公开(公告)号：US12081888B2

公开(公告)日：2024-09-03

申请号：US17660084

申请日：2022-04-21

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Alexandre Mas ,  Abdessamed Mekki ,  Cedric Tubert

IPC: H04N25/75 ,  H03M1/12 ,  H03M1/46 ,  H04N25/625 ,  H04N25/677

CPC classification number: H04N25/75 ,  H03M1/1245 ,  H03M1/46 ,  H04N25/625 ,  H04N25/677

Abstract: The present disclosure relates to a read-out circuit comprising N inputs configured to be connected to N respective outputs of a pixel array of an image sensor, with N being an integer strictly greater than 1; and N analog-to-digital converters organized in K groups, with K being an integer strictly greater than 1 and strictly less than N, and each having a first input coupled to a respective one of the N inputs and a second input. In each group, the second inputs of the analog-to-digital converters of the group are connected together, electrically decoupled from the second inputs of the analog-to-digital converters of the other groups, and configured to receive a first reference signal that is identical for all the analog-to-digital converters of the group.

公开(公告)号：US20180190838A1

公开(公告)日：2018-07-05

申请号：US15689976

申请日：2017-08-29

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Alexandre Mas ,  Eric Saugier ,  Gaetan Lobascio ,  Benoit Besancon

IPC: H01L31/0203 ,  H01L31/18 ,  H01L31/0232 ,  H01L31/02 ,  H01L31/12 ,  B29C45/14

CPC classification number: H01L31/0203 ,  B29C45/14065 ,  B29C45/14639 ,  B29C45/14778 ,  B29K2995/0026 ,  B29L2031/3481 ,  H01L31/02002 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/18 ,  H01L33/483

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

公开(公告)号：US20220368847A1

公开(公告)日：2022-11-17

申请号：US17660084

申请日：2022-04-21

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Alexandre Mas ,  Abdessamed Mekki ,  Cedric Tubert

IPC: H04N5/378 ,  H03M1/46 ,  H03M1/12

Abstract: The present disclosure relates to a read-out circuit comprising N inputs configured to be connected to N respective outputs of a pixel array of an image sensor, with N being an integer strictly greater than 1; and N analog-to-digital converters organized in K groups, with K being an integer strictly greater than 1 and strictly less than N, and each having a first input coupled to a respective one of the N inputs and a second input. In each group, the second inputs of the analog-to-digital converters of the group are connected together, electrically decoupled from the second inputs of the analog-to-digital converters of the other groups, and configured to receive a first reference signal that is identical for all the analog-to-digital converters of the group.

公开(公告)号：US10483408B2

公开(公告)日：2019-11-19

申请号：US15689976

申请日：2017-08-29

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Alexandre Mas ,  Eric Saugier ,  Gaetan Lobascio ,  Benoit Besancon

IPC: H01L31/0203 ,  H01L31/18 ,  H01L31/0232 ,  H01L31/02 ,  H01L31/12 ,  B29C45/14 ,  H01L33/48 ,  B29L31/34

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

公开(公告)号：US11688815B2

公开(公告)日：2023-06-27

申请号：US17081299

申请日：2020-10-27

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Alexandre Mas ,  Eric Saugier ,  Gaetan Lobascio ,  Benoit Besancon

IPC: H01L31/02 ,  H01L31/0203 ,  H01L31/18 ,  H01L31/0232 ,  H01L31/12 ,  B29C45/14 ,  H01L33/48 ,  B29L31/34

CPC classification number: H01L31/0203 ,  B29C45/14065 ,  B29C45/14639 ,  H01L31/02002 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/18 ,  H01L33/483 ,  B29C45/14778 ,  B29K2995/0026 ,  B29L2031/3481

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

公开(公告)号：US20180190562A1

公开(公告)日：2018-07-05

申请号：US15689828

申请日：2017-08-29

Applicant: STMicroelectronics (Tours) SAS ,  STMicroelectronics (Grenoble 2) SAS

Inventor： Laurent Figuiere ,  Gaetan Lobascio ,  Alexandre Mas

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/31 ,  H01L21/304 ,  H01L21/78 ,  H01L21/56

CPC classification number: H01L23/367 ,  H01L21/3043 ,  H01L21/56 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/3178 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3733 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/73 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2741 ,  H01L2224/27848 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29347 ,  H01L2224/32245 ,  H01L2224/37012 ,  H01L2224/40227 ,  H01L2224/40499 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/83365 ,  H01L2224/84365 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/07811

Abstract: An electronic device includes a support plate having a mounting face. An electronic chip has a front face mounted on the mounting face of the support plate. A rear face of the electronic chip located opposite to the front face is provided with rear grooves that define, between the grooves, rear zones. A rear layer made of a heat-conducting material is spread over the rear face of the electronic chip so as to at least partly cover the rear zones and at least partially fill the rear grooves.

公开(公告)号：US10833208B2

公开(公告)日：2020-11-10

申请号：US16581978

申请日：2019-09-25

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Karine Saxod ,  Alexandre Mas ,  Eric Saugier ,  Gaetan Lobascio ,  Benoit Besancon

IPC: H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L31/02 ,  H01L31/12 ,  B29C45/14 ,  H01L33/48 ,  B29L31/34

Abstract: A cover for an electronic package is manufactured by placing an optical insert, having opposite faces and configured to allow light radiation to pass therethrough, between two opposite faces of a cavity of a mold in a position such that said optical faces of the optical insert make contact with said opposite faces of the cavity of the mold. A coating material is injected into the cavity and around the optical insert. The coating material is set to obtain a substrate that is overmolded around the optical insert so as to produce the cover. An electronic package includes an electronic chip mounted to a support substrate with the cover formed by the overmolded substrate mounted to the support substrate.

公开(公告)号：US10325784B2

公开(公告)日：2019-06-18

申请号：US15685552

申请日：2017-08-24

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Benoit Besancon ,  Alexandre Mas ,  Karine Saxod

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/552 ,  H01L23/053 ,  H01L23/06 ,  H01L23/10 ,  H01L23/24 ,  H01L23/42 ,  H01L23/433 ,  H01L21/52 ,  H01L23/04 ,  H01L21/48

Abstract: A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover.

公开(公告)号：US11114312B2

公开(公告)日：2021-09-07

申请号：US16394925

申请日：2019-04-25

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Benoit Besancon ,  Alexandre Mas ,  Karine Saxod

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/552 ,  H01L23/053 ,  H01L23/06 ,  H01L23/10 ,  H01L23/24 ,  H01L23/42 ,  H01L23/433 ,  H01L21/52 ,  H01L23/04 ,  H01L21/48

Abstract: A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover.

公开(公告)号：US20180190512A1

公开(公告)日：2018-07-05

申请号：US15685552

申请日：2017-08-24

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Benoit Besancon ,  Alexandre Mas ,  Karine Saxod

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/552

CPC classification number: H01L21/565 ,  H01L21/4803 ,  H01L21/52 ,  H01L23/04 ,  H01L23/053 ,  H01L23/06 ,  H01L23/10 ,  H01L23/24 ,  H01L23/315 ,  H01L23/3192 ,  H01L23/42 ,  H01L23/4334 ,  H01L23/552

Abstract: A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover.