公开(公告)号：US11973054B2

公开(公告)日：2024-04-30

申请号：US17577406

申请日：2022-01-18

申请人： Stroke Precision Advanced Engineering Co., Ltd.

发明人： Yu-Min Huang ,  Sheng Che Huang ,  Chingju Lin ,  Wei-Hao Wang

IPC分类号： B23K1/00 ,  B23K1/005 ,  H01L23/00 ,  B23K101/40

CPC分类号： H01L24/75 ,  B23K1/0053 ,  B23K1/0056 ,  H01L24/80 ,  H01L24/81 ,  B23K2101/40 ,  H01L2224/75263 ,  H01L2224/75283 ,  H01L2224/75705 ,  H01L2224/7598 ,  H01L2224/80224 ,  H01L2224/8023 ,  H01L2224/80815 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81224 ,  H01L2224/8123 ,  H01L2224/81815

摘要： A method for transferring an electronic device includes steps as follows. A flexible carrier is provided and has a surface with a plurality of electronic devices disposed thereon. A target substrate is provided corresponding to the surface of the flexible carrier. A pin is provided, and a pin end thereof presses on another surface of the flexible carrier without the electronic devices disposed thereon, so that the flexible carrier is deformed, causing at least one of the electronic devices to move toward the target substrate and to be in contact with the target substrate. A beam is provided to transmit at least a portion of the pin and emitted from the pin end to melt a solder. The electronic device is fixed on the target substrate by soldering. The pin is moved to restore the flexible carrier to its original shape, allowing the electronic device fixed by soldering to separate from the carrier.

公开(公告)号：US20230387069A1

公开(公告)日：2023-11-30

申请号：US17976133

申请日：2022-10-28

申请人： LASERSSEL CO., LTD.

发明人： Jae Joon CHOI ,  Byung Roc KIM ,  Eun Sung CHOI ,  Hwan Soo YEO ,  Seung Hyun SEO

IPC分类号： H01L23/00

CPC分类号： H01L24/75 ,  H01L2224/75102 ,  H01L2224/75263 ,  H01L2224/75301

摘要： The present invention relates to a laser reflow apparatus. More particularly, the present invention relates to a compression-type laser reflow apparatus with a vacuum chamber that enables mass processing by simultaneously pressuring and reflowing a plurality of electronic components by performing a laser reflow process by pressing with a light-transmitting pressing member and irradiating a laser beam inside the vacuum chamber, and that effectively prevents the generation of voids by fumes during soldering, so that the defect rate of the laser reflow process is greatly improved.

公开(公告)号：US11823924B2

公开(公告)日：2023-11-21

申请号：US17460971

申请日：2021-08-30

申请人： Kioxia Corporation

发明人： Aoi Suzuki

IPC分类号： H01L21/67 ,  H01L23/00

CPC分类号： H01L21/67207 ,  H01L21/67092 ,  H01L21/67115 ,  H01L24/75 ,  H01L24/83 ,  H01L24/94 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29186 ,  H01L2224/32145 ,  H01L2224/75263 ,  H01L2224/75802 ,  H01L2224/83224 ,  H01L2224/83896 ,  H01L2224/83986 ,  H01L2924/4015 ,  H01L2924/40503

摘要： In one embodiment, a semiconductor manufacturing apparatus includes a reformer configured to partially reform a first substrate to form a reformed layer between a first portion and a second portion in the first substrate. The apparatus further includes a joiner configured to form a joining layer between the first portion and a second substrate to join the first portion and the second substrate. The apparatus further includes a remover configured to remove the second portion from a surface of the second substrate while making the first portion remain on the surface of the second substrate by separating the first portion and the second portion.

公开(公告)号：US11682650B2

公开(公告)日：2023-06-20

申请号：US17533234

申请日：2021-11-23

申请人： National Pingtung University of Science and Technology

发明人： Wei-Hua Lu

IPC分类号： B23K3/00 ,  B23K1/00 ,  H01L23/00 ,  B23K1/005 ,  B23K3/08 ,  B23K3/04 ,  B23K101/40

CPC分类号： H01L24/75 ,  B23K1/005 ,  B23K1/0016 ,  B23K3/04 ,  B23K3/08 ,  B23K2101/40 ,  H01L2224/759 ,  H01L2224/7555 ,  H01L2224/7598 ,  H01L2224/75252 ,  H01L2224/75253 ,  H01L2224/75263 ,  H01L2224/75283

摘要： A heat assisted flip chip bonding apparatus includes a semiconductor assembly having a substrate and a chip, a heating source and a press and cover assembly having a cover element and press elements. The chip is disposed above the substrate and includes conductors which contact with conductive pads on the substrate. The heating source is provided to emit a heated light which illuminates the chip via an opening of the cover element. The press elements are located between the cover element and the semiconductor assembly and each includes an elastic unit and a pressing unit. Both ends of the elastic unit are connected to the cover element and the pressing unit respectively, and the pressing unit is provided to press a back surface of the chip.

公开(公告)号：US09508572B2

公开(公告)日：2016-11-29

申请号：US14288054

申请日：2014-05-27

申请人： SHIBUYA KOGYO CO., LTD.

发明人： Hiroyuki Yasuyoshi

IPC分类号： B23K26/22 ,  H01L21/67 ,  H01L23/00 ,  B23K26/06

CPC分类号： H01L21/67144 ,  B23K26/06 ,  H01L24/75 ,  H01L2224/7501 ,  H01L2224/75263 ,  H01L2224/75745 ,  H01L2224/75824 ,  Y10T29/53178

摘要： A boding device includes a light guiding part that guides laser beam oscillated from a laser oscillator, a bonding head that heats a chip with the laser beam, and a bonding head moving part that moves the bonding head between a supply position and a bonding position. The laser oscillator is separated from the bonding head. The light guiding part includes an irradiation barrel that is provided in the vicinity of the bonding position and, a shutter part that is provided in the irradiation barrel, and a light receiving part that is provided in the bonding head and guides the laser beam to the chip. When the bonding head moving part moves the bonding head to the bonding position, the shutter part is opened so that the laser beam from the irradiation barrel is guided to the bonding head through the light receiving part.

摘要翻译： 引导装置包括：导光部，其引导从激光振荡器振荡的激光束;激光束加热芯片的接合头;以及接合头移动部，其在接合位置和接合位置之间移动接合头。 激光振荡器与接合头分离。 导光部包括设置在接合位置附近的照射筒和设置在照射筒中的遮光部，以及设置在接合头中的光接收部，并将激光束引导到 芯片。 当接合头移动部分将接合头移动到接合位置时，打开快门部分，使得来自照射筒的激光束通过光接收部分被引导到接合头。

公开(公告)号：US20160001488A1

公开(公告)日：2016-01-07

申请号：US14768607

申请日：2014-02-17

申请人： KHS GMBH

发明人： Ludwig Clüsserath

IPC分类号： B29C49/42 ,  B65B3/02 ,  B29C49/46 ,  B65B55/10 ,  B65B55/08 ,  B65B3/10 ,  B65B31/02

CPC分类号： B29C49/4252 ,  B23K1/0016 ,  B23K1/0056 ,  B23K26/1462 ,  B23K2101/42 ,  B29C49/14 ,  B29C49/16 ,  B29C49/46 ,  B29C2049/465 ,  B29C2049/4682 ,  B29C2791/006 ,  B29C2791/007 ,  B29K2067/003 ,  B29L2031/7158 ,  B65B3/022 ,  B65B3/10 ,  B65B31/025 ,  B65B55/08 ,  B65B55/10 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13101 ,  H01L2224/16057 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/75252 ,  H01L2224/75263 ,  H01L2224/75745 ,  H01L2224/81121 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81224 ,  H01L2224/81986 ,  H01L2225/06551 ,  H01L2924/014 ,  H01L2924/00014

摘要： An apparatus for transforming a preform into a container filled with liquid filling material includes a mold that forms a mold head, a sterilization system, a chamber that is common to a group of mold heads, an evacuation system that is connected to the chamber, and conduit lines, each of which connects a mold head to the chamber. The sterilization system sterilizes the interior of the preform while it is in sealing engagement with the mold head. The evacuation system creates a vacuum in the preform. Liquid filling material enters the preform under pressure and causes it to transform into a container.

摘要翻译： 一种用于将预成型体转换成填充有液体填充材料的容器的设备包括形成模具头的模具，灭菌系统，一组模具头共同的腔室，连接到腔室的抽空系统，以及 导管线，其中每一个将模头连接到腔室。 灭菌系统在与模头密封接合的同时对预成型件的内部进行灭菌。 抽空系统在预制件中产生真空。 液体填充材料在压力下进入预成型件并使其变成容器。

公开(公告)号：US20150364446A1

公开(公告)日：2015-12-17

申请号：US14763898

申请日：2014-01-22

申请人： PAC TECH-PACKAGING TECHNOLOGIES GMBH

发明人： Ghassem Azdasht

IPC分类号： H01L25/065 ,  H01L25/00 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L25/0655 ,  B23K1/0016 ,  B23K1/0056 ,  B23K26/1462 ,  B23K2101/42 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/13101 ,  H01L2224/16057 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/75252 ,  H01L2224/75263 ,  H01L2224/75745 ,  H01L2224/81121 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2225/06551 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00012

摘要： The invention relates to a chip arrangement (18) comprising a terminal substrate (12) and a plurality of semiconductor substrates (1) which are arranged on the terminal substrate, in particular chips, wherein terminal faces (5) arranged on a contact surface of the chips (1) are connected to terminal faces on a contact surface (14) of the terminal substrate (12), wherein the chips (1) extend parallel with a lateral edge and transversally with their contact surface to the contact surface of the terminal substrate (12), wherein vias (13) are arranged in the terminal substrate, which connect external contacts (15) arranged on an external contact side to terminal faces formed as internal contacts (14) on the contact surface of the terminal substrate, wherein terminal faces of the chips, which are arranged adjacent to the lateral edge, are connected to the internal contacts of the terminal substrate by way of a re-melted solder material deposit (16). Furthermore, the invention relates to a method for producing a chip arrangement (18).

摘要翻译： 本发明涉及一种芯片装置（18），其包括端子基板（12）和布置在端子基板上的多个半导体基板（1），特别是芯片，其中端子面（5）布置在 芯片（1）连接到端子基板（12）的接触表面（14）上的端面，其中芯片（1）与侧边缘平行延伸并且与其接触表面横向延伸到端子的接触表面 衬底（12），其中通孔（13）布置在端子衬底中，其将布置在外部接触侧上的外部触点（15）连接到形成为端子衬底的接触表面上的内部触点（14）的端子表面，其中 通过重新熔化的焊料沉积物（16）将与芯片侧端相邻排列的端子面连接到端子基板的内部触头。 此外，本发明涉及一种用于制造芯片布置（18）的方法。

公开(公告)号：US20090283210A1

公开(公告)日：2009-11-19

申请号：US11922714

申请日：2006-06-22

申请人： Uwe Augst

发明人： Uwe Augst

IPC分类号： B32B37/12

CPC分类号： H01L24/83 ,  H01L21/563 ,  H01L24/29 ,  H01L24/75 ,  H01L24/90 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75262 ,  H01L2224/75263 ,  H01L2224/81801 ,  H01L2224/83871 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00012 ,  H01L2224/0401

摘要： The invention relates to a method and an apparatus for permanently joining integrated circuits (1) to at least one substrate (2) arranged therebelow, by means of an adhesive (3) which is arranged therebetween and around the edges of the integrated circuits (1), wherein, in order to cure the adhesive (3), light (19) with a wavelength selected from a wavelength range of 280-900 nm is applied to the upper side and/or underside of the arrangement consisting of the substrate (2) and one of the integrated circuits (1), in order to polymerize the adhesive (3).

摘要翻译： 本发明涉及一种用于通过粘合剂（3）将集成电路（1）永久地连接到布置在其下方的至少一个基板（2）的方法和装置，所述粘合剂（3）布置在其间并且围绕集成电路（1）的边缘 ），其中为了固化粘合剂（3），将波长范围为280-900nm的波长的光（19）施加到由基板（2）组成的布置的上侧和/或下侧 ）和集成电路（1）中的一个，以便使粘合剂（3）聚合。

公开(公告)号：US4278867A

公开(公告)日：1981-07-14

申请号：US974595

申请日：1978-12-29

申请人： Swie-In Tan

发明人： Swie-In Tan

IPC分类号： H05K3/34 ,  B23K1/005 ,  B23K26/08 ,  B23K26/12 ,  B23K26/20 ,  B29C65/00 ,  B29C65/16 ,  H01L21/60 ,  H01L23/32 ,  B23K26/02

CPC分类号： B23K26/123 ,  B23K1/0056 ,  B23K26/032 ,  B23K26/08 ,  B23K26/082 ,  B23K26/12 ,  B23K26/127 ,  H01L24/75 ,  H01L24/81 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75102 ,  H01L2224/75253 ,  H01L2224/75263 ,  H01L2224/759 ,  H01L2224/7598 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01094 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  Y10S148/093

摘要： Defective chips are removed from a substrate package. The package is cleaned. Replacement chips with solder bearing elements are replaced in the position(s) of the defective chip(s). Silicon chips are less damaged by heating with light wavelengths substantially shorter than infrared radiation, when the radiation is directed upon the upper chip surface and the lower chip surface carries circuitry and solder balls. Radiation is absorbed by the upper chip surface and converted there directly to heat, protecting the circuitry below. An argon-ion laser beam confined to a given chip is directed upon the upper surface of the chip to be soldered in place. A thin laser beam can be scanned under computer control across a chip to heat the areas of a chip above solder balls. Automatic temperature control of the chip can be provided by a heat detector or chip condition detector and a program controller in a feedback loop controlling laser power.

摘要翻译： 从衬底封装中去除有缺陷的芯片。 包装被清洁。 具有焊料轴承元件的替换芯片在有缺陷的芯片的位置被替换。 当辐射指向上芯片表面并且下芯片表面承载电路和焊球时，硅芯片通过加热而比红外辐射短得多的损坏。 辐射被上芯片表面吸收，并在那里直接转化为热，保护下面的电路。 限于给定芯片的氩离子激光束被引导到待焊接的芯片的上表面就位。 可以在计算机控制下跨芯片扫描薄激光束，以加热焊球上方的芯片区域。 芯片的自动温度控制可以由热检测器或芯片状态检测器和控制激光功率的反馈回路中的程序控制器提供。

公开(公告)号：US20240120311A1

公开(公告)日：2024-04-11

申请号：US18230825

申请日：2023-08-07

申请人： Samsung Display Co., LTD.

发明人： FUTOSHI YOSHIDA ,  JONGHYUP KIM ,  JUN HA PARK ,  JINPYUNG LEE ,  DONGHYUN HAN

IPC分类号： H01L23/00

CPC分类号： H01L24/75 ,  H01L2224/75263 ,  H01L2224/75314 ,  H01L2924/401

摘要： A bonding apparatus includes: a chamber including a light transmission part configured to transmit light irradiated onto a substrate on which at least one chip is disposed; and a light generation part disposed on the chamber and configured to irradiate the light. The light transmission part may include an absorption prevention layer, in which a plurality of through-holes are defined, and a light diffusion layer that diffuses the light passing through the plurality of through-holes to reduce heat generation in the light transmission part and uniformly irradiate the light passing through the light transmission part onto the substrate on which at least one chip is disposed.