公开(公告)号：US09320143B2

公开(公告)日：2016-04-19

申请号：US13845325

申请日：2013-03-18

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Cheng-Ming Weng ,  Wei-Ming Cheng ,  Han-Pei Huang

IPC: H05K1/11 ,  H05K3/42 ,  H05K3/00

CPC classification number: H05K1/115 ,  H05K3/0032 ,  H05K3/42 ,  H05K3/426 ,  H05K2201/09563 ,  H05K2201/09709 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49165

Abstract: A wiring board includes a substrate, a first conductor layer, a second conductor layer, and a through-via conductor. The substrate has a first surface, a second surface, and at least one through-via. The first conductor layer is formed on the first surface, and the second conductor layer is formed on the second surface. The through-via conductor is formed in the through-via for electrically connecting to the first conductor layer and the second conductor layer. The through-via has a first depressed portion exposed in the first surface, a second depressed portion exposed in the second surface, and a tunnel portion between the first depressed portion and the second depressed portion for connecting the first depressed portion and the second depressed portion. The first depressed portion and the second depressed, portion are non-coaxial.

Abstract translation: 布线基板包括基板，第一导体层，第二导体层和通孔导体。 衬底具有第一表面，第二表面和至少一个通孔。 第一导体层形成在第一表面上，第二导体层形成在第二表面上。 通孔导体形成在用于电连接到第一导体层和第二导体层的通孔中。 通孔具有暴露在第一表面中的第一凹陷部分，暴露在第二表面中的第二凹部，以及在第一凹陷部分和第二凹陷部分之间的用于连接第一凹陷部分和第二凹陷部分的隧道部分 。 第一凹陷部分和第二凹陷部分是非同轴的。

公开(公告)号：US20150266806A1

公开(公告)日：2015-09-24

申请号：US14729060

申请日：2015-06-03

Applicant: Unimicron Technology Corp.

Inventor： Han-Pei Huang

IPC: C07C213/02 ,  C07C205/38

CPC classification number: C07C213/02 ,  C07C205/38 ,  C07C213/00 ,  C07C217/90 ,  C07C2603/74 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1071

Abstract: A diamine monomer with a large side chain R is provided. The large side chain would interrupt the symmetry and regularity of diamine monomer. The diamine monomer has the general formula shown as formula (V) below: The functional group R includes α-substitution cycloalkene with at least a tertiary carbon atom, cycloalkene with at least a tertiary carbon atom, cycloalkane with at least a tertiary carbon atom, α-substitution phenyl, phenyl, α-substitution naphthalyl, naphthalyl, α-substitution phenanthrenyl, phenanthrenyl, α-substitution anthracenyl, anthracenyl, α-substitution adamantyl, adamantyl, α-substitution diamantyl and diamantyl.

Abstract translation: 提供具有大侧链R的二胺单体。 大侧链会破坏二胺单体的对称性和规则性。 二胺单体具有如下式（V）所示的通式：官能团R包括至少具有叔碳原子的α-取代环烯烃，至少具有叔碳原子的环烯烃，至少具有叔碳原子的环烷烃， α-取代苯基，苯基，α-取代萘基，萘基，α-取代菲基，菲基，α-取代蒽基，蒽基，α-取代金刚烷基，金刚烷基，α-取代二硬脂基和二金刚烷基。

公开(公告)号：US09288917B2

公开(公告)日：2016-03-15

申请号：US14073873

申请日：2013-11-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4679 ,  H05K1/0268 ,  H05K3/4652 ,  H05K2201/09063 ,  H05K2201/09918 ,  Y10T29/49165

Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having two surfaces opposite to each other and a via connecting there between is provided. Next, a patterned circuit layer is formed on each of the surfaces by using the via as an alignment target. Each patterned circuit layer includes a concentric-circle pattern. Next, a first stacking layer is formed on each of the surfaces. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. Next, a second stacking layer is formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.

Abstract translation: 多层电路板的制造方法包括以下步骤。 首先，提供具有彼此相对的两个表面的基板和连接在其间的通孔。 接下来，通过使用通孔作为对准对象，在每个表面上形成图案化电路层。 每个图案化电路层包括同心圆图案。 接下来，在每个表面上形成第一层叠层。 然后，形成第一层叠层的第一贯通孔和从同心圆图案的中心的第一同心圆正交地突出的基板。 接着，在第一层叠层上形成第二层叠层。 之后，形成第一，第二堆叠层和基板的第二通孔穿透区域，其中同心圆图案的中心的第二同心圆正交地突出在其上。

公开(公告)号：US09198303B2

公开(公告)日：2015-11-24

申请号：US14073869

申请日：2013-11-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang ,  Ai-Hwa Lim

IPC: B05D5/12 ,  H05K3/40 ,  H05K3/46 ,  H05K1/02 ,  B05D7/00 ,  C23C18/16 ,  H05K1/11 ,  H05K3/24 ,  H05K3/12

CPC classification number: H05K3/4038 ,  B05D5/12 ,  B05D7/50 ,  C23C18/1655 ,  H05K1/0269 ,  H05K1/0298 ,  H05K1/111 ,  H05K3/0032 ,  H05K3/0097 ,  H05K3/12 ,  H05K3/244 ,  H05K3/46 ,  H05K3/4644 ,  H05K3/4679 ,  H05K2203/107 ,  H05K2203/1536 ,  Y10T29/49165

Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, two core layers are compressed to form a substrate having two surfaces opposite to each other. Then, a via connecting the surfaces is formed. A patterned circuit layer including a concentric-circle pattern is then formed on each surface by using the via as an alignment target. Next, a first stacking layer is formed on each surface. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. A second stacking layer is then formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.

Abstract translation: 多层电路板的制造方法包括以下步骤。 首先，将两个芯层压缩以形成具有彼此相对的两个表面的基板。 然后，形成连接表面的通孔。 然后通过使用通孔作为对准靶，在每个表面上形成包括同心圆图案的图案化电路层。 接下来，在每个表面上形成第一层叠层。 然后，形成第一层叠层的第一贯通孔和从同心圆图案的中心的第一同心圆正交地突出的基板。 然后在每个第一堆叠层上形成第二层叠层。 之后，形成第一，第二堆叠层和基板的第二通孔穿透区域，其中同心圆图案的中心的第二同心圆正交地突出在其上。

公开(公告)号：US09074051B2

公开(公告)日：2015-07-07

申请号：US13845311

申请日：2013-03-18

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Han-Pei Huang

IPC: C08G73/10 ,  C07D407/12

CPC classification number: C08G73/1053 ,  C07D407/12 ,  C08G73/10 ,  C08G73/1046

Abstract: A dianhydride monomer having a large side chain R is provided. The large side chain would interrupt the symmetry and regularity of diamine monomer. The diamine monomer has the general formula shown as formula (I) below: The functional group R includes α-substitution cycloalkene having at least a tertiary carbon atom, cycloalkene having at least a tertiary carbon atom, cycloalkane having at least a tertiary carbon atom, α-substitution phenyl, phenyl, α-substitution naphthalyl, naphthalyl, α-substitution phenanthrenyl, phenanthrenyl, α-substitution anthracenyl, anthracenyl, α-substitution adamantyl, adamantyl, α-substitution adamantyl and adamantyl.

Abstract translation: 提供具有大侧链R的二酐单体。 大侧链会破坏二胺单体的对称性和规则性。 二胺单体具有如下式（I）所示的通式：官能团R包括至少具有叔碳原子的α-取代环烯烃，至少具有叔碳原子的环烯烃，至少具有叔碳原子的环烷烃， α-取代苯基，苯基，α-取代萘基，萘基，α-取代菲基，菲基，α-取代蒽基，蒽基，α-取代金刚烷基，金刚烷基，α-取代金刚烷基和金刚烷基。

公开(公告)号：US20150121694A1

公开(公告)日：2015-05-07

申请号：US14073873

申请日：2013-11-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang

IPC: H05K3/46

CPC classification number: H05K3/4679 ,  H05K1/0268 ,  H05K3/4652 ,  H05K2201/09063 ,  H05K2201/09918 ,  Y10T29/49165

Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having two surfaces opposite to each other and a via connecting there between is provided. Next, a patterned circuit layer is formed on each of the surfaces by using the via as an alignment target. Each patterned circuit layer includes a concentric-circle pattern. Next, a first stacking layer is formed on each of the surfaces. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. Next, a second stacking layer is formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.

Abstract translation: 多层电路板的制造方法包括以下步骤。 首先，提供具有彼此相对的两个表面的基板和连接在其间的通孔。 接下来，通过使用通孔作为对准对象，在每个表面上形成图案化电路层。 每个图案化电路层包括同心圆图案。 接下来，在每个表面上形成第一层叠层。 然后，形成第一层叠层的第一贯通孔和从同心圆图案的中心的第一同心圆正交地突出的基板。 接着，在第一层叠层上形成第二层叠层。 之后，形成第一，第二堆叠层和基板的第二通孔穿透区域，其中同心圆图案的中心的第二同心圆正交地突出在其上。

公开(公告)号：US09095083B2

公开(公告)日：2015-07-28

申请号：US14074655

申请日：2013-11-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang

IPC: B05D5/12 ,  H05K3/46 ,  H05K3/00 ,  H05K3/10 ,  H05K3/40 ,  B05D7/00 ,  H05K3/12 ,  H05K1/02 ,  H05K3/24 ,  H05K1/11 ,  C23C18/16

CPC classification number: H05K1/0298 ,  B05D5/12 ,  B05D7/50 ,  C23C18/165 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/0038 ,  H05K3/12 ,  H05K3/244 ,  H05K3/40 ,  H05K3/46 ,  H05K3/4679 ,  H05K2203/1476

Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having a first via penetrating the substrate is provided. Next, a patterned circuit layer is formed on a surface of the substrate by using the first via as an alignment target. The first patterned circuit layer includes a first concentric-circle pattern surrounding the first via. Next, a first stacking layer is formed on the surface. Then, a first through hole penetrating regions where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected on the first stacking layer and the substrate is formed. Next, a second stacking layer is formed on the first stacking layer. Afterward, a second through hole penetrating regions where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected on of the first, the second stacking layers and the substrate is formed.

Abstract translation: 多层电路板的制造方法包括以下步骤。 首先，提供具有穿过基板的第一通孔的基板。 接下来，通过使用第一通孔作为取向对象，在基板的表面上形成图案化电路层。 第一图案化电路层包括围绕第一通孔的第一同心圆图案。 接下来，在表面上形成第一层叠层。 然后，形成从同心圆图案的中心的第一同心圆正交地突出在第一堆叠层和基板上的第一通孔贯穿区域。 接着，在第一堆叠层上形成第二层叠层。 之后，形成从同心圆图案的中心的第二同心圆正交地突出在第一，第二堆叠层和基板上的第二通孔贯穿区域。

公开(公告)号：US09045597B2

公开(公告)日：2015-06-02

申请号：US13845463

申请日：2013-03-18

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Han-Pei Huang

IPC: C08G69/26 ,  C08G73/10

CPC classification number: C08G73/1071 ,  C08G73/1021 ,  C08G73/1032 ,  C08G73/1046 ,  C08L79/08

Abstract: A polyimide compound with a large side chain R and R′ is provided. The large side chain would interrupt the symmetry and regularity of polyimide compound. The polyimide compound has the general formula shown as formula (I) below: The functional group R and R′ are selecting individually from the group consisting: α-substitution cycloalkene with at least a tertiary carbon atom, cycloalkene with at least a tertiary carbon atom, cycloalkane with at least a tertiary carbon atom, α-substitution phenyl, phenyl, α-substitution naphthalyl, naphthalyl, α-substitution phenanthrenyl, phenanthrenyl, α-substitution anthracenyl, anthracenyl, α-substitution adamantyl, adamantyl, α-substitution diamantyl and diamantyl.

Abstract translation: 提供了具有大侧链R和R'的聚酰亚胺化合物。 大侧链会中断聚酰亚胺化合物的对称性和规则性。 聚酰亚胺化合物具有下式（I）所示的通式：官能团R和R'分别选自：具有至少叔碳原子的α-取代环烯烃，至少具有叔碳原子的环烯烃 具有至少叔碳原子的环烷烃，α-取代苯基，苯基，α-取代萘基，萘基，α-取代菲基，菲基，α-取代蒽基，蒽基，α-取代金刚烷基，金刚烷基，α-取代二金刚烷基和 双金刚烷

公开(公告)号：US20150125625A1

公开(公告)日：2015-05-07

申请号：US14074655

申请日：2013-11-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang

IPC: H05K3/46 ,  H05K3/10 ,  H05K3/00

CPC classification number: H05K1/0298 ,  B05D5/12 ,  B05D7/50 ,  C23C18/165 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/0038 ,  H05K3/12 ,  H05K3/244 ,  H05K3/40 ,  H05K3/46 ,  H05K3/4679 ,  H05K2203/1476

Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having a first via penetrating the substrate is provided. Next, a patterned circuit layer is formed on a surface of the substrate by using the first via as an alignment target. The first patterned circuit layer includes a first concentric-circle pattern surrounding the first via. Next, a first stacking layer is formed on the surface. Then, a first through hole penetrating regions where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected on the first stacking layer and the substrate is formed. Next, a second stacking layer is formed on the first stacking layer. Afterward, a second through hole penetrating regions where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected on of the first, the second stacking layers and the substrate is formed.

Abstract translation: 多层电路板的制造方法包括以下步骤。 首先，提供具有穿过基板的第一通孔的基板。 接下来，通过使用第一通孔作为取向对象，在基板的表面上形成图案化电路层。 第一图案化电路层包括围绕第一通孔的第一同心圆图案。 接下来，在表面上形成第一层叠层。 然后，形成从同心圆图案的中心的第一同心圆正交地突出在第一堆叠层和基板上的第一通孔贯穿区域。 接着，在第一堆叠层上形成第二层叠层。 之后，形成从同心圆图案的中心的第二同心圆正交地突出在第一，第二堆叠层和基板上的第二通孔贯穿区域。

公开(公告)号：US20150121693A1

公开(公告)日：2015-05-07

申请号：US14073869

申请日：2013-11-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang ,  Ai-Hwa Lim

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4038 ,  B05D5/12 ,  B05D7/50 ,  C23C18/1655 ,  H05K1/0269 ,  H05K1/0298 ,  H05K1/111 ,  H05K3/0032 ,  H05K3/0097 ,  H05K3/12 ,  H05K3/244 ,  H05K3/46 ,  H05K3/4644 ,  H05K3/4679 ,  H05K2203/107 ,  H05K2203/1536 ,  Y10T29/49165

Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, two core layers are compressed to form a substrate having two surfaces opposite to each other. Then, a via connecting the surfaces is formed. A patterned circuit layer including a concentric-circle pattern is then formed on each surface by using the via as an alignment target. Next, a first stacking layer is formed on each surface. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. A second stacking layer is then formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.

Abstract translation: 多层电路板的制造方法包括以下步骤。 首先，将两个芯层压缩以形成具有彼此相对的两个表面的基板。 然后，形成连接表面的通孔。 然后通过使用通孔作为对准靶，在每个表面上形成包括同心圆图案的图案化电路层。 接下来，在每个表面上形成第一层叠层。 然后，形成第一层叠层的第一贯通孔和从同心圆图案的中心的第一同心圆正交地突出的基板。 然后在每个第一堆叠层上形成第二层叠层。 之后，形成第一，第二堆叠层和基板的第二通孔穿透区域，其中同心圆图案的中心的第二同心圆正交地突出在其上。