公开(公告)号：US07994716B2

公开(公告)日：2011-08-09

申请号：US12093115

申请日：2006-11-06

申请人： Yoshikazu Takahashi

发明人： Yoshikazu Takahashi

IPC分类号： H01L35/24 ,  C08K5/15

CPC分类号： H01L51/5256

摘要： In the present invention, an organic EL device, which includes first and second display electrodes and at least one organic functional layer sandwiched between the respective display electrodes and composed of an organic compound, a high-molecular compound film covering the organic EL device and a surface of a substrate in the periphery of the organic EL device, an inorganic barrier film covering the high-molecular compound film, the edge of the high-molecular compound film, and a surface of the substrate in the periphery of the high-molecular compound film are formed on the substrate. In this case, a aliphatic polyurea film is used as the high-molecular compound film.

摘要翻译： 在本发明中，一种有机EL器件，其包括第一和第二显示电极以及夹在各显示电极之间并由有机化合物构成的至少一个有机功能层，覆盖有机EL器件的高分子化合物膜和 有机EL元件周围的基板的表面，覆盖高分子化合物膜的无机阻挡膜，高分子化合物膜的边缘和高分子化合物的周围的基板的表面 在基板上形成膜。 在这种情况下，使用脂肪族聚脲膜作为高分子化合物膜。

公开(公告)号：US07991166B2

公开(公告)日：2011-08-02

申请号：US11353088

申请日：2006-02-14

申请人： Nobuyuki Kihara ,  Yoshikazu Takahashi ,  Yasuhiko Kato

发明人： Nobuyuki Kihara ,  Yoshikazu Takahashi ,  Yasuhiko Kato

IPC分类号： H04R3/00 ,  H04R1/02 ,  G10L11/00 ,  G10L19/00

CPC分类号： H04R1/406 ,  H04R19/016 ,  H04R2201/401 ,  H04R2430/20

摘要： A microphone apparatus for processing and outputting an output signal of a microphone array including at least nine microphones includes a directivity function processing circuit that converts the output signal of the microphone array into a unidirectional signal and that outputs the unidirectional signal. The directivity function processing circuit expands a directivity function whose variable is an incident angle of an acoustic wave into a Fourier series up to at least third order. The variable in the expanded expression is produced from output signals of the microphones forming the microphone array.

摘要翻译： 用于处理和输出包括至少九个麦克风的麦克风阵列的输出信号的麦克风装置包括将麦克风阵列的输出信号转换为单向信号并输出​​单向信号的方向性功能处理电路。 指向性函数处理电路将可变为声波的入射角的方向性函数扩展为至少三阶的傅里叶级数。 扩展表达式中的变量由形成麦克风阵列的麦克风的输出信号产生。

公开(公告)号：US20110037166A1

公开(公告)日：2011-02-17

申请号：US12735926

申请日：2009-04-08

申请人： Yoshinari Ikeda ,  Shin Soyano ,  Akira Morozumi ,  Kenji Suzuki ,  Yoshikazu Takahashi

发明人： Yoshinari Ikeda ,  Shin Soyano ,  Akira Morozumi ,  Kenji Suzuki ,  Yoshikazu Takahashi

IPC分类号： H01L23/34 ,  H01L21/00

CPC分类号： H01L24/80 ,  H01L21/4882 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L25/117 ,  H01L2224/05554 ,  H01L2224/29 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/371 ,  H01L2224/40137 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/83205

摘要： The object of the present invention is to efficiently dissipate heat from the upper and lower main surfaces of a semiconductor device carrying a semiconductor element. A semiconductor device (1) is provided with an insulating substrate (10A), an insulating substrate (10B) provided so as to face the insulating substrate (10A), and a semiconductor element (20) disposed between the insulating substrate (10A) and the insulating substrate (10B) and having a collector electrode and an emitter electrode provided on the side opposite to that of the collector electrode. The collector electrode is electrically connected to a metal foil (10ac) provided on the insulating substrate (10A), and the emitter electrode is electrically connected to the metal foil (10bc) provided on the insulating substrate (10B). As a result, heat generated by the semiconductor element (20) is efficiently dissipated from the upper and lower main surfaces of the semiconductor device (1).

摘要翻译： 本发明的目的是有效地从携带半导体元件的半导体器件的上主表面和下主表面散热。 半导体器件（1）设置有绝缘基板（10A），设置为与绝缘基板（10A）相对的绝缘基板（10B），以及设置在绝缘基板（10A）和 绝缘基板（10B），并且具有集电极和设置在与集电极的相反侧的发射极。 集电极电连接到设置在绝缘基板（10A）上的金属箔（10ac），发射电极与设在绝缘基板（10B）上的金属箔（10bc）电连接。 结果，由半导体元件（20）产生的热量有效地从半导体器件（1）的上主表面和下主表面消散。

公开(公告)号：US07779172B2

公开(公告)日：2010-08-17

申请号：US11515396

申请日：2006-09-01

申请人： Nobuo Sasaki ,  Kaoru Yamanoue ,  Yoshikazu Takahashi ,  Shinichi Honda

发明人： Nobuo Sasaki ,  Kaoru Yamanoue ,  Yoshikazu Takahashi ,  Shinichi Honda

IPC分类号： G06F13/28 ,  G06F15/167

CPC分类号： G06F13/32

摘要： A DMA controller controls DMA transfer in an information processing system. Input and output devices are a transfer source or a transfer destination in DMA transfer and request DMA transfer. A DMAC activating unit is provided with an event monitoring unit and an event register. The event register registers an event subject to monitoring. The event monitoring unit detects an event generated in the input and output devices and determines whether the detected event matches an event registered in the event register. If it is determined that the events match, the event monitoring unit activates the DMA controller.

摘要翻译： DMA控制器控制信息处理系统中的DMA传输。 输入和输出设备是DMA传输中的传输源或传输目的地，并请求DMA传输。 DMAC激活单元设置有事件监视单元和事件寄存器。 事件寄存器注册一个需要监视的事件。 事件监视单元检测在输入和输出设备中产生的事件，并确定检测到的事件是否与登记在事件寄存器中的事件相匹配。 如果确定事件匹配，则事件监视单元激活DMA控制器。

公开(公告)号：US20090238968A1

公开(公告)日：2009-09-24

申请号：US11886600

申请日：2006-03-23

申请人： Masanobu Hatanaka ,  Yoshikazu Takahashi ,  Michio Ishikawa ,  Fumio Nakamura

发明人： Masanobu Hatanaka ,  Yoshikazu Takahashi ,  Michio Ishikawa ,  Fumio Nakamura

IPC分类号： B05D7/22 ,  C23C16/44 ,  C23C14/12

CPC分类号： C23C16/4402 ,  B05D1/60 ,  B05D7/22

摘要： The object of this invention is to provide a method for producing a component for vacuum apparatus and a resin coating forming apparatus capable of easily forming a resin coating on an internal flow path complex in shape.The resin coating forming apparatus (21) comprises a monomer vapor supplying unit (23), a vacuum pumping line (24) for transporting monomer vapor, a connection portion (24c) connectable with the internal flow path of a component (22A) provided on part of the vacuum pumping line (24), and a temperature adjusting unit (31) for depositing the monomer vapor onto the internal flow path of the component (22A) connected with the connection portion (24c) to form a resin coating. The above arrangement permits the formation of a uniform, high-coverage resin coating on the internal flow path of the component (22A) by merely exposing the internal flow path to monomer vapor.

摘要翻译： 本发明的目的是提供一种用于制造真空装置的部件的方法和能够容易地在内部流路复合体上形成树脂涂层的树脂涂层形成装置。 树脂涂层形成装置（21）包括单体蒸气供给单元（23），用于输送单体蒸气的真空泵送管线（24），可连接到设置在其上的部件（22A）的内部流路的连接部分（24c） 真空泵送管线（24）的一部分和用于将单体蒸气沉积到与连接部分（24c）连接的部件（22A）的内部流动路径上以形成树脂涂层的温度调节单元（31）。 上述布置允许通过仅将内部流动路径暴露于单体蒸气，在组件（22A）的内部流动路径上形成均匀的高覆盖率树脂涂层。

公开(公告)号：US20090093109A1

公开(公告)日：2009-04-09

申请号：US12213923

申请日：2008-06-26

申请人： Akira Morozumi ,  Shin Soyano ,  Yoshikazu Takahashi

发明人： Akira Morozumi ,  Shin Soyano ,  Yoshikazu Takahashi

IPC分类号： H01L21/768

CPC分类号： C22C13/02 ,  B23K35/262 ,  H01L24/29 ,  H01L24/33 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： In producing a semiconductor device, a solder alloy is prepared to contain antimony in a range of from 3 to 5 wt %, a trace amount of germanium, and a balance of tin. An insulative substrate having conductor patterns on both surfaces thereof is prepared, and a heat sink plate is mounted on a back surface of the insulative substrate by a soldering process using the solder alloy at a temperature ranging from 310 C.° to 320 C.° in a hydrogen reducing furnace. A semiconductor chip is mounted on a front surface of the insulative substrate.

摘要翻译： 在制造半导体器件时，制备焊料合金以含有3至5重量％的锑，痕量的锗和余量的锡。 准备在其两面具有导体图形的绝缘基板，并且通过使用焊料合金在310℃至320℃的温度范围内的焊接工艺将散热板安装在绝缘基板的背面上。 在氢还原炉中。 半导体芯片安装在绝缘基板的前表面上。

公开(公告)号：US07448613B2

公开(公告)日：2008-11-11

申请号：US11677418

申请日：2007-02-21

申请人： Yoshikazu Takahashi

发明人： Yoshikazu Takahashi

IPC分类号： B65H1/26

CPC分类号： B65H1/12 ,  B65H1/266 ,  B65H2402/5155 ,  B65H2405/31 ,  B65H2601/322

摘要： A lifting plate provided in a sheet accommodating member is locked at a position, to which the lifting plate is downwardly turned against a pushing force of a spring, by a locking mechanism having a locking member configured to lock the lifting plate, and also having a lock releasing lever configured to release locking of the lifting plate by the locking member. When the sheet accommodating unit is mounted, the lock releasing lever is made to abut against a lock release member. Thus, the lock releasing lever is moved integrally with the locking member in a lock release direction. When the sheet accommodating unit is drawn out, the lock releasing lever is made to abut against the lock release member. Thus, the lock releasing lever is singly moved in a direction opposite to the lock release direction to maintain the locking of the lifting plate by the locking member.

摘要翻译： 设置在片材容纳构件中的提升板通过具有锁定构件来锁定提升板的锁定机构的锁定机构锁定在抵抗弹簧的推动力的情况下提升板向下转动的升降板，并且还具有 锁定释放杆，其构造成通过锁定构件释放提升板的锁定。 当安装片材容纳单元时，使锁定释放杆抵靠锁定解除构件。 因此，锁定释放杆与锁定构件沿锁定解除方向一体地移动。 当片材容纳单元被拉出时，锁定释放杆被制成抵靠锁定解除构件。 因此，锁定释放杆在与锁定解除方向相反的方向上单独移动，以通过锁定构件保持提升板的锁定。

公开(公告)号：US07438403B2

公开(公告)日：2008-10-21

申请号：US11185277

申请日：2005-07-19

申请人： Yoshikazu Takahashi

发明人： Yoshikazu Takahashi

IPC分类号： B41J2/17 ,  B41J2/45 ,  B41J2/175

CPC分类号： B41J2/055 ,  B41J2/14233 ,  B41J2002/14258 ,  B41J2002/14419

摘要： An inkjet printhead includes: a cavity unit having aligned nozzles, pressure chambers correspondingly aligned, and a common-chamber member having a common chamber connected, at an introduction place, to an ink source to receive and distribute ink to the pressure chambers, and extending along the pressure chambers row to overlap each pressure chamber when seen in the superposition direction, and a cross-sectional area of the common chamber perpendicular to its longitudinal direction gradually decreases in a direction away from the introduction place, at a portion remote from the introduction place; an actuator on the cavity unit to pressurize the distributed ink to eject ink droplets from the nozzles; and a compensating member having a rigidity lower than that of the common-chamber member, and being disposed in contact with the ink, at the remote portion so that a supporting rigidity of the common-chamber member is substantially uniform along the pressure chambers row.

摘要翻译： 喷墨打印头包括：空腔单元，其具有对准的喷嘴，相应对准的压力室，以及具有在引入位置处连接到墨源以将墨水分配到压力室的公共室的公共室构件， 沿着压力室排，当从叠加方向观察时与每个压力室重叠，并且垂直于其纵向方向的公共室的横截面积在远离引入位置的方向上在远离导入件的部分逐渐减小 地点; 空腔单元上的致动器，用于对分布的墨进行加压以从喷嘴喷出墨滴; 以及补偿构件，其刚性低于公共室构件的刚性，并且在远端部分与墨水接触地设置，使得公共腔构件的支撑刚度沿着压力室排基本上均匀。

公开(公告)号：US07335970B2

公开(公告)日：2008-02-26

申请号：US10762347

申请日：2004-01-23

申请人： Yoshikazu Takahashi ,  Masami Suzuki ,  Masaru Kimura

发明人： Yoshikazu Takahashi ,  Masami Suzuki ,  Masaru Kimura

IPC分类号： H01L23/02 ,  H01L23/06 ,  H01L23/48 ,  H01L23/04 ,  H01L23/52

CPC分类号： H01L23/49572 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/4985 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311

摘要： Disclosed are a semiconductor device, a method for manufacturing the same, and a method for mounting the same. The method for manufacturing a semiconductor device includes the steps of: preparing a package film having a planar configuration whose region is divided into a device-mounting film portion having a device hole forming therein, an external-connection film portion, and a bent portion located between the device-mounting film portion and the external-connection film portion, an external electrode pad being formed on the external-connection film portion on a first surface side of the package film, an inner lead being formed in such a manner as to lead from the device hole to the external electrode pad via the bending portion; mounting a semiconductor chip on the device-mounting film portion on the first surface side by bonding the inner lead to an electrode pad of the semiconductor chip in a region where the device hole is formed; and bending the external-connection film portion at the bending portion 180° toward a second surface side of the package film and fixing the same. The method for mounting a semiconductor device on a mother board in close contact therewith includes the steps of: depositing solder balls on electrode pads of the mother board; and placing the semiconductor device on the mother board and melting the solder balls so as to electrically connect the electrode pads of the mother board and the external electrode pads of the semiconductor device.

摘要翻译： 公开了一种半导体器件及其制造方法及其安装方法。 制造半导体器件的方法包括以下步骤：制备具有平面形状的封装膜，其区域被分成具有形成器件孔的器件安装膜部分，外部连接膜部分和位于 在所述装置安装膜部分和所述外部连接膜部分之间，在所述封装膜的第一表面侧的所述外部连接膜部分上形成外部电极焊盘，所述内部引线形成为引导 从所述装置孔经由所述弯曲部到所述外部电极焊盘; 通过在形成器件孔的区域中将内部引线接合到半导体芯片的电极焊盘，将半导体芯片安装在第一表面侧的器件安装膜部分上; 并且将弯曲部分处的外部连接膜部分朝向封装膜的第二表面侧弯曲180°并将其固定。 将半导体器件与母板紧密接触的方法包括以下步骤：在母板的电极焊盘上沉积焊球; 并将半导体器件放置在母板上并熔化焊球，以将母板的电极焊盘和半导体器件的外部电极焊盘电连接。

公开(公告)号：US07334879B2

公开(公告)日：2008-02-26

申请号：US11084650

申请日：2005-03-18

申请人： Yoshikazu Takahashi

发明人： Yoshikazu Takahashi

IPC分类号： B41J2/045

CPC分类号： B41J2/14233 ,  B41J2/14209 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14306 ,  B41J2202/11

摘要： An ink-jet head comprises an ink chamber, a pressure chamber, an actuator, a constriction, and a nozzle. The ink chamber contains ink. To the pressure chamber, ink is supplied from the ink chamber. The actuator is applied with a drive pulse to thereby change the pressure of ink in the pressure chamber. The constriction is disposed between the ink chamber and the pressure chamber and has a passage width narrower than that of the pressure chamber. The nozzle communicates with the pressure chamber and ejects ink in association with the pressure change of the ink in the pressure chamber. A ratio Ra/Rb between a flow resistance Ra of the constriction and a flow resistance Rb of the nozzle is 0.48 to 1.26.

摘要翻译： 喷墨头包括墨水室，压力室，致动器，收缩部和喷嘴。 墨水室包含墨水。 在压力室中，从油墨室供给油墨。 致动器被施加驱动脉冲，从而改变压力室中的墨的压力。 缩颈设置在墨室和压力室之间，并且具有比压力室窄的通道宽度。 喷嘴与压力室连通并与压力室中的墨的压力变化相关联地喷射墨水。 收缩部的流动阻力Ra与喷嘴的流量阻力Rb之比Ra / Rb为0.48〜1.26。