THREE-DIMENSIONAL INTEGRATED MULTISPECTRAL IMAGING SENSOR
    98.
    发明申请
    THREE-DIMENSIONAL INTEGRATED MULTISPECTRAL IMAGING SENSOR 有权
    三维集成多目标成像传感器

    公开(公告)号:US20170018594A1

    公开(公告)日:2017-01-19

    申请号:US14802014

    申请日:2015-07-17

    Abstract: A three-dimensional multispectral imaging sensor and method for forming a three-dimensional multispectral imaging sensor are provided. The three-dimensional multispectral imaging sensor includes a monolithic structure having a plurality of layers. Each of the layers is formed from light detecting materials for detecting light of respective different non-overlapping wavelengths and having respective different bandgaps

    Abstract translation: 提供了一种用于形成三维多光谱成像传感器的三维多光谱成像传感器和方法。 三维多光谱成像传感器包括具有多层的单片结构。 每个层由用于检测各个不同非重叠波长的光并具有各自不同带隙的光检测材料形成

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