Methods for forming nickel oxide films for use with resistive switching memory devices
    91.
    发明授权
    Methods for forming nickel oxide films for use with resistive switching memory devices 有权
    用于形成用于电阻式开关存储器件的氧化镍膜的方法

    公开(公告)号:US08283214B1

    公开(公告)日:2012-10-09

    申请号:US11963656

    申请日:2007-12-21

    Abstract: Methods for forming a NiO film on a substrate for use with a resistive switching memory device are presenting including: preparing a nickel ion solution; receiving the substrate, where the substrate includes a bottom electrode, the bottom electrode utilized as a cathode; forming a Ni(OH)2 film on the substrate, where the forming the Ni(OH)2 occurs at the cathode; and annealing the Ni(OH)2 film to form the NiO film, where the NiO film forms a portion of a resistive switching memory element. In some embodiments, methods further include forming a top electrode on the NiO film and before the forming the Ni(OH)2 film, pre-treating the substrate. In some embodiments, methods are presented where the bottom electrode and the top electrode are a conductive material such as: Ni, Pt, Ir, Ti, Al, Cu, Co, Ru, Rh, a Ni alloy, a Pt alloy, an Ir alloy, a Ti alloy, an Al alloy, a Cu alloy, a Co alloy, an Ru alloy, and an Rh alloy.

    Abstract translation: 在电阻式切换存储装置使用的基板上形成NiO膜的方法包括:制备镍离子溶液; 接收衬底,其中衬底包括底部电极,用作阴极的底部电极; 在衬底上形成Ni(OH)2膜,其中在阴极处形成Ni(OH)2; 并且还原Ni(OH)2膜以形成NiO膜,其中NiO膜形成电阻式开关存储元件的一部分。 在一些实施例中,方法还包括在NiO膜上形成顶部电极,并且在形成Ni(OH)2膜之前,预处理衬底。 在一些实施例中,呈现了底部电极和顶部电极为导电材料的方法,例如:Ni,Pt,Ir,Ti,Al,Cu,Co,Ru,Rh,Ni合金,Pt合金,Ir 合金,Ti合金,Al合金,Cu合金,Co合金,Ru合金和Rh合金。

    Method and System of Improved Reliability Testing
    92.
    发明申请
    Method and System of Improved Reliability Testing 有权
    改进可靠性测试方法与系统

    公开(公告)号:US20120119768A1

    公开(公告)日:2012-05-17

    申请号:US12948257

    申请日:2010-11-17

    CPC classification number: H01L22/14

    Abstract: A method and system of improved reliability testing includes providing a first substrate and a second substrate, each substrate comprising only a first metallization layer; processing regions on a first substrate by combinatorially varying at least one of materials, unit processes, and process sequences; performing a first reliability test on the processed regions on the first substrate to generate first results; processing regions on a second substrate in a combinatorial manner by varying at least one of materials, unit processes, and process sequences based on the first results of the first reliability test; performing a second reliability test on the processed regions on the second substrate to generate second results; and determining whether the first substrate and the second substrate meet a predetermined quality threshold based on the second results.

    Abstract translation: 改进的可靠性测试的方法和系统包括提供第一衬底和第二衬底,每个衬底仅包括第一金属化层; 通过组合地改变材料,单元过程和工艺顺序中的至少一个来处理第一衬底上的处理区域; 对所述第一基板上的所述经处理区域进行第一可靠性测试以产生第一结果; 基于第一可靠性测试的第一结果,通过改变材料,单元过程和过程序列中的至少一个来以组合的方式处理第二基板上的区域; 对所述第二基板上的所述经处理区域进行第二可靠性测试以产生第二结果; 以及基于所述第二结果来确定所述第一基板和所述第二基板是否满足预定质量阈值。

    High Throughput Quantum Efficiency Combinatorial Characterization Tool and Method for Combinatorial Solar Test Substrates
    93.
    发明申请
    High Throughput Quantum Efficiency Combinatorial Characterization Tool and Method for Combinatorial Solar Test Substrates 失效
    组合太阳能测试基板的高通量量子效率组合表征工具和方法

    公开(公告)号:US20110279810A1

    公开(公告)日:2011-11-17

    申请号:US12952855

    申请日:2010-11-23

    CPC classification number: G01R31/26 G01N21/55 G01R31/2607 H02S50/10

    Abstract: Simultaneous measurement of an internal quantum efficiency and an external quantum efficiency of a solar cell using an emitter that emits light; a three-way beam splitter that splits the light into solar cell light and reference light, wherein the solar cell light strikes the solar cell; a reference detector that detects the reference light; a reflectance detector that detects reflectance light, wherein the reflectance light comprises a portion of the solar cell light reflected off the solar cell; a source meter operatively coupled to the solar cell; a multiplexer operatively coupled to the solar cell, the reference detector, and the reflectance detector; and a computing device that simultaneously computes the internal quantum efficiency and the external quantum efficiency of the solar cell.

    Abstract translation: 使用发射光的同时测量太阳能电池的内部量子效率和外部量子效率; 三光束分离器,其将光分解成太阳能电池光和参考光,其中太阳能电池光照射到太阳能电池; 检测参考光的参考检测器; 反射光检测器,其检测反射光,其中所述反射光包括从太阳能电池反射的太阳能电池光的一部分; 可操作地耦合到太阳能电池的源计量器; 可操作地耦合到太阳能电池,参考检测器和反射检测器的多路复用器; 以及同时计算太阳能电池的内部量子效率和外部量子效率的计算装置。

    METHODS FOR FORMING RESISTIVE SWITCHING MEMORY ELEMENTS
    95.
    发明申请
    METHODS FOR FORMING RESISTIVE SWITCHING MEMORY ELEMENTS 有权
    形成电阻式开关记忆元件的方法

    公开(公告)号:US20110201149A1

    公开(公告)日:2011-08-18

    申请号:US13096719

    申请日:2011-04-28

    Abstract: Resistive switching memory elements are provided that may contain electroless metal electrodes and metal oxides formed from electroless metal. The resistive switching memory elements may exhibit bistability and may be used in high-density multi-layer memory integrated circuits. Electroless conductive materials such as nickel-based materials may be selectively deposited on a conductor on a silicon wafer or other suitable substrate. The electroless conductive materials can be oxidized to form a metal oxide for a resistive switching memory element. Multiple layers of conductive materials can be deposited each of which has a different oxidation rate. The differential oxidization rates of the conductive layers can be exploited to ensure that metal oxide layers of desired thicknesses are formed during fabrication.

    Abstract translation: 提供电阻式开关存储器元件,其可以包含由无电金属形成的化学金属电极和金属氧化物。 电阻式开关存储器元件可以表现出双稳态,并且可以用于高密度多层存储器集成电路中。 诸如镍基材料的无电导电材料可以选择性地沉积在硅晶片或其它合适的衬底上的导体上。 无电导电材料可以被氧化以形成用于电阻式开关存储元件的金属氧化物。 可以沉积多层导电材料,每层具有不同的氧化速率。 可以利用导电层的差异氧化速率来确保在制造期间形成所需厚度的金属氧化物层。

    Methods for forming resistive switching memory elements
    96.
    发明授权
    Methods for forming resistive switching memory elements 有权
    形成电阻式开关存储元件的方法

    公开(公告)号:US07972897B2

    公开(公告)日:2011-07-05

    申请号:US11702966

    申请日:2007-02-05

    Abstract: Resistive switching memory elements are provided that may contain electroless metal electrodes and metal oxides formed from electroless metal. The resistive switching memory elements may exhibit bistability and may be used in high-density multi-layer memory integrated circuits. Electroless conductive materials such as nickel-based materials may be selectively deposited on a conductor on a silicon wafer or other suitable substrate. The electroless conductive materials can be oxidized to form a metal oxide for a resistive switching memory element. Multiple layers of conductive materials can be deposited each of which has a different oxidation rate. The differential oxidization rates of the conductive layers can be exploited to ensure that metal oxide layers of desired thicknesses are formed during fabrication.

    Abstract translation: 提供电阻式开关存储器元件,其可以包含由无电金属形成的化学金属电极和金属氧化物。 电阻式开关存储器元件可以表现出双稳态,并且可以用于高密度多层存储器集成电路中。 诸如镍基材料的无电导电材料可以选择性地沉积在硅晶片或其它合适的衬底上的导体上。 无电导电材料可以被氧化以形成用于电阻式开关存储元件的金属氧化物。 可以沉积多层导电材料,每层具有不同的氧化速率。 可以利用导电层的差异氧化速率来确保在制造期间形成所需厚度的金属氧化物层。

    CVD flowable gap fill
    98.
    发明授权
    CVD flowable gap fill 有权
    CVD可流动缝隙填充

    公开(公告)号:US07915139B1

    公开(公告)日:2011-03-29

    申请号:US12508461

    申请日:2009-07-23

    Abstract: The present invention meets these needs by providing improved methods of filling gaps. In certain embodiments, the methods involve placing a substrate into a reaction chamber and introducing a vapor phase silicon-containing compound and oxidant into the chamber. Reactor conditions are controlled so that the silicon-containing compound and the oxidant are made to react and condense onto the substrate. The chemical reaction causes the formation of a flowable film, in some instances containing Si—OH, Si—H and Si—O bonds. The flowable film fills gaps on the substrates. The flowable film is then converted into a silicon oxide film, for example by plasma or thermal annealing. The methods of this invention may be used to fill high aspect ratio gaps, including gaps having aspect ratios ranging from 3:1 to 10:1.

    Abstract translation: 本发明通过提供填充间隙的改进方法来满足这些需要。 在某些实施方案中,所述方法包括将基材置于反应室中并将气相含硅化合物和氧化剂引入所述​​室中。 控制反应器条件使得含硅化合物和氧化剂反应并冷凝到基底上。 化学反应导致形成可流动的膜,在某些情况下,含有Si-OH,Si-H和Si-O键。 可流动膜填充基板上的间隙。 然后将可流动膜转化成氧化硅膜,例如通过等离子体或热退火。 本发明的方法可用于填充高纵横比间隙,包括具有3:1至10:1的纵横比的间隙。

    Methods for forming nonvolatile memory elements with resistive-switching metal oxides
    99.
    发明授权
    Methods for forming nonvolatile memory elements with resistive-switching metal oxides 有权
    用电阻式开关金属氧化物形成非易失性存储元件的方法

    公开(公告)号:US07629198B2

    公开(公告)日:2009-12-08

    申请号:US11714334

    申请日:2007-03-05

    Abstract: Nonvolatile memory elements are provided that have resistive switching metal oxides. The nonvolatile memory elements may be formed by depositing a metal-containing material on a silicon-containing material. The metal-containing material may be oxidized to form a resistive-switching metal oxide. The silicon in the silicon-containing material reacts with the metal in the metal-containing material when heat is applied. This forms a metal silicide lower electrode for the nonvolatile memory element. An upper electrode may be deposited on top of the metal oxide. Because the silicon in the silicon-containing layer reacts with some of the metal in the metal-containing layer, the resistive-switching metal oxide that is formed is metal deficient when compared to a stoichiometric metal oxide formed from the same metal.

    Abstract translation: 提供具有电阻开关金属氧化物的非易失性存储元件。 非易失性存储元件可以通过将含金属的材料沉积在含硅材料上而形成。 含金属材料可以被氧化以形成电阻式开关金属氧化物。 当施加热量时,含硅材料中的硅与含金属材料中的金属反应。 这形成用于非易失性存储元件的金属硅化物下电极。 上部电极可以沉积在金属氧化物的顶部。 由于含硅层中的硅与含金属层中的一些金属反应,与由相同金属形成的化学计量的金属氧化物相比,形成的电阻 - 开关金属氧化物是金属缺陷的。

    Techniques to Improve Characteristics of Processed Semiconductor Substrates
    100.
    发明申请
    Techniques to Improve Characteristics of Processed Semiconductor Substrates 有权
    提高加工半导体基板特性的技术

    公开(公告)号:US20090124081A1

    公开(公告)日:2009-05-14

    申请号:US12268387

    申请日:2008-11-10

    CPC classification number: H01L21/288 H01L21/02074 H01L21/7684 H01L21/76849

    Abstract: Techniques to improve characteristics of processed semiconductor substrates are described, including cleaning a substrate using a preclean process, the substrate comprising a dielectric region and a conductive region, introducing a hydroquinone to the substrate after cleaning the substrate using the preclean operation, and forming a capping layer over the conductive region of the substrate after introducing the hydroquinone.

    Abstract translation: 描述了改进处理的半导体衬底的特性的技术,包括使用预清洗工艺清洗衬底,所述衬底包括电介质区域和导电区域,在使用预清洗操作清洁衬底之后,将氢醌引入衬底,并形成封盖 在引入氢醌之后,在衬底的导电区域上方。

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