公开(公告)号：US20230240007A1

公开(公告)日：2023-07-27

申请号：US18001681

申请日：2021-05-27

Applicant: NITTO DENKO CORPORATION

Inventor： Daigo TSUBAI ,  Naoki SHIBATA ,  Hiroaki MACHITANI

IPC: H05K1/05 ,  H05K1/11

CPC classification number: H05K1/05 ,  H05K1/11

Abstract: A wiring circuit board includes a metal support substrate, an insulating layer, and a conductive layer in this order in a thickness direction, and has an edge portion extending in a first direction. The edge portion includes a main structure portion and partially includes a partial structure portion. In the main structure portion, the metal support substrate has a substrate extension portion extending outwardly with respect to the insulating layer in a second direction perpendicular to the first direction and the thickness direction. In the partial structure portion, the insulating layer has an insulating layer extension portion extending outwardly with respect to the metal support substrate in the second direction.

公开(公告)号：US11707917B2

公开(公告)日：2023-07-25

申请号：US17603153

申请日：2020-04-16

Applicant: NITTO DENKO CORPORATION

Inventor： Muneshige Nakagawa ,  Sho Uchida ,  Shinsuke Ikishima

IPC: B32B27/08 ,  B32B7/022 ,  B32B27/18 ,  B32B27/30 ,  B32B27/32

CPC classification number: B32B7/022 ,  B32B27/08 ,  B32B27/18 ,  B32B27/302 ,  B32B27/32 ,  B32B2250/246 ,  B32B2250/40 ,  B32B2264/1022 ,  B32B2270/00 ,  B32B2307/51 ,  B32B2307/704 ,  B32B2307/732 ,  B32B2307/746 ,  B32B2555/02

Abstract: Provided is a multilayer co-extruded film comprising at least two different elasticity layers with at least one first elasticity layer and at least one second elasticity layer having higher elasticity than the at least one first elasticity layer, wherein the first elasticity layer comprises a combination of an olefin-based elastomer and a crystalline olefin polymer, and wherein the residual strain after 100% elongation during 10 min at 23° C. of the multilayer co-extruded film is less than 15%.

公开(公告)号：US20230220247A1

公开(公告)日：2023-07-13

申请号：US18009136

申请日：2021-06-09

Applicant: NITTO DENKO CORPORATION

Inventor： Hirofumi KATAMI ,  Masamichi MATSUMOTO ,  Takahiro NONAKA

IPC: C09J7/38 ,  C09J11/06 ,  C09J7/28 ,  B32B15/02 ,  G06F3/041 ,  G06F3/044

CPC classification number: C09J7/385 ,  C09J11/06 ,  C09J7/28 ,  B32B15/02 ,  G06F3/0412 ,  G06F3/044 ,  B32B15/085

Abstract: An object of the present invention is to provide a pressure-sensitive adhesive sheet enables a pressure-sensitive adhesive layer to be formed, wherein the pressure-sensitive adhesive layer has a low dielectric constant, is excellent in level difference conformability while maintaining adhesive strength and adhesion reliability at high temperatures, and suitable for laminating a metal mesh film and the like. The pressure-sensitive adhesive sheet of the present invention is a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer containing an acrylic polymer (A) and a hydrogenated polyolefinic resin (B) that exhibits liquid flowability at 25° C. The pressure-sensitive adhesive layer has a dielectric constant at a frequency of 1 MHz of from 2.3 to 3.5. The pressure-sensitive adhesive sheet has a 180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 65° C. of 6 N/20 mm or more. In the pressure-sensitive adhesive sheet, the proportion of the 180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 65° C. to the 180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 25° C. (180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 65° C./180° peel adhesive strength to a glass plate at a tensile speed of 300 mm/minute at 25° C.×100) is 30 or more.

公开(公告)号：US11696506B2

公开(公告)日：2023-07-04

申请号：US16497969

申请日：2018-03-08

Applicant: NITTO DENKO CORPORATION

Inventor： Masaharu Arimoto ,  Hironobu Machinaga ,  Masato Katsuda ,  Manami Kurose

IPC: H01L41/08 ,  H01L41/047 ,  H01L41/113 ,  H01L41/187 ,  H01L41/316 ,  H01L41/319 ,  H10N30/00 ,  H10N30/076 ,  H10N30/079 ,  H10N30/30 ,  H10N30/853 ,  H10N30/87

CPC classification number: H10N30/10516 ,  H10N30/076 ,  H10N30/079 ,  H10N30/302 ,  H10N30/853 ,  H10N30/878

Abstract: A piezoelectric device has a layered structure in which at least a first electrode, a plastic layer, an orientation control layer, a piezoelectric layer, and a second electrode are stacked, wherein the orientation control layer is amorphous, and the piezoelectric layer with a thickness of 20 nm to 250 nm is provided over the orientation control layer, the piezoelectric layer having a wurtzite crystal structure, and wherein the orientation control layer and the piezoelectric layer are provided between the first electrode and the second electrode.

公开(公告)号：US11678828B2

公开(公告)日：2023-06-20

申请号：US17442030

申请日：2020-03-17

Applicant: Nitto Denko Corporation

Inventor： Ryota Masuda

IPC: A61B5/257

CPC classification number: A61B5/257

Abstract: A stick-on biosensor capable of acquiring satisfactory biological information is provided. The stick-on biosensor includes a pressure-sensitive adhesive layer and an electrode part, said pressure-sensitive adhesive layer having a stick-on surface to be attached to a subject; a base material layer provided on the side opposite the stick-on surface of the pressure-sensitive adhesive layer; and an electronic device provided on the base material layer and configured to process a biological signal acquired through the electrode part. A structure, which includes the pressure-sensitive adhesive layer, the electrode part, and the base material layer, has a flexural rigidity of 0.010 [MPa·mm3/mm] or higher, and an adhesive strength of the electrode part to adhere to the subject is greater than 0.6 [N/cm2] and less than or equal to 5.0 [N/cm2].

公开(公告)号：US20230189440A1

公开(公告)日：2023-06-15

申请号：US18056095

申请日：2022-11-16

Applicant: NITTO DENKO CORPORATION

Inventor： Kanayo SAWASHI ,  Akihito MATSUTOMI

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/115 ,  H05K3/4084 ,  H05K3/4623 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2203/107

Abstract: A wiring circuit board includes an insulating layer having a via penetrating in a thickness direction, a first conductive layer disposed on a one-side surface in the thickness direction of the insulating layer, a second conductive layer disposed on the other-side surface in the thickness direction of the insulating layer, and a conductive portion disposed on an inner peripheral surface of the via and electrically connecting the first and second conductive layers. Length L of 1 µm-10 µm inclusive, is measured by: drawing a segment joining first and second connection points from respectively, the one-side surface to the other-side surface in the thickness direction of the insulating layer and the inner peripheral surface in the cross-sectional view; identifying an outermost position farthest outward from the segment on the inner peripheral surface in the cross-sectional view; and measuring the length as the shortest distance from the segment to the outermost position.

公开(公告)号：US20230183436A1

公开(公告)日：2023-06-15

申请号：US17923970

申请日：2021-04-30

Applicant: NITTO DENKO CORPORATION

Inventor： Kenichi EGUCHI ,  Aika ISHII ,  Haruka ONA ,  Hikaru YANO ,  Hiroyuki FUJITA

IPC: C08J7/046 ,  C09D183/04 ,  C08J7/04

CPC classification number: C08J7/046 ,  C09D183/04 ,  C08J7/0427 ,  C08J2383/04 ,  C08J2467/03

Abstract: The present invention relates to a coating material containing a resin component and at least one kind of oil component P, in which the oil component P can exude out from a cured or dried coating film layer to which the coating material has been applied when a temperature drops to a predetermined value or less, a wetting parameter is 0.5 (J/cm3)1/2 or less, and a gel fraction of the coating film layer is 30% or more.

公开(公告)号：US20230167336A1

公开(公告)日：2023-06-01

申请号：US17920228

申请日：2021-03-22

Applicant: NITTO DENKO CORPORATION

Inventor： Mizuho NAGATA ,  Yu TACHIKAWA ,  Tomokazu TAKAHASHI ,  Satoshi HONDA

IPC: C09J7/38

CPC classification number: C09J7/38 ,  C09J2301/312 ,  C09J2301/408

Abstract: Provided is a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a peelable manner, the pressure-sensitive adhesive sheet being free from requiring high-output laser light irradiation at the time of the peeling of the adherend. The pressure-sensitive adhesive sheet of the present invention includes a pressure-sensitive adhesive layer containing a UV absorber, wherein the pressure-sensitive adhesive layer has a first surface and a second surface opposed to the first surface, and wherein a maximum value S1 of a detection intensity of the UV absorber by time-of-flight secondary ion mass spectrometry (TOF-SIMS) in a range of from the first surface to a depth of 1 μm in a thickness direction and a detection intensity C of the UV absorber by the TOF-SIMS at a center point in the thickness direction of the pressure-sensitive adhesive layer satisfy a relationship: S1/C≥1.1.

公开(公告)号：US11660796B2

公开(公告)日：2023-05-30

申请号：US16918442

申请日：2020-07-01

Applicant: NITTO DENKO CORPORATION

Inventor： Yoshinori Kono ,  Akifumi Kido ,  Makoto Azukizawa

IPC: B29C48/08 ,  B29C48/305 ,  B29C44/20 ,  B29K105/24 ,  B29K23/00 ,  B29K105/04

CPC classification number: B29C48/305 ,  B29C44/20 ,  B29C48/08 ,  B29K2023/16 ,  B29K2105/04 ,  B29K2105/24

Abstract: There is provided a die for extrusion in which an undesired reaction is suppressed in an inside thereof and with which variation in thickness of a resin sheet to be obtained can be reduced. A die for extrusion of the present invention includes: a cylindrical inflow port into which a molten resin flows; a manifold connected to the inflow port; a first slit connected to the manifold; a second slit connected to the first slit; and a lip land connected to the second slit. In the die for extrusion, the shape of a flow path is optimized based on a relationship among a position in the die, an operation time, and a vulcanization degree.

公开(公告)号：US20230159811A1

公开(公告)日：2023-05-25

申请号：US17915574

申请日：2021-03-30

Applicant: NITTO DENKO CORPORATION

Inventor： Tetsuya OTSUKA ,  Takanobu MIMURA ,  Tomoya KATO

IPC: C09K5/14 ,  C08L83/04 ,  C08L67/06 ,  C08J9/26 ,  C08J9/00 ,  C08K3/38

CPC classification number: C09K5/14 ,  C08L83/04 ,  C08L67/06 ,  C08J9/26 ,  C08J9/0066 ,  C08K3/38 ,  C08L2203/14 ,  C08J2383/04 ,  C08J2367/06 ,  C08J2201/046 ,  C08J2205/044 ,  C08K2003/385 ,  C08K2201/001 ,  C08K2201/016 ,  C08K2201/005

Abstract: A composite material according to the present invention includes a solid portion including inorganic particles and a resin. The composite material has a porous structure including a plurality of voids surrounded by the solid portion. The composite material compressed by 10% has a reaction force of 0.1 kPa to 1000 kPa, and the composite material has a heat conductivity of 0.5 W/(m·K) or more. The heat conductivity is a value measured for one test specimen in a symmetric configuration according to an American Society for Testing and Materials (ASTM) standard (ASTM) D5470-01.