公开(公告)号：US11538701B2

公开(公告)日：2022-12-27

申请号：US16791564

申请日：2020-02-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Taehyoung Lee ,  Byeongsang Kim ,  Sung Chai Kim ,  Wooram Kim ,  Kyungwon Yun ,  Keonho Lee ,  Sangil Im ,  Namyoung Cho

IPC: H01L21/67 ,  G05B19/406 ,  G06T7/00 ,  G01N21/88 ,  G01N21/954

Abstract: A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module.

公开(公告)号：US20210013074A1

公开(公告)日：2021-01-14

申请号：US16791564

申请日：2020-02-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： TAEHYOUNG LEE ,  Byeongsang Kim ,  Sung Chai Kim ,  Wooram Kim ,  Kyungwon Yun ,  Keonho Lee ,  Sangil Im ,  Namyoung Cho

IPC: H01L21/67 ,  G05B19/406 ,  G06T7/00 ,  G01N21/88 ,  G01N21/954

Abstract: A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module.

公开(公告)号：US20230187236A1

公开(公告)日：2023-06-15

申请号：US17889035

申请日：2022-08-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonguk Seo ,  Seok Heo ,  Sungwook Kang ,  Byeongsang Kim ,  Sungkun Hwang ,  Igor Ivanov

IPC: H01L21/67 ,  H01L21/687 ,  H05B3/26 ,  F27B17/00 ,  F27D5/00 ,  B32B9/00 ,  B32B9/04 ,  B32B18/00 ,  B32B7/12 ,  B32B3/30 ,  B32B3/14

CPC classification number: H01L21/67109 ,  B32B3/14 ,  B32B3/30 ,  B32B7/12 ,  B32B9/04 ,  B32B9/007 ,  B32B9/041 ,  B32B18/00 ,  F27B17/0025 ,  F27D5/0037 ,  H01L21/6875 ,  H05B3/265 ,  B32B2255/205 ,  B32B2307/302 ,  H05B2203/005 ,  H05B2214/04

Abstract: A wafer baking apparatus includes a chamber including a processing space, and a wafer heater disposed in the processing space and configured to support a wafer. The wafer heater includes a first heating plate, a heating resistance pattern disposed on a lower surface of the first heating plate, a second heating plate disposed on the first heating plate, and a heat dispersion layer interposed between the first and second heating plates and having thermal conductivity lower than a thermal conductivity of materials of the first and second heating plates.

公开(公告)号：US20230078095A1

公开(公告)日：2023-03-16

申请号：US17695062

申请日：2022-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dougyong SUNG ,  Youngdo Kim ,  Byeongsang Kim ,  Yunhwan Kim ,  Jungmo Yang ,  Sejin Oh ,  Sungho Jang

IPC: H01J37/32

Abstract: A plasma etching apparatus includes a housing having a processing space; a support inside the housing, the support configured to support a substrate and including at least one lower electrode; at least one upper electrode facing the at least one lower electrode; a sidewall electrode disposed on a sidewall of the housing; a lower radiofrequency (RF) power source connected to the at least one lower electrode and configured to apply RF power; an upper RF power source connected to the at least one upper electrode and configured to apply RF power; a lower insulator adjacent to the at least one lower electrode; an upper insulator adjacent to the at least one upper electrode; at least one lower detector embedded in the lower insulator; and at least one upper detector embedded in the upper insulator.

公开(公告)号：US20230060400A1

公开(公告)日：2023-03-02

申请号：US17747303

申请日：2022-05-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonbum Nam ,  Namkyun Kim ,  Seungbo Shim ,  Donghyeon Na ,  Naohiko Okunishi ,  Dongseok Han ,  Minyoung Hur ,  Byeongsang Kim ,  Kuihyun Yoon

IPC: G01N9/24 ,  H01Q9/30 ,  H01Q1/40

Abstract: An apparatus for measuring parameters of plasma includes a cutoff probe. The cutoff probe includes: a first antenna having a line shape and configured to emit a microwave to the plasma in response to the signal provided by at least one processor; a second antenna having a line shape and configured to generate an electrical signal in response to receiving the microwave emitted by the first antenna and transferred through the plasma; a first insulating layer; a second insulating layer; a first shield; a second shield; an end protection layer covering an end of each of the first insulating layer, the second insulating layer, the first shield, and the second shield; a first antenna protection layer, of insulating nature, covering the first antenna; and a second antenna protection layer, of insulating nature, covering the second antenna.

公开(公告)号：US20210159112A1

公开(公告)日：2021-05-27

申请号：US16895513

申请日：2020-06-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeongsang Kim ,  Keonwoo Kim ,  Wooram Kim ,  Eungsu Kim ,  Heewon Min ,  Sangwook Park ,  Seungwon Shin ,  Dongyun Yeo ,  Geunsik Oh ,  Hyanjung Lee

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/683 ,  H01J37/20

Abstract: A lift apparatus for moving an object up and down in a substrate processing apparatus, the lift apparatus including a body configured to support the object while a lift hole, included in the body, is overlapped by the object in a vertical direction; a lift pin configured to move the object up and down by moving up and down in the lift hole; a bellows including an upper flange, a lower flange, and a flexible pipe; a connector combined with a lower portion of the lift pin in the flexible pipe and configured to interfere with downward movement of the lift pin and to allow at least one from among rotation, sliding, and tilting of the lift pin; a load sensor configured to measure vertical load generated in accordance with movement of the lift pin; and an actuator configured to move the lift pin up and down.

公开(公告)号：US12222362B2

公开(公告)日：2025-02-11

申请号：US17747303

申请日：2022-05-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonbum Nam ,  Namkyun Kim ,  Seungbo Shim ,  Donghyeon Na ,  Naohiko Okunishi ,  Dongseok Han ,  Minyoung Hur ,  Byeongsang Kim ,  Kuihyun Yoon

IPC: G01N9/24 ,  H01Q1/40 ,  H01Q9/30

Abstract: An apparatus for measuring parameters of plasma includes a cutoff probe. The cutoff probe includes: a first antenna having a line shape and configured to emit a microwave to the plasma in response to the signal provided by at least one processor; a second antenna having a line shape and configured to generate an electrical signal in response to receiving the microwave emitted by the first antenna and transferred through the plasma; a first insulating layer; a second insulating layer; a first shield; a second shield; an end protection layer covering an end of each of the first insulating layer, the second insulating layer, the first shield, and the second shield; a first antenna protection layer, of insulating nature, covering the first antenna; and a second antenna protection layer, of insulating nature, covering the second antenna.

公开(公告)号：US12210045B2

公开(公告)日：2025-01-28

申请号：US17591751

申请日：2022-02-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeongsang Kim ,  Dougyong Sung ,  Sungjin Kim ,  Yunhwan Kim ,  Inseok Seo ,  Seungbo Shim ,  Naohiko Okunishi ,  Minyoung Hur

IPC: G01R27/16 ,  C23C16/455 ,  C23C16/52 ,  H01L21/66 ,  H01L21/67 ,  H01L21/683

Abstract: An impedance measurement jig may include a first contact plate, a second contact plate, a cover plate, a plug, and an analyzer. The first contact plate may make electrical contact with an ESC in a substrate-processing apparatus. The second contact plate may make electrical contact with a focus ring configured to surround the ESC. The cover plate may be configured to cover an upper surface of the substrate-processing apparatus. The plug may be installed at the cover plate to selectively make contact with the first contact plate or the second contact plate. The analyzer may individually apply a power to the first contact plate and the second contact plate through the plug to measure an impedance of the ESC and an impedance of the focus ring. Thus, the impedances of the ESC and the focus ring may be individually measured to inspect the ESC and/or the focus ring.

公开(公告)号：US11984344B2

公开(公告)日：2024-05-14

申请号：US16895513

申请日：2020-06-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byeongsang Kim ,  Keonwoo Kim ,  Wooram Kim ,  Eungsu Kim ,  Heewon Min ,  Sangwook Park ,  Seungwon Shin ,  Dongyun Yeo ,  Geunsik Oh ,  Hyanjung Lee

IPC: H01L21/687 ,  H01J37/20 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/68742 ,  H01J37/20 ,  H01L21/67242 ,  H01L21/6831 ,  H01J2237/334

Abstract: A lift apparatus for moving an object up and down in a substrate processing apparatus, the lift apparatus including a body configured to support the object while a lift hole, included in the body, is overlapped by the object in a vertical direction; a lift pin configured to move the object up and down by moving up and down in the lift hole; a bellows including an upper flange, a lower flange, and a flexible pipe; a connector combined with a lower portion of the lift pin in the flexible pipe and configured to interfere with downward movement of the lift pin and to allow at least one from among rotation, sliding, and tilting of the lift pin; a load sensor configured to measure vertical load generated in accordance with movement of the lift pin; and an actuator configured to move the lift pin up and down.

公开(公告)号：US09381653B2

公开(公告)日：2016-07-05

申请号：US14643702

申请日：2015-03-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byeongsang Kim ,  Kang-Min Park ,  Jungjun Park ,  JaeChul Hwang

IPC: H01L21/677 ,  B25J19/00 ,  B25J15/00 ,  B25J11/00

CPC classification number: B25J19/0091 ,  B25J11/0095 ,  B25J15/0014 ,  H01L21/67766

Abstract: The robot including a main body, an arm connected to the main body, a hand connected to the arm, the hand including a hand base and a finger, and a hand bracket unit between the hand base and the finger or between the hand base and the arm, may be provided. The hand bracket unit may include a vibration damping member provided between the hand base and the finger or between the hand base and the arm, thereby damping vibration of the hand base or the finger.

Abstract translation: 该机器人包括主体，连接到主体的臂，连接到手臂的手，手包括手基座和手指，以及在手基座和手指之间或手基座和手指之间的手托架单元， 可以提供手臂。 手托架单元可以包括设置在手基座和手指之间或手基座和手臂之间的减震构件，从而阻止手基座或手指的振动。