摘要:
The present invention relates to a process for coating apparatuses and apparatus parts for chemical plant construction—which are taken to mean, for example, apparatus, tank and reactor walls, discharge devices, valves, pumps, filters, compressors, centrifuges, columns, dryers, comminution machines, internals, packing elements and mixing elements—wherein a metal layer or a metal/polymer dispersion layer is deposited in an electroless manner on the apparatus(es) or apparatus part(s) to be coated by bringing the parts into contact with a metal electrolyte solution which, in addition to the metal electrolyte, comprises a reducing agent and optionally the polymer or polymer mixture to be deposited in dispersed form, where at least one polymer is halogenated.
摘要:
The invention relates to a process for the production of a heat transfer device, which comprises electroless chemical deposition of a metal/polymer dispersion layer, in which the polymer is halogenated, on a heat transfer surface. The invention furthermore relates to a process for the production of a heat transfer device, wherein a metal/phosphorus layer with a thickness of from 1 to 15 &mgr;m is applied by electroless chemical deposition before application of the metal/polymer dispersion layer. The invention furthermore relates to a heat transfer device which can be produced by a process according to the invention, and to the use of a coating, produced by electroless chemical deposition of a metal/polymer dispersion layer, in which the polymer is halogenated, for reducing the tendency of the coated surfaces to accumulate solids from fluids, causing fouling.
摘要:
A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, where the movable substructures are excitable into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, where deflections of the Coriolis elements induced by a Coriolis force are detectable, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis.
摘要:
Measures are proposed by which the design freedom is significantly increased in the case of the implementation of the micromechanical structure of the MEMS element of a component, which includes a carrier for the MEMS element and a cap for the micromechanical structure of the MEMS element, the MEMS element being mounted on the carrier via a standoff structure. The MEMS element is implemented in a layered structure, and the micromechanical structure of the MEMS element extends over at least two functional layers of this layered structure, which are separated from one another by at least one intermediate layer.
摘要:
A drive element is provided having a substrate, a seismic mass, a drive electrode and a counter-electrode, one of the two electrodes being connected to the substrate and the other of the two electrodes being connected to the seismic mass; and the drive electrode and the counter-electrodes being provided for the excitation of motion of the seismic mass in a main direction of motion; and in addition, the drive electrode includes a first and a second partial electrode, which are switchable separately from each other.
摘要:
A method for constructing an electrical circuit that includes at least one semiconductor chip encapsulated with a potting compound is disclosed. The method includes applying a galvanic layer arrangement for forming an electrochemical element on an element of the electrical circuit including the at least one semiconductor chip.
摘要:
A method for measuring an air mass flow flowing in a main flow direction, and a hot-film air mass meter by which the method is able to be realized. The method and the hot-film air mass meter are especially suitable for use in the induction tract of an internal combustion engine. The hot-film air mass meter includes a sensor chip having a chip surface across which an air mass flow is able to flow. The chip surface in turn has a measuring surface, the measuring surface including a central hot-film air mass meter circuit having at least one central heating element and at least two temperature sensors. The method is implemented so that the at least one central heating element is periodically heated using a frequency ω. With the aid of at least two temperature sensors, at least two measuring signals are detected. The measuring signals and/or at least one differential signal of the at least two measuring signals are modulated using the frequency ω.
摘要:
A device is provided for resonantly driving a micromechanical system, which includes at least one seismic mass supported by spring vibrations, at least one drive for driving the vibration of the seismic mass and at least one element that is motionally coupled to the seismic mass. Furthermore, the device includes at least one detection element for detecting a relational parameter, that changes with the vibration of the seismic mass, between the motionally coupled element and the detection element, the detection element being equipped to cause an interruption of the vibration drive when a predetermined value of the relational parameter is reached.
摘要:
Measures are proposed by which the design freedom is significantly increased in the case of the implementation of the micromechanical structure of the MEMS element of a component, which includes a carrier for the MEMS element and a cap for the micromechanical structure of the MEMS element, the MEMS element being mounted on the carrier via a standoff structure. The MEMS element is implemented in a layered structure, and the micromechanical structure of the MEMS element extends over at least two functional layers of this layered structure, which are separated from one another by at least one intermediate layer.
摘要:
A method for producing an electronic module, in that at least one first microelectronic component is provided and is electrically connected to a second microelectronic component by a first flip-chip method step; at least one dielectric component is provided which has at least one printed circuit trace, and at least one printed circuit trace of the dielectric component is electrically connected to the second microelectronic component; and the second microelectronic component is electrically connected by a second flip-chip method step to a printed circuit board by way of the printed circuit trace(s) of the dielectric component, in order to avoid vias through a microelectronic component; the invention also relates to a corresponding electronic module.