于聚合物树脂的导热颗粒（14）。 颗粒（10）是用铜（12）涂覆的氮化铝。 导热颗粒（14）被引入聚合物（38）中以提供例如导热粘合剂（36）。 导热粘合剂用于将电子部件（32）连接到电路承载基板（34），以便散发来自电子部件的热量。
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公开(公告)号：US5128746A
公开(公告)日：1992-07-07
申请号：US588888
申请日：1990-09-27
CPC分类号： H05K3/305 , B23K35/3613 , H01L21/563 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/83192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01016 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/14 , H01L2924/15787 , H01L2924/351 , H05K2201/0145 , H05K2201/10674 , H05K2201/10734 , H05K2201/10977 , H05K2203/1189 , H05K3/3489 , Y02P70/613
摘要： An adhesive material 120 including a fluxing agent is applied to either a substrate 100 having a metallization pattern 110 or a solder bumped electrical component 130. The component 130 is positioned on the substrate 110 and the solder bump 140 is reflowed. During the reflow step, the fluxing agent promotes adhesion of the solder 140 to the substrate metallization pattern 110, and the adhesive material 120 is cured to mechanically interconnect and encapsulate the substrate 110 to the component 130.
摘要翻译： 包括助熔剂的粘合剂材料120被施加到具有金属化图案110或焊料凸起的电气部件130的基板100上。部件130位于基板110上，并且焊料凸块140被回流。 在回流步骤期间，助熔剂促进焊料140与衬底金属化图案110的粘附，并且固化粘合剂材料120以将衬底110机械地互连并封装到部件130。
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公开(公告)号：US5019673A
公开(公告)日：1991-05-28
申请号：US570751
申请日：1990-08-22
IPC分类号： H01L23/28 , H01L21/60 , H01L23/12 , H01L23/485
CPC分类号： H01L24/10 , H01L24/13 , H01L24/81 , H01L2224/13 , H01L2224/13099 , H01L2224/16237 , H01L2224/81801 , H01L2924/01005 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/14
摘要： A flip-chip package for integrated circuits is provided by over-molding an integrated circuit assembly which includes a flip-chip mounted to a very thin chip carrier. The flip-chip includes an array of bumped pads which fill an array of matching conductive through holes on the chip carrier and securely couple thereto. The chip carrier includes an array of bumped contacts on its back surface which correspond to the bumped pads of the flip-chip. The transfer over molding of the integrated circuit assembly provides a layer of epoxy around the exposed surfaces of the flip-chip providing an environmentally protected and removable integrated circuit package.
摘要翻译： 用于集成电路的倒装芯片封装通过覆盖模制集成电路组件来提供，集成电路组件包括安装到非常薄的芯片载体上的倒装芯片。 倒装芯片包括一组凸起的焊盘，其填充芯片载体上匹配的导电通孔的阵列并且牢固地耦接到芯片载体上。 芯片载体在其后表面上包括与倒装芯片的凸起焊盘相对应的凸起触点阵列。 集成电路组件的成型转移在倒装芯片的暴露表面周围提供环氧树脂层，其提供环境保护和可移除的集成电路封装。
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公开(公告)号：US5438224A
公开(公告)日：1995-08-01
申请号：US159910
申请日：1993-12-01
IPC分类号： H01L23/495 , H01L23/498 , H01L25/065 , H01L23/02 , H01L23/12 , H01L23/44 , H01L29/41
CPC分类号： H01L23/4985 , H01L23/49575 , H01L25/0657 , H01L2224/16 , H01L2225/06517 , H01L2225/06555 , H01L2225/06572 , H01L2225/06579 , H01L2924/01079 , H01L2924/15311
摘要： An integrated circuit package includes a stacked integrated circuit chip arrangement (140) placed on a circuit substrate. The stacked IC chip arrangement includes a first IC chip (110) and a second IC chip (120), each having an array of terminals (116, 126) and being positioned in a face-to-face manner. An interposed substrate (130) is positioned between the first IC chip (110) and the second IC chip (120) such that circuitry disposed on the interposed substrate (130) provides electrical connection among the arrays of terminals of the first IC chip (110) and the second IC chip (120) and external circuitry.
摘要翻译： 集成电路封装包括放置在电路基板上的堆叠集成电路芯片布置（140）。 堆叠的IC芯片装置包括第一IC芯片（110）和第二IC芯片（120），每个芯片具有端子阵列（116,126）并且以面对面的方式定位。 插入的基板（130）位于第一IC芯片（110）和第二IC芯片（120）之间，使得设置在插入的基板（130）上的电路在第一IC芯片（110）的端子阵列之间提供电连接 ）和第二IC芯片（120）和外部电路。
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