公开(公告)号：US20230207350A1

公开(公告)日：2023-06-29

申请号：US18147400

申请日：2022-12-28

Applicant: SEMES CO., LTD.

Inventor： Tae Shin KIM ,  Young Dae Chung ,  Won-Geun Kim ,  Jee Young Lee ,  Ji Hoon Jeong

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67115 ,  H01L21/67248 ,  H01L21/6715 ,  H01L21/68764

Abstract: Provided is an apparatus for treating a substrate, which includes: a chamber having a treating space; a substrate support unit supporting and rotating a substrate in the treating space; a liquid supply unit supplying a chemical liquid to the substrate supported on the substrate support unit; a laser irradiation unit irradiating a laser to a bottom of the substrate supported on the substrate support unit; and a laser reflection unit coupled to the laser irradiation unit, and reflecting the laser irradiated and reflected to the bottom of the substrate, in which the laser reflection unit includes a reflection member reflecting the laser reflected from the substrate, and a driving member tilting the reflection member at a predetermined tilt angle.

公开(公告)号：US11715651B2

公开(公告)日：2023-08-01

申请号：US17079445

申请日：2020-10-24

Applicant: SEMES CO., LTD.

Inventor： Young Dae Chung ,  Won Geun Kim ,  Jee Young Lee ,  Ji Hoon Jeong ,  Tae Shin Kim ,  Jung Suk Goh ,  Cheng Bin Cui ,  Ye Rim Yeon

IPC: H01L21/67

CPC classification number: H01L21/6708 ,  H01L21/67115 ,  H01L21/67248 ,  H01L21/67253

Abstract: A substrate treatment apparatus includes a substrate support unit, a chemical supply unit supplying a chemical solution onto an upper surface of a substrate supported on the substrate support unit, a laser irradiation unit applying a laser pulse to the substrate to heat the substrate, and a controller controlling the laser irradiation unit to emit the laser pulse such that the substrate is repeatedly heated and cooled to maintain a preset temperature.

公开(公告)号：US20230166285A1

公开(公告)日：2023-06-01

申请号：US18060030

申请日：2022-11-30

Applicant: SEMES CO., LTD.

Inventor： Yun Sang Kim ,  Yoon Seok Choi ,  Young Dae Chung ,  Soon-Cheon Cho ,  Se Hoon Oh

IPC: B05C5/02 ,  B05C13/02 ,  H05B6/78 ,  H05B6/80

CPC classification number: B05C5/02 ,  B05C13/02 ,  H05B6/78 ,  H05B6/80 ,  H05B2206/04

Abstract: Provided are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes: a chamber for providing a processing space; a substrate support unit provided in the processing space to support a substrate and rotate the substrate; a liquid supply unit including a chemical liquid discharge nozzle that discharges a chemical liquid to the substrate supported by the substrate support unit; and a microwave applying member for emitting microwaves to the substrate.

公开(公告)号：US12055857B2

公开(公告)日：2024-08-06

申请号：US18147469

申请日：2022-12-28

Applicant: SEMES CO., LTD.

Inventor： Tae Hee Kim ,  Ji Hoon Jeong ,  Tae Shin Kim ,  Young Dae Chung ,  Young Eun Jeon

IPC: G03F7/00

CPC classification number: G03F7/70191 ,  G03F7/70025

Abstract: The inventive concept provides a mask treatment apparatus. The mask treatment may include a support unit that supports the mask, and a light irradiation unit that irradiate the mask with a light to adjust a critical dimension of a pattern formed in the mask, wherein the light irradiation unit includes a light source that generates the light, and a light modulation element that modulates the light generated by the light source and forms an irradiation pattern.

公开(公告)号：US20230207324A1

公开(公告)日：2023-06-29

申请号：US18057321

申请日：2022-11-21

Applicant: SEMES CO., LTD.

Inventor： Won Sik Son ,  Hyun Yoon ,  Hyo Won Yang ,  Ji Hoon Jeong ,  Young Dae Chung ,  In Ki Jung

IPC: H01L21/268 ,  H01L21/67

CPC classification number: H01L21/268 ,  H01L21/6704 ,  H01L21/67115

Abstract: The present invention provides a substrate treating method of treating a substrate including a plurality of cells, the substrate treating method including: a liquid treating operation of supplying a treatment liquid to the substrate; and a heating operation of heating the substrate by supplying the treatment liquid and irradiating laser light to a specific region located outside a region in which the plurality of cells is provided, in which the laser light is formed to cover the specific region when viewed from the top.

公开(公告)号：US12148674B2

公开(公告)日：2024-11-19

申请号：US17224658

申请日：2021-04-07

Applicant: SEMES CO., LTD.

Inventor： Jung Suk Goh ,  Young Dae Chung ,  Ji Hoon Jeong

IPC: H01L21/66 ,  H01L21/311

Abstract: A substrate processing method and a substrate processing apparatus for removing material on a substrate are disclosed. In order to remove the material, a processing liquid including a chemical liquid and water is supplied on the substrate so that a liquid layer maintained by surface tension is formed. The material is removed from the substrate by a reaction between the material and the processing liquid. A size distribution of by-product particles formed by the reaction between the material and the processing liquid is measured by a dynamic light scattering method. A supply of the processing liquid is controlled based on the size distribution of the by-product particles.

公开(公告)号：US11923213B2

公开(公告)日：2024-03-05

申请号：US17128159

申请日：2020-12-20

Applicant: SEMES CO., LTD.

Inventor： Tae Shin Kim ,  Young Dae Chung ,  Ji Hoon Jeong ,  Jee Young Lee ,  Won Geun Kim

IPC: H01L23/00 ,  B08B3/10 ,  B23K26/00 ,  B23K26/06 ,  B23K26/064 ,  B23K26/352 ,  G02B7/02 ,  G02B27/09 ,  H01L21/02 ,  H01L21/268 ,  H01L21/66 ,  H01L21/67 ,  H01L21/687 ,  B23K101/40 ,  B23K103/00

CPC classification number: H01L21/67115 ,  B08B3/10 ,  B23K26/0006 ,  B23K26/0604 ,  B23K26/0626 ,  B23K26/064 ,  B23K26/352 ,  G02B7/028 ,  G02B27/0916 ,  G02B27/0955 ,  H01L21/02057 ,  H01L21/268 ,  H01L21/67051 ,  H01L21/67248 ,  H01L21/68764 ,  H01L22/20 ,  B23K2101/40 ,  B23K2103/56

Abstract: Proposed is a substrate heating unit including: a laser generator providing a laser beam for heating a substrate; and a beam shaper processing the laser beam from the laser generator and selectively providing one of a first beam having a uniform energy distribution and a second beam having an edge-enhanced energy distribution to the substrate.

公开(公告)号：US20230213852A1

公开(公告)日：2023-07-06

申请号：US18148051

申请日：2022-12-29

Applicant: SEMES CO., LTD.

Inventor： Ji Hoon Jeong ,  Young Dae Chung ,  Hyun Yoon

IPC: G03F1/78 ,  G03F1/70

CPC classification number: G03F1/78 ,  G03F1/70

Abstract: Disclosed is a method of treating a substrate, the method including: supplying a liquid to the substrate, emitting a laser to the substrate supplied with the liquid to heat the substrate, and emitting imaging light for capturing the substrate to obtain an image of the substrate including a region to which the laser is emitted, in which the laser and the imaging light are emitted to the substrate through a head lens, and a divergence angle of the laser emitted from the head lens and a divergence angle of the imaging light are matched with each other.

公开(公告)号：US12224200B2

公开(公告)日：2025-02-11

申请号：US17394868

申请日：2021-08-05

Applicant: SEMES CO., LTD.

Inventor： Ji Hoon Jeong ,  Won-Geun Kim ,  Young Dae Chung ,  Jee Young Lee ,  Tae Shin Kim

IPC: H01L21/687 ,  H01L21/67

Abstract: The present disclosure provides a substrate treating apparatus. The substrate treating apparatus includes a support unit that supports a substrate, and a heating unit that irradiates a beam to the substrate and heat the substrate, and the heating unit further includes an irradiation part that irradiates the beam, and a rotation part that rotates the beam.

公开(公告)号：US12094733B2

公开(公告)日：2024-09-17

申请号：US17073342

申请日：2020-10-17

Applicant: SEMES CO., LTD.

Inventor： Young Dae Chung ,  Won Geun Kim ,  Jee Young Lee ,  Ji Hoon Jeong ,  Tae Shin Kim ,  Se Hoon Oh ,  Pil Kyun Heo ,  Hyun Goo Park

IPC: H01L21/67 ,  H01L21/306 ,  C09K13/04

CPC classification number: H01L21/6708 ,  H01L21/30604 ,  H01L21/67115 ,  C09K13/04

Abstract: Disclosed is a substrate treatment apparatus including a rotation unit that supports and rotates a substrate, a chemical discharge unit that discharges a chemical solution to the rotation unit, a chemical recovery unit disposed close to the rotation unit and configured to recover the chemical solution scattering from the rotation unit, and a laser irradiation unit that applies a laser beam to the substrate and heats the substrate.