公开(公告)号：US4986131A

公开(公告)日：1991-01-22

申请号：US458538

申请日：1989-12-28

申请人： Susumu Sugiyama ,  Shiro Yamashita ,  Hirofumi Funabashi

发明人： Susumu Sugiyama ,  Shiro Yamashita ,  Hirofumi Funabashi

IPC分类号： H01L29/84 ,  G01L1/22 ,  G01L9/00 ,  G01L9/06

CPC分类号： G01L1/2281 ,  G01L9/0054 ,  G01L9/065

摘要： In a semiconductor strain detector, the temperature characteristic of the output of a zero-point temperature compensating circuit is added to the zero-point temperature characteristic of the output of a bridge circuit composed of strain gauges, to perform a zero-point temperature compensation of the final output. Further, two kinds of diffusion resistors having different surface impurity densities are used in each amplifying circuit to perform a sensitivity-temperature compensation in which a temperature coefficient of sensitivity is considered up to the second-order term.

摘要翻译： 在半导体应变检测器中，将零点温度补偿电路的输出的温度特性加到由应变计构成的桥式电路的输出的零点温度特性中，以进行零点温度补偿 最终输出。 此外，在每个放大电路中使用具有不同表面杂质浓度的两种扩散电阻器，以执行灵敏度温度补偿，其中灵敏度温度系数被考虑到二阶项。

公开(公告)号：US07217645B2

公开(公告)日：2007-05-15

申请号：US10372392

申请日：2003-02-25

申请人： Shiro Yamashita ,  Masahide Harada ,  Kenichi Yamamoto ,  Munehiro Yamada ,  Ryosuke Kimoto

发明人： Shiro Yamashita ,  Masahide Harada ,  Kenichi Yamamoto ,  Munehiro Yamada ,  Ryosuke Kimoto

IPC分类号： H01L21/44

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3436 ,  H05K3/3463 ,  H01L2224/29099 ,  H01L2924/00014 ,  H01L2924/00

摘要： Solder is connected to the electrodes of the circuit board by using a temperature profile with a constant fusion temperature, a connection interface strength evaluation test is carried out on the soldered joints to obtain an appropriate reflow range free of decreases in the strength at the connection interface. On the basis of the appropriate reflow range obtained and using as the basis the chemical compound thickness which is determined uniquely by heat load, an appropriate reflow range in an optional temperature profile with one temperature peak is obtained. By carrying out connection in this appropriate reflow range, soldered joints can be obtained without decreases in the connection interface strength in the large-scale production stage.

摘要翻译： 通过使用恒定熔融温度的温度分布将焊料连接到电路板的电极，在焊接接头上进行连接界面强度评估测试，以获得在连接界面处强度没有降低的适当回流范围 。 基于获得的适当的回流范围和以热负荷唯一确定的化合物厚度为基准，获得具有一个温度峰值的任选温度曲线中的适当回流范围。 通过在适当的回流范围内实现连接，可以在大规模生产阶段的连接界面强度不降低的情况下获得焊接接头。

公开(公告)号：US5879646A

公开(公告)日：1999-03-09

申请号：US771834

申请日：1996-12-23

申请人： Ithuo Orihara ,  Moriyuki Fukushima ,  Eisaku Mogi ,  Shiro Yamashita

发明人： Ithuo Orihara ,  Moriyuki Fukushima ,  Eisaku Mogi ,  Shiro Yamashita

IPC分类号： A62D3/00 ,  B01D53/34 ,  B01D53/68 ,  B01D53/54

CPC分类号： B01D53/685

摘要： A waste gas stream containing toxic NF.sub.3 and optionally other gases, such as acidic fluoride gases, for example, HF, SiF.sub.4, MoF.sub.6 and WF.sub.6 is first treated with particles or ribbons of a Cr-containing Fe alloy at about 300.degree.-600.degree. C. to remove the NF.sub.3 content and, if desired, subsequently with an alkaline neutralizing agent in the form of pellets to remove the acidic fluoride contents, if any; said alloy containing preferably about 16-26% Cr and being used in a form of bed packed with said ribbons.

摘要翻译： 含有有毒的NF3和任选的其它气体（如酸性氟化物气体，例如HF，SiF 4，MoF 6和WF 6）的废气流首先在约300-600℃用含Cr的Fe合金的颗粒或带进行处理 如果需要，随后用颗粒形式的碱性中和剂除去NF 3含量，以除去酸性氟化物含量（如果有的话）; 所述合金优选含有约16-26％的Cr，并且以填充有所述带的床的形式使用。

公开(公告)号：US4101848A

公开(公告)日：1978-07-18

申请号：US734466

申请日：1976-10-21

申请人： Shiro Yamashita

发明人： Shiro Yamashita

IPC分类号： H03B5/32 ,  G04F5/06 ,  H01G5/06 ,  H01G5/16 ,  H03B1/00 ,  H03B1/04 ,  H03B5/36 ,  H03H3/04 ,  H03H9/02 ,  H03K3/03

CPC分类号： G04F5/066 ,  H01G5/06 ,  H01G5/16 ,  H03B5/36 ,  H03H3/04 ,  H03K3/0307 ,  H03B2200/0018 ,  H03B2200/0088 ,  H03B2201/011 ,  H03B2202/04

摘要： An oscillator for producing an output signal having a predetermined frequency for use in an electronic timepiece. The oscillator comprises a miniature crystal vibrator having a high resonant frequency, a case housing the crystal vibrator, an integrated circuit comprising an oscillator circuit with the crystal vibrator, and a trimmer condenser for adjusting the high resonant frequency. The trimmer condenser is formed on an external recess portion of said case, and is connected with the crystal vibrator and integrated circuit by a circuit having low stray capacitances. The oscillator is therefor highly insensitive to external electric fields.

公开(公告)号：US08796563B2

公开(公告)日：2014-08-05

申请号：US12696762

申请日：2010-01-29

申请人： Ukyo Ikeda ,  Masato Nakamura ,  Shiro Yamashita

发明人： Ukyo Ikeda ,  Masato Nakamura ,  Shiro Yamashita

IPC分类号： H01L23/49 ,  H05K1/03 ,  H05K1/16 ,  H05K1/11 ,  H01L23/48 ,  H01L29/40 ,  H05K7/10

CPC分类号： H01L23/49811 ,  H01L21/50 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/4847 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/1306 ,  H01L2924/13091 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00

摘要： In ultrasonic bonding of a metal terminal to a substrate pad, a thin buffer metal layer which is formed of a soft metal or a highly slidable metal is interposed between a terminal edge and a pad so as to prevent direct contact between an end of the terminal and the pad upon bonding. This makes it possible to prevent abrasion and a crack in the pad at the end of the terminal caused by pressure and an ultrasonic wave upon the ultrasonic bonding. This makes it possible to realize a compact bonded structure with high reliability.

摘要翻译： 在金属端子与衬底焊盘的超声波接合中，由软金属或高度可滑动的金属形成的薄缓冲金属层插入在端子边缘和焊盘之间，以防止端子的端部之间的直接接触 和粘合时的垫。 这使得可以防止在超声波接合时由压力和超声波引起的端子端部处的焊盘的磨损和裂纹。 这使得可以实现具有高可靠性的紧凑的结合结构。

公开(公告)号：US07554039B2

公开(公告)日：2009-06-30

申请号：US10535857

申请日：2003-06-20

申请人： Takehide Yokozuka ,  Masahide Harada ,  Shiro Yamashita ,  Kaoru Uchiyama ,  Shuji Eguchi ,  Masahiko Asano ,  Koji Sato

发明人： Takehide Yokozuka ,  Masahide Harada ,  Shiro Yamashita ,  Kaoru Uchiyama ,  Shuji Eguchi ,  Masahiko Asano ,  Koji Sato

IPC分类号： H05K1/00

CPC分类号： H05K1/021 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/056 ,  H05K1/182 ,  H05K3/3436 ,  H05K3/4608 ,  H05K2201/10734 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In an electronic device having an interposer substrate as an MCM structure, heat dissipation properties are enhanced while the reliability of joint between the interposer substrate and a motherboard is maintained. In the invention, a metal core base material of great heat capacity and high thermal conductivity is used for both the interposer substrate and the motherboard. Furthermore, a part where a core metal is exposed is provided on at least one of the interposer substrate and the motherboard. A solder joint pad is directly formed on the core metal exposed part, and the interposer substrate is solder-joined to the motherboard.

摘要翻译： 在具有作为MCM结构的插入器基板的电子设备中，提高了散热性能，同时保持了插入器基板和母板之间的接合的可靠性。 在本发明中，中间层基板和母板两者都使用具有高热容量和高导热性的金属芯基材。 此外，在内插基板和母板的至少一个上设置有芯金属露出的部分。 在芯金属露出部上直接形成焊点焊盘，并将插入基板与母板焊接。

公开(公告)号：USD534548S1

公开(公告)日：2007-01-02

申请号：US29243448

申请日：2005-11-23

申请人： Seiji Urano ,  Toshiaki Kikui ,  Toshihiko Matsuda ,  Kazuhiro Seguchi ,  Shiro Yamashita

设计人： Seiji Urano ,  Toshiaki Kikui ,  Toshihiko Matsuda ,  Kazuhiro Seguchi ,  Shiro Yamashita

公开(公告)号：US20060163745A1

公开(公告)日：2006-07-27

申请号：US11340562

申请日：2006-01-27

申请人： Shiro Yamashita ,  Daisuke Tsuji ,  Akihiko Hatasawa ,  Hidehiro Takeshima

发明人： Shiro Yamashita ,  Daisuke Tsuji ,  Akihiko Hatasawa ,  Hidehiro Takeshima

IPC分类号： H01L23/48 ,  H05K1/16

CPC分类号： H01L25/0657 ,  H01L23/145 ,  H01L23/5383 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a semiconductor device according to the present invention, a first bare chip, and a second bare chip having a wider principal surface than that of the first bare chip are connected to one principal surface and the other principal surface of an interposer substrate, respectively. In the semiconductor device, a resin having a larger coefficient of linear expansion than that of the second bare chip is applied to a backgrind surface (a principal surface at an opposite side to the interposer substrate) of the second bare chip, thereby preventing the second bare chip from cracking due to warpage of the interposer substrate.

摘要翻译： 在根据本发明的半导体器件中，具有比第一裸芯片更宽的主表面的第一裸芯片和第二裸芯片分别连接到插入器基板的一个主表面和另一主表面。 在半导体装置中，将具有比第二裸芯片的线膨胀系数大的树脂施加到第二裸芯片的背面研磨表面（与内插基板的相反侧的主表面），从而防止第二裸芯片 裸芯片由于内插器基板的翘曲而破裂。

公开(公告)号：US20060151877A1

公开(公告)日：2006-07-13

申请号：US11146044

申请日：2005-06-07

申请人： Shiro Yamashita ,  Yoichi Abe ,  Kenichi Yamamoto ,  Ryosuke Kimoto ,  Hiroshi Kawakubo

发明人： Shiro Yamashita ,  Yoichi Abe ,  Kenichi Yamamoto ,  Ryosuke Kimoto ,  Hiroshi Kawakubo

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11822 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K3/067 ,  H05K3/244 ,  H05K3/3463 ,  H05K2201/0305 ,  H05K2203/0361 ,  H05K2203/1476 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In order to inhibit the connection failure due to the degradation of the connection interface strength of the electrode pad and the warp thereof in the semiconductor device having an electrode pad, a metal layer formed on the electrode pad, and a metal bump formed on the metal layer, in the present invention, gold (Au) is contained in the metal layer, the metal bump is made of solder mainly made of Sn and designed to have an average height H of 100 μm or less per unit area in the electrode pad, and the concentration of Au of the metal layer dissolved in the solder is set to 1.3×10−3 (Vol %) or less. More preferably, the metal bump contains palladium (Pd), and the solder coating for forming the metal bump on the electrode pad is performed by using the dipping and the paste printing in combination.

摘要翻译： 为了抑制由于在具有电极焊盘的半导体器件中电极焊盘的连接界面强度的劣化及其翘曲导致的连接故障，形成在电极焊盘上的金属层和形成在金属上的金属凸块 在本发明中，在金属层中含有金（Au），金属凸块由主要由Sn制成的焊料制成，并且设计成在电极焊盘中的每单位面积的平均高度H为100mum以下， 并且溶解在焊料中的金属层的Au浓度设定为1.3×10 -3（Vol％）以下。 更优选地，金属凸块包含钯（Pd），并且通过组合使用浸渍和糊印来进行用于在电极焊盘上形成金属凸块的焊料涂层。

公开(公告)号：US06739045B2

公开(公告)日：2004-05-25

申请号：US10192478

申请日：2002-07-09

申请人： Motoko Kimura ,  Takeshi Miitsu ,  Takeshi Takahashi ,  Kaoru Katayama ,  Shiro Yamashita

发明人： Motoko Kimura ,  Takeshi Miitsu ,  Takeshi Takahashi ,  Kaoru Katayama ,  Shiro Yamashita

IPC分类号： H05K334

CPC分类号： B23K1/018 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49815 ,  Y10T29/49822

摘要： The present invention provides a method for removing solder adhering to an LSI. In this method, a plate-shaped first member for causing molten solder to adhere thereto is mounted on top of a heater. An LSI is placed on top of the first member with the surface on which solder is attached facing downward. A second member for adding a load to the LSI is placed on top of the LSI. The heater is heated up to heat the first member and the LSI, and to melt the solder. The molten solder is transferred to the first member. A suction mechanism is positioned at a location a predetermined distance away from the top surface of the second member. The second member and the LSI are attracted by the suction mechanism, and the LSI is pulled away from the first member. The solder is thereby removed from the LSI.

摘要翻译： 本发明提供一种去除附着在LSI上的焊料的方法。 在该方法中，将用于使熔融焊料粘附到其上的板状第一构件安装在加热器的顶部。 将LSI放置在第一构件的顶部上，其上焊接有焊料的表面朝下。 用于向LSI添加负载的第二构件放置在LSI的顶部。 将加热器加热以加热第一构件和LSI，并熔化焊料。 熔融的焊料被转移到第一部件。 抽吸机构定位在距离第二构件的顶表面预定距离的位置。 第二部件和LSI被吸引机构吸引，LSI被从第一部件拉出。 从而从LSI中除去焊料。