公开(公告)号：US20060097405A1

公开(公告)日：2006-05-11

申请号：US11262907

申请日：2005-10-31

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/12

CPC classification number: H01L23/055 ,  H01L23/10 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An IC (integrated circuit) chip package includes a substrate (2), a chip (3), a plurality of bonding wires (32), and a cover (5). The substrate has a top surface, a bottom surface, a receiving chamber (23) defined therein, a plurality of solder pads (24) arranged around the top surface and the bottom surface, and a plurality of vias (25) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate to cover the opening, and has a smaller profile than that of the substrate, thereby not cover a peripheral area of the top surface.

Abstract translation: IC（集成电路）芯片封装包括基板（2），芯片（3），多个接合线（32）和盖（5）。 衬底具有顶表面，底表面，限定在其中的接收室（23），围绕顶表面和底表面布置的多个焊盘（24），以及多个通孔（25），其具有导电材料 将顶部焊盘与其中限定的底部焊盘连接。 芯片安装在接收室中，并且具有围绕其顶表面布置的多个芯片焊盘。 接合线分别将衬底的顶部焊盘与芯片焊盘电连接。 盖被固定到基板的顶表面以覆盖开口，并且具有比基板更小的轮廓，从而不覆盖顶表面的周边区域。

公开(公告)号：US06946316B2

公开(公告)日：2005-09-20

申请号：US10286269

申请日：2002-10-31

Applicant: Thomas P. Glenn ,  Steven Webster

Inventor： Thomas P. Glenn ,  Steven Webster

IPC: B29C43/36 ,  H01L21/00 ,  H01L23/02

CPC classification number: H01L27/14625 ,  B29C33/0022 ,  B29C43/36 ,  B29C2043/023 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

Abstract translation: 图像传感器封装包括具有锁定特征的模制件。 该包装还包括具有突片的卡扣盖，其中突片附接到模制件的锁定特征。 为了形成图像传感器封装，将窗口放置在模制品的口袋中。 卡扣盖固定就位。 一旦固定，卡扣盖压靠窗口外表面的周边区域。 窗口夹在模制件和卡扣盖之间并保持就位。

公开(公告)号：US06869861B1

公开(公告)日：2005-03-22

申请号：US09803083

申请日：2001-03-08

Applicant: Thomas P. Glenn ,  Roy Dale Hollaway ,  Steven Webster

Inventor： Thomas P. Glenn ,  Roy Dale Hollaway ,  Steven Webster

IPC: H01L21/301 ,  H01L21/68 ,  H01L21/78 ,  H01L23/544

CPC classification number: H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A wafer includes a vertical scribe line and a horizontal scribe line on a front-side surface of the wafer. An intersection of the vertical scribe line and the horizontal scribe line is optically recognized through a wafer support attached to the front-side surface of the wafer. The wafer is drilled all the way through at the intersection to form a back-side alignment mark on a back-side surface of said wafer. The back-side alignment mark is used to aligning a saw, which singulates the wafer from the back-side surface.

Abstract translation: 晶片包括在晶片的前侧表面上的垂直划线和水平划线。 垂直划线和水平划线的交叉点通过附着在晶片的前侧表面的晶片支架而被光学识别。 晶圆在相交处一直穿过，在所述晶片的背面形成背面对准标记。 背面对准标记用于对准从后侧表面对晶片进行单片化的锯。

公开(公告)号：US06791076B2

公开(公告)日：2004-09-14

申请号：US10286589

申请日：2002-10-31

Applicant: Steven Webster

Inventor： Steven Webster

IPC: H01J502

CPC classification number: H01L27/14627 ,  G02B7/02 ,  G02B7/022 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H04N5/2251 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  Y10T29/49002 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Abstract translation: 图像传感器封装包括图像传感器，窗口和模制件，其中模制件包括从窗户向上延伸的透镜保持器延伸部分。 透镜保持器延伸部分包括从窗口延伸的阴螺纹孔，使得窗口通过孔露出。 透镜支撑在螺纹透镜支架中。 带螺纹的透镜支撑件被拧入透镜保持器延伸部分的孔中。 通过旋转透镜支架，相对于图像传感器容易地调节透镜。

公开(公告)号：US06686588B1

公开(公告)日：2004-02-03

申请号：US09764165

申请日：2001-01-16

Applicant: Steven Webster ,  Thomas P. Glenn ,  Roy Dale Hollaway

Inventor： Steven Webster ,  Thomas P. Glenn ,  Roy Dale Hollaway

IPC: H01J502

CPC classification number: H01L27/14618 ,  H01L24/97 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83

Abstract: An optical module includes a lens housing and a substrate having a base and a sidewall. An image sensor is mounted to the base. The sidewall includes a joint surface and the lens housing includes a mounting surface. The mounting surface of the lens housing is bonded to the joint surface of the substrate thus mounting the lens housing to the sidewall. To minimize the overall width of the optical module and to maximize the strength of the bond between the lens housing and the substrate, the mounting surface of the lens housing is formed with a locking feature. The locking feature includes a horizontal surface bonded to the joint surface and a vertical surface bonded to an interior surface of the sidewall.

Abstract translation: 光学模块包括透镜壳体和具有基底和侧壁的基底。 图像传感器安装在基座上。 侧壁包括接合表面，并且透镜壳体包括安装表面。 透镜壳体的安装表面结合到基板的接合表面，从而将透镜壳体安装到侧壁上。 为了最小化光学模块的总宽度并且最大化透镜壳体和衬底之间的结合的强度，透镜壳体的安装表面形成有锁定特征。 锁定特征包括结合到接合表面的水平表面和结合到侧壁的内表面的垂直表面。

公开(公告)号：US06629633B1

公开(公告)日：2003-10-07

申请号：US09711994

申请日：2000-11-13

Applicant: Thomas P. Glenn ,  Steven Webster ,  Markus K. Liebhard

Inventor： Thomas P. Glenn ,  Steven Webster ,  Markus K. Liebhard

IPC: B22K3102

CPC classification number: H01L27/1469 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/14634 ,  H01L2224/48091 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

Abstract: To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. The image sensor further includes a plurality of bond pads on the upper surface. Interior traces on a lower surface of a step up ring are aligned with the bond pads on the upper surface of the image sensor. Bumps are formed between the interior traces and the bond pads thus flip chip mounting the step up ring to the image sensor. The step up ring is mounted such that the window is located in or adjacent a central aperture of the step up ring. An underfill material is applied into the central aperture. The underfill material flows from the central aperture between the lower surface of the step up ring and the upper surface of the image sensor. The underfill material encloses the bumps. The underfill material is cured, if necessary, to form a package body. The package body enhances the reliability of the image sensor package by preventing the failure of the bumps and preventing the associated dismounting of the step up ring.

Abstract translation: 为了形成图像传感器封装，将窗口安装在图像传感器的上表面上的有效区域上方。 图像传感器还包括在上表面上的多个接合焊盘。 升降环的下表面上的内部迹线与图像传感器的上表面上的接合焊盘对准。 在内部迹线和接合焊盘之间形成凸起，因此倒装芯片将升压环安装到图像传感器。 安装升降环使得窗口位于或靠近升压环的中心孔。 将底部填充材料施加到中心孔中。 底部填充材料从升压环的下表面和图像传感器的上表面之间的中心孔流出。 底部填充材料包住凸块。 如果需要，底部填充材料被固化以形成包装体。 封装体通过防止凸块的故障并防止相关的升压环的拆卸来增强图像传感器封装的可靠性。

公开(公告)号：US06580167B1

公开(公告)日：2003-06-17

申请号：US09839284

申请日：2001-04-20

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2334

CPC classification number: H01L23/552 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/40225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/37099

Abstract: An RF shielded package includes a heat sink having a plurality of spring elements. The spring elements press the heat sink against a mold half during encapsulation to prevent encapsulant from leaking between the heat sink and the mold half. Further, the spring elements ground the heat sink to shield an electronic component from RF radiation.

Abstract translation: RF屏蔽封装包括具有多个弹簧元件的散热器。 弹簧元件在封装期间将散热器压在半模上，以防止密封剂在散热器和半模之间泄漏。 此外，弹簧元件将散热器接地以将电子部件与RF辐射屏蔽。

公开(公告)号：US06571466B1

公开(公告)日：2003-06-03

申请号：US09536830

申请日：2000-03-27

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H05K330

CPC classification number: H01L27/14618 ,  H01L24/97 ,  H01L31/0203 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15151 ,  H01L2924/15153 ,  Y10T29/49133 ,  Y10T29/49139 ,  Y10T29/49146 ,  H01L2224/81

Abstract: A method of fabricating a flip chip image sensor package includes forming an aperture in a substrate and mounting an image sensor to the substrate. The image sensor is mounted such that an active area of the image sensor is aligned with the aperture. A bead is formed around a periphery of the image sensor. An aperture side of the aperture, the image sensor, and the bead define a pocket. The method further includes filling the pocket with a transparent liquid encapsulant and hardening the transparent liquid encapsulant. The hardened transparent liquid encapsulant serves as the window for the flip chip image sensor package.

Abstract translation: 制造倒装芯片图像传感器封装的方法包括在衬底中形成孔并将图像传感器安装到衬底。 图像传感器被安装成使得图像传感器的有效区域与孔径对准。 围绕图像传感器的周边形成珠。 光圈的光圈侧，图像传感器和光圈限定了一个口袋。 该方法还包括用透明液体密封剂填充袋，并硬化透明液体密封剂。 硬化的透明液体密封剂用作倒装芯片图像传感器封装的窗口。

公开(公告)号：US06532157B1

公开(公告)日：2003-03-11

申请号：US09714622

申请日：2000-11-16

Applicant: Thomas P. Glenn ,  Roy D. Hollaway ,  Steven Webster

Inventor： Thomas P. Glenn ,  Roy D. Hollaway ,  Steven Webster

IPC: H05K700

CPC classification number: H01L31/0203 ,  H01L2924/0002 ,  H05K1/02 ,  H05K1/189 ,  H01L2924/00

Abstract: A novel semiconductor package comprises a rigid dielectric, e.g., ceramic, substrate having first and second portions joined to one another at respective margins thereof to form an angle, e.g., a right angle, between the portions. Each of the portions has electrically conductive paths connected to one another through the angle. A semiconductor device, e.g., a die, is mounted to the first portion and electrically connected to the conductive paths thereof. An array of electrically conductive lands, balls, or pins are mounted on the second portion for connecting the package to a printed circuit board. In a high-power embodiment, the device is mounted directly on a threaded stud projecting from the first portion to enable intimate thermal coupling of the device to a heat sink. In another embodiment, a connector projects from the first portion to optically couple an optical device directly to an end of a fiber optic cable.

Abstract translation: 新颖的半导体封装包括刚性电介质，例如陶瓷衬底，其具有在其相应边缘处彼此连接的第一和第二部分，以在这些部分之间形成一个角度，例如直角。 每个部分具有通过该角度彼此连接的导电路径。 诸如裸片的半导体器件被安装到第一部分并且电连接到其导电路径。 在第二部分上安装有导电焊盘，滚珠或引脚的阵列，用于将封装连接到印刷电路板。 在大功率实施例中，该装置直接安装在从第一部分突出的螺柱上，以使装置能够与散热器紧密地热耦合。 在另一个实施例中，连接器从第一部分突出以将光学装置直接光耦合到光纤电缆的端部。

公开(公告)号：US06530515B1

公开(公告)日：2003-03-11

申请号：US09670501

申请日：2000-09-26

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: B23K3102

CPC classification number: B81B7/0077 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: To form a micromachine package, bond pads on a front surface of a controller chip are aligned with corresponding traces on a front surface of a micromachine chip. The bond pads are physically connected to the traces thus mounting the controller chip as a flip chip to the micromachine chip. A bead is formed around a periphery of the controller chip. The bead and the controller chip form an enclosure around a micromachine area in the front surface of the micromachine chip. This enclosure protects the micromachine area from the ambient environment.

Abstract translation: 为了形成微机械组件，控制器芯片的前表面上的接合焊盘与微机械芯片前表面上的对应迹线对齐。 接合焊盘物理连接到迹线，从而将控制器芯片作为倒装芯片安装到微机械芯片。 在控制器芯片的周围形成珠。 珠和控制器芯片在微机械芯片的前表面周围形成围绕微机械区域的外壳。 该外壳保护微机械区域免受周围环境的影响。