On the fly automatic wafer centering method and apparatus

    公开(公告)号:US10134623B2

    公开(公告)日:2018-11-20

    申请号:US15209497

    申请日:2016-07-13

    Abstract: Substrate processing apparatus including a wafer transport apparatus with a transport arm including an end effector, an arm pose deterministic feature integral to the substrate transport apparatus and disposed so that a static detection sensor of the substrate processing apparatus detects at least one edge of the at least one arm pose deterministic feature on the fly with radial motion of the transport arm, and a controller configured so that detection of the edge effects a determination of a proportion factor identifying at least a thermal expansion variance of the transport arm on the fly and includes a kinematic effects resolver configured to determine, from the detection of the edge on the fly, a discrete relation between the determined proportion factor and each different discrete variance respective to each different link of the transport arm determining at least the thermal expansion variance of the transport arm on the fly.

    METHOD AND APPARATUS FOR SUBSTRATE TRANSPORT
    93.
    发明申请

    公开(公告)号:US20180308728A1

    公开(公告)日:2018-10-25

    申请号:US15889811

    申请日:2018-02-06

    Abstract: A substrate processing apparatus includes a linearly elongated substantially hexahedron shaped substrate transport chamber having linearly elongated sides of the hexahedron and at least one end wall of the hexahedron substantially orthogonal to the linearly elongated sides. A plurality of process modules are linearly arrayed along the at least one of the linearly elongated sides. A substrate transport arm is pivotally mounted within the substrate transport chamber so that a pivot axis of the substrate transport arm is mounted, fixed relative to the substrate transport chamber. The substrate transport arm has a three link—three joint SCARA configuration, of which one link is an end effector with at least one substrate holder, that is articulate to transport the substrate, and held by the at least one substrate holder, in and out of the substrate transport chamber through the end and side substrate transport openings.

    Sample selector
    94.
    发明授权

    公开(公告)号:US10101352B2

    公开(公告)日:2018-10-16

    申请号:US15496989

    申请日:2017-04-25

    Abstract: An apparatus includes a frame configured to hold sample holders in an array, a longitudinal axis of the sample holder extending outward of an array plane; a drive section connected to the frame; at least one transfer arm rotatably connected to the drive section so that each transfer arm rotates about a rotation axis oriented substantially parallel with the longitudinal axis and includes a sample holder gripper; and at least one push member movably connected to the drive section and being distinct from the sample holder gripper and configured for linear movement along the longitudinal axis, the at least one push member being configured so that engagement with at least a bottom or top surface of the sample holder effects longitudinal translation of the sample holder for one or more of capture and release of the sample holder by the respective transfer arm in the longitudinal direction.

    Substrate handling system for aligning and orienting substrates during a transfer operation

    公开(公告)号:US09691651B2

    公开(公告)日:2017-06-27

    申请号:US14089439

    申请日:2013-11-25

    Inventor: Matthew W. Coady

    CPC classification number: H01L21/68 H01L21/68707

    Abstract: A system for sensing, orienting, and transporting wafers in an automated wafer handling process that reduces the generation of particles and contamination so that the wafer yield is increased. The system includes a robotic arm for moving a wafer from one station to a destination station, and an end-effector connected to an end of the robotic arm for receiving the wafer. The end-effector includes a mechanism for gripping the wafer, a direct drive motor for rotating the wafer gripping mechanism, and at least one sensor for sensing the location and orientation of the wafer. A control processor calculates the location of the center and the notch of the wafer based on measurements by the sensor(s) and generates an alignment signal for rotating the wafer gripping mechanism so that the wafer is oriented at a predetermined position on the end-effector while the robotic arm is moving to another station.

    TIME-OPTIMAL TRAJECTORIES FOR ROBOTIC TRANSFER DEVICES

    公开(公告)号:US20170087720A1

    公开(公告)日:2017-03-30

    申请号:US15376119

    申请日:2016-12-12

    Abstract: A time-optimal trajectory generation method, for a robotic manipulator haying a transport path with at least one path segment, comprising generating a forward time-optimal trajectory of the manipulator along the at least one path segment from a start point of the at least one path segment towards an end point of the at least one path segment, generating a reverse time-optimal trajectory of the manipulator along the at least one path segment from the end point towards the start point of the at least one path segment, and combining the time-optimal forward and reverse trajectories to obtain a complete time optimal trajectory, where the forward and reverse trajectories of the at least one path segment are blended together with a smoothing bridge joining the time-optimal forward and reverse trajectories in a position-velocity reference frame with substantially no discontinuity between the time-optimal forward and reverse trajectories.

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