公开(公告)号：US20250076232A1

公开(公告)日：2025-03-06

申请号：US18950924

申请日：2024-11-18

Applicant: Tokyo Electron Limited

Inventor： Shigeru KASAI ,  Naoki AKIYAMA ,  Fumiya TAKASE ,  Hiroyuki NAKAYAMA ,  Hajime KUMASAKA

IPC: G01N25/72 ,  G01R31/26 ,  G01R31/265

Abstract: An inspection apparatus for inspecting an inspection target device is presented. The inspection apparatus comprises a placing table that supports the inspection target object while facing the back surface of the imaging device, and the placing table includes: a ceiling plate made of a light transmitting material and having a placing surface on which the inspection target object is placed, an irradiation part that is disposed at a position facing the inspection target object with the ceiling plate interposed therebetween and that irradiates light toward the inspection target object placed on the placing surface; and a temperature controller configured to adjusts a temperature of the inspection target device of the inspection target object placed on the placing surface.

公开(公告)号：US20220151026A1

公开(公告)日：2022-05-12

申请号：US17425285

申请日：2020-01-16

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shigeru KASAI

IPC: H05B3/03 ,  H01L21/02 ,  H05B3/74

Abstract: Disclosed is a method for controlling the temperature of a heater which has a single plate-shaped member formed of a semiconductor substrate, and three or more electrodes formed on a side surface of the single plate-shaped member while being spaced apart from each other in a circumference direction, the method comprising a step for heating the plate-shaped member by supplying a power between the electrodes and sequentially changing the pair of electrodes to which the power is supplied, wherein a period of time in which the power is supplied between the electrodes in the heating step is individually determined for each set of electrodes.

公开(公告)号：US20220128624A1

公开(公告)日：2022-04-28

申请号：US17508232

申请日：2021-10-22

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shigeru KASAI ,  Tomohiro OTA

IPC: G01R31/28 ,  G01K13/00 ,  G01K7/01 ,  G01K7/18

Abstract: There is provided a placement table having an upper surface on which a device to be processed is placed. The placement table comprises: a top plate having a placement surface for the device; a heating unit configured to heat the top plate; a plurality of temperature sensors configured to acquire temperature of the top plate at desired measurement positions in a plan view; and a positioning unit electrically connected to the temperature sensors and configured to position the temperature sensors at the measurement positions in a plan view. The positioning unit is formed of a flexible substrate having flexibility.

公开(公告)号：US20130168390A1

公开(公告)日：2013-07-04

申请号：US13727000

申请日：2012-12-26

Applicant: TOKYO ELECTRON LIMITED

Inventor： Taro IKEDA ,  Shigeru KASAI ,  Jun YAMASHITA ,  Masakazu BAN

IPC: H05B6/64

CPC classification number: H05B6/6402 ,  H05B6/6426 ,  H05B6/70 ,  H05B6/707 ,  H05B6/72 ,  H05B6/806

Abstract: In the microwave heating apparatus, four microwave introduction ports are arranged at positions spaced apart from each other at an angle of about 90° in a ceiling portion of a processing chamber in such a way that the long sides and the short sides thereof are in parallel to inner surfaces of four sidewalls. The microwave introduction port are disposed in such a way that each of the microwave introduction ports are not overlapped with another microwave introduction port whose long sides are in parallel to the long sides of the corresponding microwave introduction port when the corresponding microwave introduction port is moved in translation in a direction perpendicular to the long sides thereof.

Abstract translation: 在微波加热装置中，四个微波导入口被配置在处理室的顶部以大约90°的角度彼此间隔开的位置，使得其长边和短边平行 到四个侧壁的内表面。 微波引入端口以这样的方式设置，即当相应的微波引入端口移动时，每个微波引入端口不与其长边与相应的微波导入口的长边平行的另一个微波导入口重叠 在垂直于其长边的方向上平移。

公开(公告)号：US20240402021A1

公开(公告)日：2024-12-05

申请号：US18694153

申请日：2022-09-15

Applicant: Tokyo Electron Limited

Inventor： Tomohiro OTA ,  Shigeru KASAI ,  Yasuhiro MURATA ,  Fumiya FUJII

IPC: G01K15/00 ,  G01K1/143 ,  G01K3/14 ,  G01R31/26 ,  G01R31/28 ,  G01R35/00

Abstract: A temperature calibration system includes: an inspection apparatus to adjust temperature of an inspection target in a placement part and inspect the inspection target; and a surface thermometer, and is configured to calibrate temperature sensors in the placement part. The inspection apparatus includes: a carriage to move the placement part in X-, Y-, and Z-axis directions; and a controller to perform a calibration process to measurement values of the temperature sensors. The surface thermometer is configured to contact a placement surface of the placement part and detect a surface temperature of the placement surface. The controller is configured to: control the carriage to contact the surface thermometer with a detection position of the placement surface of the placement part; detect the surface temperature of the detection position by the surface thermometer; and calibrate the measurement value of the temperature sensor corresponding to the detection position based on the surface temperature.

公开(公告)号：US20220178994A1

公开(公告)日：2022-06-09

申请号：US17539951

申请日：2021-12-01

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiroaki AGAWA ,  Masahito KOBAYASHI ,  Shigeru KASAI

IPC: G01R31/28

Abstract: There is provided a control method of a test device, the test device comprising a chuck on which an object to be tested is mounted, a tester configured to supply electric power to the object to be tested to test the object to be tested, and a controller configured to control a temperature of the chuck. The control method comprises: when an actual temperature of the object to be tested cannot be fed back, estimating a temperature difference between the temperature of the chuck and the temperature of the object to be tested on the basis of a heat amount of the object to be tested; correcting a target temperature of the chuck on the basis of a target temperature of the object to be tested and the temperature difference; and controlling the temperature of the chuck on the basis of the corrected target temperature of the chuck and an actual temperature of the chuck.

公开(公告)号：US20220015193A1

公开(公告)日：2022-01-13

申请号：US17370347

申请日：2021-07-08

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shigeru KASAI ,  Hiroyuki NAKAYAMA ,  Yutaka AKAIKE ,  Hiroaki KOMIYA ,  Yoshiyasu KATO

IPC: H05B1/02 ,  H05B3/22 ,  G01R31/28

Abstract: A method for adjusting a temperature of a substrate support is provided. In an apparatus for inspecting a target device, a substrate placement surface of the substrate support is divided into multiple regions and a heater is disposed in each of the multiple regions. The method comprises controlling the heater in a main region corresponding to the target device such that a temperature of the main region becomes a set temperature, and controlling the heater in a sub-region adjacent to the main region. When overshoot has not occurred in the temperature of the main region, the heater in the sub-region is controlled such that a temperature difference between the main region and the sub-region becomes a predetermined value, and when overshoot has occurred, the heater of the sub-region is controlled such that a difference between the set temperature and the temperature in the sub-region becomes the predetermined value.

公开(公告)号：US20160240374A1

公开(公告)日：2016-08-18

申请号：US15043242

申请日：2016-02-12

Applicant: TOKYO ELECTRON LIMITED

Inventor： Shigeru KASAI ,  Kotaro MIYATANI ,  Takuya KUROTORI ,  Kenichi KOTE ,  Yutaka FUJINO ,  Akira TANIHARA ,  Kohei KAWAMURA

IPC: H01L21/02

CPC classification number: H01L21/02345 ,  H01L21/0212 ,  H01L21/02175 ,  H01L21/02274 ,  H01L21/02315

Abstract: In a method for forming a fluorocarbon-based insulating film to be in contact with a metal, a microwave is irradiated to the metal to which moisture is adhered in a hydrogen-containing atmosphere. Then plasma CVD using a fluorocarbon-based gas is performed on the metal to which the microwave is irradiated to form the insulating film.

Abstract translation: 在与金属接触的氟碳系绝缘膜的形成方法中，在含氢气氛中对附着有水分的金属照射微波。 然后，对照射微波的金属进行基于碳氟化合物气体的等离子体CVD，形成绝缘膜。

公开(公告)号：US20140158302A1

公开(公告)日：2014-06-12

申请号：US14095563

申请日：2013-12-03

Applicant: TOKYO ELECTRON LIMITED

Inventor： Taro IKEDA ,  Tomohito KOMATSU ,  Shigeru KASAI ,  Hiroyuki MIYASHITA ,  Yuki OSADA ,  Akira TANIHARA ,  Yutaka FUJINO

IPC: H01J37/32

CPC classification number: H01J37/3222 ,  H01J37/32201

Abstract: A microwave radiation antenna includes an antenna body having a microwave radiation surface; a processing gas inlet configured to introduce a processing gas into the antenna body; a gas diffusion space configured to diffuse the processing gas in the antenna body; a plurality of gas outlets provided in the antenna body and configured to discharge the processing gas into the chamber; a plurality of slots provided in the antenna body under a state where the slots are separated from the gas diffusion space and the gas outlets; and an annular dielectric member provided in the microwave radiation surface side of the antenna body to cover a slot formation region where the slots are formed. A metal surface wave is formed in the microwave radiation surface by the microwave radiated through the slots and the annular dielectric member and a surface wave plasma is generated by the metal surface wave.

Abstract translation: 微波辐射天线包括具有微波辐射表面的天线体; 处理气体入口，被配置为将处理气体引入到天线体中; 气体扩散空间，其构造成将所述处理气体扩散到所述天线体中; 多个气体出口，其设置在所述天线体中并且被配置为将所述处理气体排出到所述室中; 在槽与气体扩散空间和气体出口分离的状态下设置在天线体中的多个槽; 以及设置在天线体的微波辐射面侧的环状电介质部件，以覆盖形成槽的槽形成区域。 通过微波辐射通过狭缝和环形电介质构成的微波辐射表面形成金属表面波，并通过金属表面波产生表面波等离子体。

公开(公告)号：US20210389366A1

公开(公告)日：2021-12-16

申请号：US17286959

申请日：2019-10-17

Applicant: Tokyo Electron Limited

Inventor： Naoki AKIYAMA ,  Susumu SAITO ,  Hiroyuki NAKAYAMA ,  Shigeru KASAI

IPC: G01R31/28 ,  G01R1/067 ,  G01R1/073

Abstract: In an inspection apparatus for inspecting an inspection target device formed on an inspection object, the inspection target device is a back-illuminated imaging device into which light is incident from a rear surface opposite to a side of a wiring layer. The inspection apparatus includes a stage having the inspection object placed such that the inspection object faces the rear surface. The stage includes a light transmitter made of a light-transmissive material. The inspection object is placed on the light transmitter below which a light illuminator is disposed. The light illuminator includes a flat light guide plate having a facing surface facing the inspection object. A light source is provided laterally outside the light guide plate configured to diffuse light emitted from the light source incident from a side end surface of the light guide plate, and to emit the light as planar light from the facing surface.