公开(公告)号：US09054228B2

公开(公告)日：2015-06-09

申请号：US14160008

申请日：2014-01-21

申请人： Samsung Electronics Co., Ltd.

发明人： Eun-Kyoung Choi ,  Jong-Youn Kim ,  Sang-Wook Park ,  Hae-Jung Yu ,  In-Young Lee ,  Sang-Uk Han ,  Ji-Seok Hong

IPC分类号： H01L23/02 ,  H01L23/34 ,  H01L23/00 ,  H01L23/36 ,  H01L23/373 ,  H01L23/433 ,  H01L23/48 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： Semiconductor packages including a heat spreader and methods of forming the same are provided. The semiconductor packages may include a first semiconductor chip, a second semiconductor chip, and a heat spreader stacked sequentially. The semiconductor packages may also include a thermal interface material (TIM) layer surrounding the second semiconductor chip and directly contacting a sidewall of the second semiconductor chip. An upper surface of the TIM layer may directly contact a lower surface of the heat spreader, and a sidewall of the TIM layer may be substantially coplanar with a sidewall of the heat spreader. In some embodiments, a sidewall of the first semiconductor chip may be substantially coplanar with the sidewall of the TIM layer.

摘要翻译： 提供了包括散热器的半导体封装及其形成方法。 半导体封装可以包括顺序堆叠的第一半导体芯片，第二半导体芯片和散热器。 半导体封装还可以包括围绕第二半导体芯片并直接接触第二半导体芯片的侧壁的热界面材料（TIM）层。 TIM层的上表面可以直接接触散热器的下表面，并且TIM层的侧壁可以与散热器的侧壁基本上共面。 在一些实施例中，第一半导体芯片的侧壁可以与TIM层的侧壁基本共面。

公开(公告)号：US09159659B2

公开(公告)日：2015-10-13

申请号：US13835969

申请日：2013-03-15

申请人： SAMSUNG Electronics Co., Ltd.

发明人： Sang-Won Kim ,  Kwang-Chul Choi ,  Hyun-Jung Song ,  Cha-Jea Jo ,  Eun-Kyoung Choi ,  Ji-Seok Hong

IPC分类号： H01L23/49 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L23/48 ,  H01L25/065 ,  H01L29/06 ,  H01L21/768

CPC分类号： H01L23/49811 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2924/15156 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00

摘要： A semiconductor package includes a first semiconductor chip, a second semiconductor chip and a sealing member. The first semiconductor chip includes a substrate having a first surface and a second surface opposite to the first surface and having an opening that extends in a predetermined depth from the second surface, and a plurality of through electrodes extending in a thickness direction from the first surface, end portions of the through electrodes being exposed through a bottom surface of the opening. The second semiconductor chip is received in the opening and mounted on the bottom surface of the opening. The sealing member covers the second semiconductor chip in the opening.

摘要翻译： 半导体封装包括第一半导体芯片，第二半导体芯片和密封构件。 第一半导体芯片包括具有与第一表面相对的第一表面和第二表面的基板，并且具有从第二表面以预定深度延伸的开口，以及从厚度方向从第一表面延伸的多个贯穿电极 通孔的端部通过开口的底表面露出。 第二半导体芯片被容纳在开口中并安装在开口的底表面上。 密封构件覆盖开口中的第二半导体芯片。

公开(公告)号：US20140299980A1

公开(公告)日：2014-10-09

申请号：US14160008

申请日：2014-01-21

申请人： Samsung Electronics Co., Ltd.

发明人： Eun-Kyoung Choi ,  Jong-Youn Kim ,  Sang-Wook Park ,  Hae-Jung Yu ,  In-Young Lee ,  Sang-Uk Han ,  Ji-Seok Hong

IPC分类号： H01L23/522 ,  H01L23/34

CPC分类号： H01L24/97 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/481 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： Semiconductor packages including a heat spreader and methods of forming the same are provided. The semiconductor packages may include a first semiconductor chip, a second semiconductor chip, and a heat spreader stacked sequentially. The semiconductor packages may also include a thermal interface material (TIM) layer surrounding the second semiconductor chip and directly contacting a sidewall of the second semiconductor chip. An upper surface of the TIM layer may directly contact a lower surface of the heat spreader, and a sidewall of the TIM layer may be substantially coplanar with a sidewall of the heat spreader. In some embodiments, a sidewall of the first semiconductor chip may be substantially coplanar with the sidewall of the TIM layer.

摘要翻译： 提供了包括散热器的半导体封装及其形成方法。 半导体封装可以包括顺序堆叠的第一半导体芯片，第二半导体芯片和散热器。 半导体封装还可以包括围绕第二半导体芯片并直接接触第二半导体芯片的侧壁的热界面材料（TIM）层。 TIM层的上表面可以直接接触散热器的下表面，并且TIM层的侧壁可以与散热器的侧壁基本上共面。 在一些实施例中，第一半导体芯片的侧壁可以与TIM层的侧壁基本共面。

公开(公告)号：US08816509B2

公开(公告)日：2014-08-26

申请号：US13733481

申请日：2013-01-03

申请人： Samsung Electronics Co., Ltd.

发明人： Ji-Seok Hong ,  Kwang-chul Choi ,  Sangwon Kim ,  Hyun-Jung Song ,  Eun-Kyoung Choi

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/02 ,  H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  H01L25/065 ,  H01L25/00 ,  H01L23/31

CPC分类号： H01L23/29 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/29017 ,  H01L2224/29036 ,  H01L2224/29099 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/33051 ,  H01L2224/33505 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83986 ,  H01L2224/84201 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2924/01014 ,  H01L2924/014 ,  H01L2924/00012

摘要： A semiconductor package includes first and second semiconductor elements electrically interconnected by a connection structure. The first and second semiconductor elements are joined by a protection structure that includes an adhesive layer surrounded by a retention layer.

摘要翻译： 半导体封装包括通过连接结构电互连的第一和第二半导体元件。 第一和第二半导体元件通过保护结构连接，保护结构包括由保持层包围的粘合剂层。

公开(公告)号：US11676913B2

公开(公告)日：2023-06-13

申请号：US17134978

申请日：2020-12-28

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Eun-Kyoung Choi

IPC分类号： H01L23/00 ,  H01L25/18 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L23/562 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/3185 ,  H01L23/3675 ,  H01L23/49838 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/16157 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/18161 ,  H01L2924/3512

摘要： A semiconductor package includes a substrate. A first semiconductor chip is disposed on the substrate and is electrically connected to the substrate. The first semiconductor chip comprises a first sidewall extending in a first direction, a second sidewall extending in a second direction that crosses the first direction, and a third sidewall disposed between the first sidewall and the second sidewall and configured to connect the first sidewall and the second sidewall. The third sidewall has a curved surface shape. A second semiconductor chip is disposed on the first semiconductor chip and is electrically connected to the first semiconductor chip.

公开(公告)号：US20130193588A1

公开(公告)日：2013-08-01

申请号：US13733481

申请日：2013-01-03

申请人： Samsung Electronics Co, Ltd.

发明人： Ji-Seok Hong ,  Kwang-chul Choi ,  Sangwon Kim ,  Hyun-Jung Song ,  Eun-Kyoung Choi

IPC分类号： H01L23/29

CPC分类号： H01L23/29 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2224/29017 ,  H01L2224/29036 ,  H01L2224/29099 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/33051 ,  H01L2224/33505 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83986 ,  H01L2224/84201 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/0665 ,  H01L2924/01014 ,  H01L2924/014 ,  H01L2924/00012

摘要： A semiconductor package includes first and second semiconductor elements electrically interconnected by a connection structure. The first and second semiconductor elements are joined by a protection structure that includes an adhesive layer surrounded by a retention layer.

摘要翻译： 半导体封装包括通过连接结构电互连的第一和第二半导体元件。 第一和第二半导体元件通过保护结构连接，保护结构包括由保持层包围的粘合剂层。