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公开(公告)号:US08698315B2
公开(公告)日:2014-04-15
申请号:US13596859
申请日:2012-08-28
申请人: Yoshiyuki Hata , Yutaka Nonomura , Teruhisa Akashi , Hirofumi Funabashi , Motohiro Fujiyoshi , Yoshiteru Omura
发明人: Yoshiyuki Hata , Yutaka Nonomura , Teruhisa Akashi , Hirofumi Funabashi , Motohiro Fujiyoshi , Yoshiteru Omura
CPC分类号: B81C1/00825 , B81B2201/0235 , B81B2203/033 , B81B2203/0392 , G01C19/5762 , G01C19/5769 , G01P15/0802 , G01P15/125 , G01P15/18 , G01P2015/0814 , G01P2015/084
摘要: When forming a trench of a narrow width in a thick semiconductor layer, a trench can be formed without the occurrence of semiconductor residue. In this Specification, a semiconductor device in which a trench is formed in a semiconductor layer is disclosed. In the semiconductor layer of the semiconductor device, a compensation pattern which compensates for sudden changes in the width of the trench is formed at a place at which the width of the trench changes suddenly. In the semiconductor layer of the above-described semiconductor device, since a compensation pattern is formed at a place at which the trench width changes suddenly, in the case where forming the trench using a deep RIE method, the occurrence of steep inclined portions arising from semiconductor residue can be prevented. Consequently, when forming a trench of a narrow width in a thick semiconductor layer, the occurrence of semiconductor residue can be prevented.
摘要翻译: 当在厚半导体层中形成窄宽度的沟槽时,可以形成沟槽而不会发生半导体残渣。 在本说明书中,公开了在半导体层中形成沟槽的半导体器件。 在半导体器件的半导体层中,在沟槽宽度急剧变化的地方形成补偿沟槽宽度突然变化的补偿图案。 在上述半导体器件的半导体层中,由于在沟槽宽度突然变化的地方形成补偿图案,所以在使用深RIE法形成沟槽的情况下,由于 可以防止半导体残渣。 因此,当在厚半导体层中形成窄宽度的沟槽时,可以防止发生半导体残渣。
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公开(公告)号:US08368196B2
公开(公告)日:2013-02-05
申请号:US12710571
申请日:2010-02-23
IPC分类号: H01L23/02
CPC分类号: B81B3/001 , B81B2201/025 , G01P15/125 , G01P15/18
摘要: The micro device includes a support substrate, and a movable structure configured to move with respect to the support substrate. At least one of the support substrate and the movable structure is provided with at least one protrusion protruding towards the other of the support substrate and the movable structure. Further, a base portion extending into the one of the support substrate and the movable structure is provided integrally with the at least one protrusion. With this configuration, the protrusion is securely held by the base portion, and the detachment of the protrusion can therefore be prevented even after repeated collisions between the support substrate and the movable structure via the protrusion.
摘要翻译: 微型装置包括支撑基板和被配置为相对于支撑基板移动的可移动结构。 支撑基板和可移动结构中的至少一个设置有至少一个朝着支撑基板和可移动结构中的另一个突出的突起。 此外,延伸到支撑基板和可移动结构中的一个的基部与所述至少一个突起一体设置。 通过这种构造,突起被基部牢固地保持,并且因此即使在支撑基板和可移动结构经由突起重复碰撞之后也能够防止突起的分离。
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公开(公告)号:US08816451B2
公开(公告)日:2014-08-26
申请号:US13035186
申请日:2011-02-25
申请人: Hirofumi Funabashi , Yutaka Nonomura , Yoshiyuki Hata , Motohiro Fujiyoshi , Teruhisa Akashi , Yoshiteru Omura
发明人: Hirofumi Funabashi , Yutaka Nonomura , Yoshiyuki Hata , Motohiro Fujiyoshi , Teruhisa Akashi , Yoshiteru Omura
摘要: In a MEMS structure, a first trench which penetrates the first layer, the second layer and the third layer is formed, and a second trench which penetrates the fifth layer, the forth layer and the third layer is formed. The first trench forms a first part of an outline of the movable portion in a view along the stacked direction. The second trench forms a second part of the outline of the movable portion in the view along the stacked direction. At least a part of the first trench overlaps with the first extending portion in the view along the stacked direction.
摘要翻译: 在MEMS结构中,形成贯穿第一层,第二层和第三层的第一沟槽,形成贯穿第五层,第四层和第三层的第二沟槽。 第一沟槽沿着堆叠的方向形成可动部分的轮廓的第一部分。 第二沟槽沿着堆叠方向在视图中形成可动部分的轮廓的第二部分。 第一沟槽的至少一部分沿着堆叠方向在视图中与第一延伸部分重叠。
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公开(公告)号:US08365597B2
公开(公告)日:2013-02-05
申请号:US12723971
申请日:2010-03-15
IPC分类号: G01P15/00
CPC分类号: G01C19/5719 , G01P2015/082
摘要: An apparatus with a second movable portion that moves along an x-axis direction and a z-axis direction and a first movable portion that only moves along the z-axis direction is disclosed. The apparatus is provided with a fixed portion fixed to a support portion, a plurality of first spring portions connected to the fixed portion, a first movable portion connected to the plurality of first spring portions, a second spring portion connected to the first movable portion, and a second movable portion connected to the second spring portion. A spring constant of each of the plurality of first spring portions in the z-axis direction is lower than spring constants of each of the plurality of first spring portions in the x-axis and a y-axis directions respectively, and a spring constant of the second spring portion in the x-axis direction is lower than spring constants of the second spring portion in the y-axis and the z-axis directions respectively. The first movable portion is configured to move along the z-axis but not to move along the x-axis and the y-axis nor to rotate around the z-axis, and the second movable portion is configured to move along the x-axis and the z-axis with respect to the support portion.
摘要翻译: 公开了一种具有沿x轴方向和z轴方向移动的第二可移动部分和仅沿着z轴方向移动的第一可动部分的装置。 该装置设置有固定到支撑部分的固定部分,连接到固定部分的多个第一弹簧部分,连接到多个第一弹簧部分的第一可动部分,连接到第一可动部分的第二弹簧部分, 以及与第二弹簧部连接的第二可动部。 多个第一弹簧部分中的每一个在z轴方向上的弹簧常数分别低于多个第一弹簧部分在x轴和y轴方向上的弹簧常数,弹簧常数 x轴方向上的第二弹簧部分分别低于第二弹簧部分在y轴和z轴方向上的弹簧常数。 第一可移动部分被配置为沿着z轴移动但不沿着x轴和y轴移动,也不围绕z轴旋转,并且第二可移动部分构造成沿x轴移动 和z轴相对于支撑部分。
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公开(公告)号:US08707784B2
公开(公告)日:2014-04-29
申请号:US13047274
申请日:2011-03-14
申请人: Teruhisa Akashi , Yutaka Nonomura , Motohiro Fujiyoshi , Hirofumi Funabashi , Yoshiyuki Hata , Yoshiteru Omura
发明人: Teruhisa Akashi , Yutaka Nonomura , Motohiro Fujiyoshi , Hirofumi Funabashi , Yoshiyuki Hata , Yoshiteru Omura
IPC分类号: G01C19/56
CPC分类号: G01C19/574 , G01P15/125 , G01P15/18 , G01P2015/082
摘要: A structure having a first movable portion displaced perpendicular to a substrate surface and a second movable portion displaced parallel to the substrate surface is realized by a laminated structure employing a nested structure for the first portion and the second portion. The laminated structure is provided with inner and outer movable portions. A y spring is connected to the outer portion, and the outer portion is supported in a y-axis direction by the y spring at a height apart from an outer substrate. A z spring is connected to the inner portion, and the inner portion is supported in a z-axis direction by the z spring at a height apart from the outer substrate. The outer portion and the z spring are at different heights from the substrate, and the z spring overpasses across the outer portion at a height apart from the outer movable portion.
摘要翻译: 具有垂直于基板表面移动的第一可移动部分和平行于基板表面移动的第二可移动部分的结构通过采用用于第一部分和第二部分的嵌套结构的层压结构实现。 层叠结构设置有内部和外部可移动部分。 y弹簧连接到外部,并且外部部分通过y弹簧以与外部基板隔开的高度在y轴方向上支撑。 z弹簧连接到内部,并且内部通过z弹簧以与外基板隔开的高度在z轴方向上支撑。 外部部分和z弹簧与基板处于不同的高度,并且z弹簧在与外部可移动部分分开的高度处超过外部部分。
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公开(公告)号:US09478503B2
公开(公告)日:2016-10-25
申请号:US14389103
申请日:2013-02-28
申请人: Mitsutoshi Makihata , Masayoshi Esashi , Shuji Tanaka , Masanori Muroyama , Hirofumi Funabashi , Yutaka Nonomura , Yoshiyuki Hata , Hitoshi Yamada , Takahiro Nakayama , Ui Yamaguchi
发明人: Mitsutoshi Makihata , Masayoshi Esashi , Shuji Tanaka , Masanori Muroyama , Hirofumi Funabashi , Yutaka Nonomura , Yoshiyuki Hata , Hitoshi Yamada , Takahiro Nakayama , Ui Yamaguchi
IPC分类号: H01L23/552 , H01L23/538 , B81B7/00 , H01L21/78 , H01L21/683 , H01L21/306 , H01L25/18 , H01L27/06 , H01L25/07 , H01L25/16 , B81C1/00 , H01L25/00 , H01L29/06
CPC分类号: H01L23/552 , B81B7/008 , B81C1/00238 , B81C2203/0792 , H01L21/3043 , H01L21/30625 , H01L21/6835 , H01L21/6836 , H01L21/76898 , H01L21/78 , H01L23/5386 , H01L25/072 , H01L25/16 , H01L25/18 , H01L25/50 , H01L27/0611 , H01L29/0657 , H01L2221/68327 , H01L2224/94 , H01L2924/0002 , H01L2924/00 , H01L2224/03
摘要: An integrated device with high insulation tolerance is provided. A groove having an inclined side surface is provided between adjacent devices. When a side where an electronic circuit or MEMS device is mounted is a front surface, the groove becomes narrower from the front surface to a back surface because of the inclined surface. A mold material (insulating material) is disposed inside the groove, so that the plurality of devices are mechanically joined together, being electrically insulated from one another. A line member that establishes an electrical conduction between the adjacent devices is formed to lie along the side surface and the bottom surface of the groove. To lead the line out to the backside, the bottom surface of the groove has a hole, so that the line member is exposed to the backside from the hole.
摘要翻译: 提供了具有高绝缘公差的集成器件。 在相邻的装置之间设有具有倾斜侧面的凹槽。 当安装电子电路或MEMS装置的一侧是前表面时,由于倾斜表面,凹槽从前表面变窄到后表面。 模具材料(绝缘材料)设置在凹槽内,使得多个装置机械地接合在一起,彼此电绝缘。 形成相邻器件之间形成电导通的线构件沿着沟槽的侧表面和底表面。 为了将线导出到背面,凹槽的底表面具有孔,使得线构件从孔的背面露出。
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公开(公告)号:US20060176043A1
公开(公告)日:2006-08-10
申请号:US11311182
申请日:2005-12-20
CPC分类号: G05F3/30
摘要: A reference voltage circuit includes an operational amplifier, a first fixed resistance resistor, a second fixed resistance resistor, a third fixed resistance resistor, a first diode and a second diode. The reference voltage circuit further includes a fourth fixed resistance resistor having an end connected to a non-inverting input terminal of the operational amplifier and the other end connected to the first diode. The reference voltage circuit is characterized by a value of the resistance of the fourth resistor being less than the resistance of the first resistor and a temperature coefficient of the fourth resistor being greater than any of the temperature coefficients of the first, second and third resistors.
摘要翻译: 参考电压电路包括运算放大器,第一固定电阻电阻,第二固定电阻电阻,第三固定电阻电阻,第一二极管和第二二极管。 参考电压电路还包括第四固定电阻电阻器,其端部连接到运算放大器的非反相输入端子,另一端连接到第一二极管。 参考电压电路的特征在于第四电阻器的电阻小于第一电阻器的电阻值,第四电阻器的温度系数大于第一,第二和第三电阻器的任何温度系数。
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公开(公告)号:US07888840B2
公开(公告)日:2011-02-15
申请号:US11448799
申请日:2006-06-08
申请人: Keiichi Shimaoka , Hirofumi Funabashi , Yasuichi Mitsushima , Toshiaki Nakagawa , Toshihiro Wakita , Shigeru Ando , Nobutaka Ono
发明人: Keiichi Shimaoka , Hirofumi Funabashi , Yasuichi Mitsushima , Toshiaki Nakagawa , Toshihiro Wakita , Shigeru Ando , Nobutaka Ono
摘要: A microphone that identifies the direction along which acoustic waves propagate with one diaphragm, and has superior durability is provided. The microphone includes a circular diaphragm supported at a center portion thereof. When the diaphragm receives acoustic waves, each position around the center thereof will vibrate with a phase depending upon the direction of the acoustic waves. First electrodes are arranged on one surface of the diaphragm and second electrodes are arranged facing corresponding first electrodes to form a first capacitor. Third electrodes are arranged on the other surface of the diaphragm and fourth electrodes are arranged facing corresponding third electrodes to form a second capacitor. A controller applies a voltage to the second capacitors so that the capacitance of the first capacitors will be constant and identifies the direction along which the acoustic waves propagate based on the difference in the voltages applied to each of the second capacitors.
摘要翻译: 一种麦克风,用于识别声波以一个隔膜传播的方向,并具有优异的耐久性。 麦克风包括在其中心部分处支撑的圆形隔膜。 当隔膜接收到声波时,围绕其中心的每个位置将根据声波的方向以相位振动。 第一电极布置在隔膜的一个表面上,并且第二电极被布置成面对相应的第一电极以形成第一电容器。 第三电极布置在隔膜的另一个表面上,第四电极被布置成面对相应的第三电极以形成第二电容器。 控制器向第二电容器施加电压,使得第一电容器的电容将是恒定的,并且基于施加到每个第二电容器的电压的差异来识别声波传播的方向。
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公开(公告)号:US4986131A
公开(公告)日:1991-01-22
申请号:US458538
申请日:1989-12-28
CPC分类号: G01L1/2281 , G01L9/0054 , G01L9/065
摘要: In a semiconductor strain detector, the temperature characteristic of the output of a zero-point temperature compensating circuit is added to the zero-point temperature characteristic of the output of a bridge circuit composed of strain gauges, to perform a zero-point temperature compensation of the final output. Further, two kinds of diffusion resistors having different surface impurity densities are used in each amplifying circuit to perform a sensitivity-temperature compensation in which a temperature coefficient of sensitivity is considered up to the second-order term.
摘要翻译: 在半导体应变检测器中,将零点温度补偿电路的输出的温度特性加到由应变计构成的桥式电路的输出的零点温度特性中,以进行零点温度补偿 最终输出。 此外,在每个放大电路中使用具有不同表面杂质浓度的两种扩散电阻器,以执行灵敏度温度补偿,其中灵敏度温度系数被考虑到二阶项。
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公开(公告)号:US06785117B2
公开(公告)日:2004-08-31
申请号:US10386100
申请日:2003-03-12
申请人: Minekazu Sakai , Toshiyuki Tsuchiya , Hirofumi Funabashi , Norio Fujitsuka , Yasuichi Mitsushima
发明人: Minekazu Sakai , Toshiyuki Tsuchiya , Hirofumi Funabashi , Norio Fujitsuka , Yasuichi Mitsushima
IPC分类号: H01G700
CPC分类号: G01P15/125 , G01P15/18 , G01P2015/0814 , G01P2015/082
摘要: A capacitive device includes a substrate, a movable electrode, and a fixed electrode. The movable electrode is located above a surface of the substrate and is movable with respect to the substrate along directions that are substantially orthogonal to the surface. The fixed electrode is stationary with respect to the substrate. When the movable electrode is displaced in a first direction that is substantially orthogonal to the surface, the total sum of area-distance quotients in the overlap between the electrodes remains substantially unchanged or decreases to provide a first reduction rate that is substantially zero or more. On the other hand, when the movable electrode is displaced in a second direction that is substantially opposite to the first direction, the total sum of area-distance quotients remains substantially unchanged or decreases to provide a second reduction rate that is substantially zero or more. The reduction rates are different from each other.
摘要翻译: 电容器件包括衬底,可动电极和固定电极。 可移动电极位于基板的表面上方并且能够沿与基板正交的方向相对于基板移动。 固定电极相对于基板是静止的。 当可移动电极在基本上与表面正交的第一方向上位移时,电极之间的重叠中的面积 - 距离商的总和基本上保持不变或减小,以提供基本为零或更大的第一减小率。 另一方面,当可移动电极在与第一方向基本相反的第二方向上移位时,面积 - 距离商的总和基本上保持不变或减小,从而提供基本为零或更大的第二减小率。 缩减率彼此不同。
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