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公开(公告)号:US20230091026A1
公开(公告)日:2023-03-23
申请号:US17994296
申请日:2022-11-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Anil Kavala , Seonkyoo Lee , Taesung Lee , Jeongdon Ihm , Byunghoon Jeong
Abstract: A semiconductor device includes an internal clock generation circuit configured to generate an internal clock; a plurality of unit circuits configured to have a first unit circuit and a second unit circuit operating while being synchronized with an internal clock; a plurality of transfer circuits including a first transfer circuit configured to provide a first transfer path having a first delay time, and a second transfer circuit configured to provide a second transfer path having a second delay time different from the first delay time; and a delay compensation circuit configured to compare a first clock input to the first unit circuit through the first transfer path with a second clock input to the second unit circuit through the second transfer path, and to adjust the second delay time so that the adjusted second delay time matches the first delay time.
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公开(公告)号:US10171269B2
公开(公告)日:2019-01-01
申请号:US15099987
申请日:2016-04-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seon-Kyoo Lee , Jeong-Don Ihm , Anil Kavala , Byung-Hoon Jeong
Abstract: An equalizer circuit may include an equalizer controller and a plurality of equalizers. The equalizer controller may prove separate sets of enable signals, delay control signals and voltage control signals to the separate equalizers based on a control signal. The equalizers provide equalizer signals to separate connection nodes between separate pairs of logic circuits. An equalizer may be selectively activated based on a received enable signal. An equalizer may include a delay control circuit and a voltage control circuit. The delay control circuit may delay a received transfer signal to generate a delayed transfer signal based on a received delay control signal. The voltage control circuit may generate an equalizer signal based on the delayed transfer signal and a received voltage control signal. The equalizer circuit may reduce inter-symbol interference in the integrated circuit based on providing the equalizer signals to the connection nodes between the logic circuits.
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3.
公开(公告)号:US20240312551A1
公开(公告)日:2024-09-19
申请号:US18529619
申请日:2023-12-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Anil Kavala , Youngmin Jo , Jungjune Park , Chiweon Yoon
CPC classification number: G11C29/46 , G11C29/1201 , G11C29/38 , G11C2029/4002
Abstract: A storage device includes a plurality of memory chips, a buffer chip connected to the plurality of memory chips, and a controller connected to the buffer chip. The buffer chip is configured to periodically receive a first command from the controller, and perform a DQS oscillator enable operation in response to the first command. At least one memory chip among the plurality of memory chips and the buffer chip are configured to perform write training or read training when the DQS oscillator enable operation is performed.
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公开(公告)号:US11522550B2
公开(公告)日:2022-12-06
申请号:US17077891
申请日:2020-10-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Anil Kavala , Seonkyoo Lee , Taesung Lee , Jeongdon Ihm , Byunghoon Jeong
Abstract: A semiconductor device includes an internal clock generation circuit configured to generate an internal clock; a plurality of unit circuits configured to have a first unit circuit and a second unit circuit operating while being synchronized with an internal clock; a plurality of transfer circuits including a first transfer circuit configured to provide a first transfer path having a first delay time, and a second transfer circuit configured to provide a second transfer path having a second delay time different from the first delay time; and a delay compensation circuit configured to compare a first clock input to the first unit circuit through the first transfer path with a second clock input to the second unit circuit through the second transfer path, and to adjust the second delay time so that the adjusted second delay time matches the first delay time.
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公开(公告)号:US12047082B2
公开(公告)日:2024-07-23
申请号:US17994296
申请日:2022-11-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Anil Kavala , Seonkyoo Lee , Taesung Lee , Jeongdon Ihm , Byunghoon Jeong
CPC classification number: H03L7/0816 , G11C7/222 , H03K5/133 , H03L7/085 , G11C29/023 , G11C29/028
Abstract: A semiconductor device includes an internal clock generation circuit configured to generate an internal clock; a plurality of unit circuits configured to have a first unit circuit and a second unit circuit operating while being synchronized with an internal clock; a plurality of transfer circuits including a first transfer circuit configured to provide a first transfer path having a first delay time, and a second transfer circuit configured to provide a second transfer path having a second delay time different from the first delay time; and a delay compensation circuit configured to compare a first clock input to the first unit circuit through the first transfer path with a second clock input to the second unit circuit through the second transfer path, and to adjust the second delay time so that the adjusted second delay time matches the first delay time.
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公开(公告)号:US11367471B2
公开(公告)日:2022-06-21
申请号:US17352527
申请日:2021-06-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Anil Kavala , Tongsung Kim , Chiweon Yoon , Byunghoon Jeong
IPC: G11C7/10 , H03K19/00 , H01L27/115 , G11C16/04
Abstract: An impedance calibration circuit includes a first variable impedance, a second variable impedance, a third variable impedance. The first variable impedance is connected to a ZQ terminal. A first control circuit performs a first impedance calibration on the first variable impedance based on an output signal from an output of a first comparator. A second control circuit performs a second impedance calibration on the third variable impedance based on an output signal from an output of a second comparator. A first switch connects an input of the first comparator to one of the ZQ terminal and the first node. A second switch connects the output of the first comparator to one of the first and second control circuits. A third switch connects an output of the first switch to one of first and second input terminals of the first comparator and connects the reference voltage to the other.
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7.
公开(公告)号:US20240257850A1
公开(公告)日:2024-08-01
申请号:US18426825
申请日:2024-01-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Anil Kavala , Youngmin Jo , Jungjune Park , Chiweon Yoon
CPC classification number: G11C7/225 , G11C7/1096 , G11C7/222
Abstract: Provided is a memory system including a memory device including a plurality of non-volatile memories, each of the plurality of non-volatile memories being electrically connected to a buffer chip, and a memory controller electrically connected to the buffer chip and configured to transmit a reference clock signal used in correction of a data signal, wherein the buffer chip includes a delay clock generation chain configured to generate a first delay clock signal or a second delay clock signal from the reference clock signal, a first register configured to store the first delay clock signal, and a second register configured to store the second delay clock signal, and wherein the buffer chip is configured to perform compensation on a strobe signal of the data signal based on the first delay clock signal, and perform compensation on the data signal based on the second delay clock signal.
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公开(公告)号:US20220148630A1
公开(公告)日:2022-05-12
申请号:US17352527
申请日:2021-06-21
Applicant: Samsung Electronics Co., Ltd.
Inventor: Anil Kavala , Tongsung Kim , Chiweon Yoon , Byunghoon Jeong
Abstract: An impedance calibration circuit includes a first variable impedance, a second variable impedance, a third variable impedance. The first variable impedance is connected to a ZQ terminal. A first control circuit performs a first impedance calibration on the first variable impedance based on an output signal from an output of a first comparator. A second control circuit performs a second impedance calibration on the third variable impedance based on an output signal from an output of a second comparator. A first switch connects an input of the first comparator to one of the ZQ terminal and the first node. A second switch connects the output of the first comparator to one of the first and second control circuits. A third switch connects an output of the first switch to one of first and second input terminals of the first comparator and connects the reference voltage to the other.
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公开(公告)号:US20210320664A1
公开(公告)日:2021-10-14
申请号:US17077891
申请日:2020-10-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Anil Kavala , Seonkyoo Lee , Taesung Lee , Jeongdon Ihm , Byunghoon Jeong
Abstract: A semiconductor device includes an internal clock generation circuit configured to generate an internal clock; a plurality of unit circuits configured to have a first unit circuit and a second unit circuit operating while being synchronized with an internal clock; a plurality of transfer circuits including a first transfer circuit configured to provide a first transfer path having a first delay time, and a second transfer circuit configured to provide a second transfer path having a second delay time different from the first delay time; and a delay compensation circuit configured to compare a first clock input to the first unit circuit through the first transfer path with a second clock input to the second unit circuit through the second transfer path, and to adjust the second delay time so that the adjusted second delay time matches the first delay time.
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10.
公开(公告)号:US20240295989A1
公开(公告)日:2024-09-05
申请号:US18538512
申请日:2023-12-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Anil Kavala , Hyunjin Kwon , Jungjune Park , Chiweon Yoon , Youngmin Jo
IPC: G06F3/06
CPC classification number: G06F3/0659 , G06F3/0679 , G06F3/0625
Abstract: A storage device includes at least one nonvolatile memory device a controller configured to control the at least one nonvolatile memory device, and an interface chip connected to the controller, wherein the interface chip includes a first interface circuit configured to communicate with the controller according to a first interface protocol, a second interface circuit configured to communicate the at least one nonvolatile memory device according to a second interface protocol, and a protocol converter configured to convert the first interface protocol to the second interface protocol or to convert the second interface protocol to the first interface protocol.
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