-
91.发明授权Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction 有权采用发光二极管（LED）的发光器件和方法，用于改进光提取公开(公告)号：US09496466B2
公开(公告)日：2016-11-15
申请号：US13312508
申请日：2011-12-06
CPC分类号： H01L33/54 , H01L24/49 , H01L33/20 , H01L33/58 , H01L2224/49113 , H01L2924/00014 , H01L2924/01322 , H01L2924/12041 , H01L2933/005 , H01L2933/0058 , Y10T29/49117 , Y10T29/4913 , Y10T29/49169 , H01L2224/45099 , H01L2924/00
摘要： Light emitter devices with improved light extraction and related methods are disclosed. In one embodiment, the light emitter device can include a submount, at least one light emitting chip disposed over the submount, and a lens disposed over the light emitting chip. The lens can include a lens base that can have substantially the same geometry as a geometry of the submount.
摘要翻译： 公开了具有改进的光提取和相关方法的发光器件。 在一个实施例中，发光器件可以包括底座，设置在底座上的至少一个发光芯片和设置在发光芯片上的透镜。 透镜可以包括透镜基座，其可以具有与基座的几何形状基本相同的几何形状。
-
公开(公告)号：US09428688B2
公开(公告)日：2016-08-30
申请号：US12271945
申请日：2008-11-17
IPC分类号： C09K11/79 , C09K11/08 , C04B35/58 , C04B35/581 , C04B35/584 , C04B35/591 , C04B35/593 , C04B35/597 , C09K11/77
CPC分类号： C09K11/7734 , C04B35/58 , C04B35/581 , C04B35/584 , C04B35/591 , C04B35/593 , C04B35/5935 , C04B35/597 , C04B2235/3224 , C04B2235/3852 , C04B2235/3865 , C04B2235/3869 , C04B2235/3873 , C04B2235/445 , C09K11/025 , C09K11/0883 , C09K11/7728
摘要： A method is disclosed for forming a blended phosphor composition. The method includes the steps of firing precursor compositions that include europium and nitrides of at least calcium, strontium and aluminum, in a refractory metal crucible and in the presence of a gas that precludes the formation of nitride compositions between the nitride starting materials and the refractory metal that forms the crucible. The resulting compositions can include phosphors that convert frequencies in the blue portion of the visible spectrum into frequencies in the red portion of the visible spectrum.
摘要翻译： 公开了一种形成混合荧光粉组合物的方法。 该方法包括以下步骤：在耐火金属坩埚中，并且在气体存在下，将包含至少钙，锶和铝的铕和氮化物的前体组合物焙烧，以防止在氮化物起始材料和耐火材料之间形成氮化物组合物 形成坩埚的金属。 所得组合物可以包括将可见光谱的蓝色部分中的频率转换成可见光谱的红色部分中的频率的磷光体。
-
公开(公告)号：USD740453S1
公开(公告)日：2015-10-06
申请号：US29459233
申请日：2013-06-27
-
公开(公告)号：US09111778B2
公开(公告)日：2015-08-18
申请号：US13011609
申请日：2011-01-21
IPC分类号： H01L33/08 , H01L25/075 , G02F1/1335 , H01L23/00 , H01L33/48 , H01L33/60 , H01L33/62 , H01L33/64
CPC分类号： H01L25/0753 , G02F1/133603 , G02F1/133608 , H01L24/48 , H01L24/49 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/29144 , H01L2224/2929 , H01L2224/29399 , H01L2224/48091 , H01L2224/48247 , H01L2224/49113 , H01L2224/83192 , H01L2224/92247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01079 , H01L2924/01322 , H01L2924/10157 , H01L2924/10158 , H01L2924/12032 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/0105 , H01L2924/0665 , H01L2224/45099 , H01L2924/00
摘要： Light emitting diode (LED) devices, systems, and methods are disclosed. In one aspect, an illumination panel can be configured to provide backlighting for a liquid crystal display (LCD) panel. The illumination panel can include one or more LEDs arranged in an array. The one or more LEDs can be attached using metal-to-metal die attach methods over an illumination panel, or attached within packages disposed over the illumination panel. In one aspect, the one or more LEDs can be attached using robust metal-to-metal die attach techniques and/or materials disclosed herein.
摘要翻译： 公开了发光二极管（LED）装置，系统和方法。 一方面，照明面板可以被配置为为液晶显示器（LCD）面板提供背光。 照明面板可以包括以阵列布置的一个或多个LED。 一个或多个LED可以使用金属对金属管芯附接方法安装在照明面板上，或者附接在设置在照明面板上的封装内。 在一个方面，可以使用本文公开的鲁棒金属 - 金属管芯附接技术和/或材料来连接一个或多个LED。
-
公开(公告)号：US09052416B2
公开(公告)日：2015-06-09
申请号：US13087510
申请日：2011-04-15
CPC分类号： G02B6/0003 , F21K9/232 , F21K9/60 , F21K9/61 , F21K9/64 , F21V29/70 , F21Y2115/10 , G02B5/02 , G02B6/001 , G02B6/0035 , G02B6/005 , G02B6/0073 , G02B6/0096
摘要： A semiconductor light emitting apparatus includes an elongated hollow wavelength conversion tube that comprises an elongated wavelength conversion tube wall having wavelength conversion material such as phosphor dispersed therein uniformly or non-uniformly. The tube need not be cylindrical. A semiconductor light emitting device is oriented to emit light inside the elongated hollow wavelength conversion tube to impinge upon the elongated wavelength conversion tube wall and the wavelength conversion material dispersed therein.
摘要翻译： 半导体发光装置包括细长的中空波长转换管，其包括具有均匀或不均匀分散的诸如磷光体的波长转换材料的细长波长转换管壁。 管不需要是圆柱形的。 半导体发光器件被定向以在细长的中空波长转换管内发光，以照射到分散在其中的细长波长转换管壁和波长转换材料。
-
公开(公告)号：US09048392B2
公开(公告)日：2015-06-02
申请号：US13093431
申请日：2011-04-25
IPC分类号： H01L33/00 , H01L33/48 , F21K99/00 , H01L25/075 , F21Y101/02 , F21Y105/00 , H01L33/62 , H05K1/14 , H05K1/18
CPC分类号： H01L33/486 , F21K9/20 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L2224/48 , H05K1/141 , H05K1/189 , H05K2201/10106
摘要： Light emitting device (LED) array assemblies and related methods are provided. An LED array assembly can include a primary substrate with an array of light emitting devices disposed on the primary substrate. The LED array assembly can also include a secondary substrate comprising at least one or more grooves. The primary substrate can be positioned on the secondary substrate with the grooves facing the primary substrate.
摘要翻译： 提供发光器件（LED）阵列组件及相关方法。 LED阵列组件可以包括具有布置在初级衬底上的发光器件阵列的初级衬底。 LED阵列组件还可以包括包括至少一个或多个凹槽的次基底。 主衬底可以定位在次级衬底上，其中凹槽面向初级衬底。
-
公开(公告)号：USD718258S1
公开(公告)日：2014-11-25
申请号：US29431064
申请日：2012-09-02
-
公开(公告)号：US08878217B2
公开(公告)日：2014-11-04
申请号：US13616759
申请日：2012-09-14
IPC分类号： H01L33/48 , H01L25/075 , H01L33/64
CPC分类号： H01L25/0753 , H01L33/486 , H01L33/642 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Packages for containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed with an efficient, isolated thermal path. In one embodiment, LED package can include a thermal element and at least one electrical element embedded within a body. The thermal element and electrical element can have the same and/or substantially the same thickness and can extend directly from a bottom surface of the LED package such that they are substantially flush with or extend beyond the bottom surface of the LED package. The thermal and electrical element have exposed portions which can be substantially flush with lateral sides of the body such that the thermal and electrical element do not have a significant portion extending beyond an outermost edge of the lateral sides of the body.
摘要翻译： 公开了一种用于容纳一个或多个发光器件（例如发光二极管（LED））的封装，其具有有效的隔离的热路径。 在一个实施例中，LED封装可以包括热元件和嵌入在主体内的至少一个电元件。 热元件和电气元件可以具有相同和/或基本上相同的厚度，并且可以直接从LED封装的底表面延伸，使得它们基本上与LED封装的底表面齐平或延伸超出LED封装的底表面。 热元件和电元件具有暴露部分，其可以与主体的侧面基本齐平，使得热电元件和电元件不具有延伸超过主体的侧面的最外边缘的显着部分。
-
公开(公告)号：USD707192S1
公开(公告)日：2014-06-17
申请号：US29412168
申请日：2012-01-31
-
100.发明授权Light emitting diode (LED) packages, systems, devices and related methods 有权发光二极管（LED）封装，系统，器件及相关方法公开(公告)号：US08610140B2
公开(公告)日：2013-12-17
申请号：US13462450
申请日：2012-05-02
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , F21K9/27 , F21K9/68 , F21Y2115/10 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/00012
摘要： Packages, systems, and devices for light emitting diodes (LEDs) and related methods are provided. The packages can include a lead frame with an electrically conductive chip carrier comprising an upper surface. An LED can be placed on the upper surface of the electrically conductive chip carrier. A casing can be disposed on the lead frame covering at least a portion of the lead frame. A reflector cavity can be in the casing surrounding the LED. The reflector cavity can have angled side wall portions and angled end wall portions with an angle at which the side wall portions are angled that is different from an angle at which the end wall portions are angled.
摘要翻译： 提供了用于发光二极管（LED）和相关方法的封装，系统和器件。 封装可以包括具有包括上表面的导电芯片载体的引线框架。 LED可以放置在导电芯片载体的上表面上。 壳体可以设置在引线框架上，覆盖引线框架的至少一部分。 反射器腔可以在围绕LED的壳体中。 反射器腔体可以具有成角度的侧壁部分和成角度的端壁部分，其中侧壁部分成角度，其不同于端壁部分成角度的角度。
-
-
-
-
-
-
-
-
-
搜索结果
114 条记录 (耗时 0.03 秒)
