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公开(公告)号:US20250166694A1
公开(公告)日:2025-05-22
申请号:US19029083
申请日:2025-01-17
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Tomoaki ATSUMI , Kiyoshi KATO , Shuhei MAEDA
IPC: G11C11/4094 , H10B12/00 , H10D30/67
Abstract: A semiconductor device whose operating speed is increased is provided. The semiconductor device includes a write word line, a read word line, a write bit line, a read bit line, a first wiring, and a memory cell. The memory cell includes three transistors of a single conductivity type and a capacitor. Gates of the three transistors are electrically connected to the write word line, a first terminal of the capacitor, and the read word line, respectively. A second terminal of the capacitor is electrically connected to the read bit line. A source and a drain of one transistor are electrically connected to the write bit line and the gate of another transistor, respectively. Two of the three transistors are electrically connected in series between the read bit line and the first wiring. A channel formation region of each of the three transistors includes, for example, a metal oxide layer.
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公开(公告)号:US20250142803A1
公开(公告)日:2025-05-01
申请号:US19006634
申请日:2024-12-31
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Hitoshi KUNITAKE , Tatsuya ONUKI , Tomoaki ATSUMI , Kiyoshi KATO
Abstract: A memory device having an error detection function and being capable of storing a large amount of data per unit area is provided. A driver circuit of the memory device is formed using a transistor formed on a semiconductor substrate, and a memory cell of the memory device is formed using a thin film transistor. A plurality of layers each of which includes a memory cell using the thin film transistor can be stacked over the semiconductor substrate, so that the amount of data that can be stored per unit area can be increased. Part of a peripheral circuit including the memory device can be formed using a thin film transistor, and thus, an error detection circuit is formed using the thin film transistor and stacked over the semiconductor substrate.
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公开(公告)号:US20250107062A1
公开(公告)日:2025-03-27
申请号:US18832672
申请日:2023-01-23
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei YAMAZAKI , Tatsuya ONUKI , Kiyoshi KATO , Hitoshi KUNITAKE , Ryota HODO
IPC: H10B12/00 , G11C11/405 , G11C11/408
Abstract: A semiconductor device that can be miniaturized or highly integrated is provided. The semiconductor device includes a first insulator, a second insulator over the first insulator, and a memory cell including a transistor and a capacitor. The transistor includes an oxide over the first insulator, a first conductor and a second conductor over the oxide, a third insulator over the oxide, and a third conductor over the third insulator. The third insulator and the third conductor are located in a first opening of the second insulator. The capacitor includes a fourth conductor in contact with a top surface of the second conductor, a fourth insulator over the fourth conductor, and a fifth conductor over the fourth insulator. The fourth conductor, the fourth insulator, and the fifth conductor are located in a second opening of the second insulator. A third opening is formed in the first insulator, the second insulator, and the first conductor. A sixth conductor is located in the third opening. The sixth conductor includes a region in contact with part of a top surface of the first conductor and part of a side surface of the first conductor in each of a plurality of layers.
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公开(公告)号:US20240423096A1
公开(公告)日:2024-12-19
申请号:US18691163
申请日:2022-09-08
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Takanori MATSUZAKI , Tatsuya ONUKI , Kiyoshi KATO
Abstract: A semiconductor device with high storage capacity and low power consumption is provided. The semiconductor device includes first to third conductors, first and second transistors, and an MTJ element. The MTJ element includes a free layer and a fixed layer. In the semiconductor device, the first conductor, the second conductor, the free layer, the fixed layer, the first and second transistors, and the third conductor are provided in this order from the bottom. In particular, in a plan view, the third conductor is positioned in a region overlapping with the first conductor. The first conductor is electrically connected to the second conductor, and the second conductor is electrically connected to the free layer and a first terminal of the first transistor. The fixed layer is electrically connected to a first terminal of the second transistor, and a second terminal of the first transistor is electrically connected to a second terminal of the second transistor and the third conductor. The first transistor and the second transistor each include a metal oxide in a channel formation region.
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公开(公告)号:US20240304231A1
公开(公告)日:2024-09-12
申请号:US18657376
申请日:2024-05-07
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Shunpei YAMAZAKI , Kiyoshi KATO , Takahiko ISHIZU , Tatsuya ONUKI
IPC: G11C11/408 , H01L27/12 , H01L29/24 , H01L29/786 , H10B99/00
CPC classification number: G11C11/4085 , H01L27/1207 , H01L27/1225 , H01L27/124 , H01L27/1255 , H01L29/24 , H01L29/78648 , H01L29/7869 , H10B99/00
Abstract: A memory device having long data retention time and high reliability is provided. The memory device includes a driver circuit and a plurality of memory cells, the memory cell includes a transistor and a capacitor, and the transistor includes a metal oxide in a channel formation region. The transistor includes a first gate and a second gate, and in a period during which the memory cell retains data, negative potentials are applied to the first gate and the second gate of the transistor.
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公开(公告)号:US20240063797A1
公开(公告)日:2024-02-22
申请号:US18240389
申请日:2023-08-31
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Masashi FUJITA , Yutaka SHIONOIRI , Kiyoshi KATO , Hidetomo KOBAYASHI
IPC: H03K19/17728 , H03K19/173 , H03K19/17758 , H03K19/17772
CPC classification number: H03K19/17728 , H03K19/1737 , H03K19/17758 , H03K19/17772
Abstract: An object is to provide a semiconductor device that can maintain the connection relation between logic circuit units or the circuit configuration of each of the logic circuit units even after supply of power supply voltage is stopped. Another object is to provide a semiconductor device in which the connection relation between logic circuit units or the circuit configuration of each of the logic circuit units can be changed at high speed. In a reconfigurable circuit, an oxide semiconductor is used for a semiconductor element that stores data on the circuit configuration, connection relation, or the like. Specifically, the oxide semiconductor is used for a channel formation region of the semiconductor element.
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公开(公告)号:US20230413587A1
公开(公告)日:2023-12-21
申请号:US18242210
申请日:2023-09-05
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei YAMAZAKI , Jun KOYAMA , Kiyoshi KATO
IPC: H10B99/00 , H01L27/105 , H01L27/12 , H10B12/00 , H10B41/20 , H10B41/70 , H01L29/24 , H01L29/786
CPC classification number: H10B99/00 , H01L27/105 , H01L27/1225 , H10B12/00 , H10B41/20 , G11C13/0007 , H01L27/124 , H01L27/1255 , H01L29/24 , H01L29/7869 , H01L29/78696 , H10B41/70
Abstract: An object of one embodiment of the present invention is to provide a semiconductor device with a novel structure in which stored data can be stored even when power is not supplied in a data storing time and there is no limitation on the number of times of writing. The semiconductor device includes a first transistor which includes a first channel formation region using a semiconductor material other than an oxide semiconductor, a second transistor which includes a second channel formation region using an oxide semiconductor material, and a capacitor. One of a second source electrode and a second drain electrode of the second transistor is electrically connected to one electrode of the capacitor.
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公开(公告)号:US20230309308A1
公开(公告)日:2023-09-28
申请号:US18129120
申请日:2023-03-31
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei YAMAZAKI , Hajime KIMURA , Takanori MATSUZAKI , Kiyoshi KATO , Satoru OKAMOTO
Abstract: A semiconductor device with a large storage capacity per unit area is provided. The semiconductor device includes a first insulator including a first opening, a first conductor that is over the first insulator and includes a second opening, a second insulator that is over the first insulator and includes a third opening, and an oxide penetrating the first opening, the second opening, and the third opening. The oxide includes a first region at least in the first opening, a second region at least in the second opening, and a third region at least in the third opening. The resistances of the first region and the third region are lower than the resistance of the second region.
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公开(公告)号:US20230253031A1
公开(公告)日:2023-08-10
申请号:US18135779
申请日:2023-04-18
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Tatsuya ONUKI , Takanori MATSUZAKI , Kiyoshi KATO , Shunpei YAMAZAKI
IPC: G11C11/4091 , G11C5/02 , G11C5/06 , H10B12/00
CPC classification number: G11C11/4091 , G11C5/02 , G11C5/063 , H10B12/30
Abstract: A memory device in which bit line parasitic capacitance is reduced is provided. The memory device includes a sense amplifier electrically connected to a bit line and a memory cell array stacked over the sense amplifier. The memory cell array includes a plurality of memory cells. The plurality of memory cells are each electrically connected to a bit line. A portion for leading the bit lines is not provided in the memory cell array. Thus, the bit line can be shortened and the bit line parasitic capacitance is reduced.
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公开(公告)号:US20230230994A1
公开(公告)日:2023-07-20
申请号:US18105005
申请日:2023-02-02
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Tatsuya ONUKI , Kiyoshi KATO , Takanori MATSUZAKI , Hajime KIMURA , Shunpei YAMAZAKI
IPC: H01L27/146 , H01L27/12 , H01L29/786 , H04N25/771 , H04N25/772 , H10B99/00
CPC classification number: H01L27/14634 , H01L27/1207 , H01L27/1225 , H01L27/1255 , H01L29/78648 , H01L29/7869 , H04N25/771 , H04N25/772 , H10B99/00
Abstract: An imaging device which has a stacked-layer structure and can be manufactured easily is provided. The imaging device includes a signal processing circuit, a memory device, and an image sensor. The imaging device has a stacked-layer structure in which the memory device is provided above the signal processing circuit, and the image sensor is provided above the memory device. The signal processing circuit includes a transistor formed on a first semiconductor substrate, the memory device includes a transistor including a metal oxide in a channel formation region, and the image sensor includes a transistor formed on a second semiconductor substrate.
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