摘要:
A laser engraving machine (4) is used for engraving a workpiece surface (22) by a modulated laser beam in order to form a desired profile in the workpiece surface. The fine structures of the profile are formed by the laser beam of a first laser which is modulated by an acoustooptic modulator (12) with relatively high modulation frequency, while the deep areas of the desired profile are formed by the laser beam of a second laser (10), for which purpose the modulator (12), on the one hand, and the second laser beam source (10), on the other hand, are driven by interrelated but separate control signals (S3, S2). The two perpendicular polarized laser beams from the modulator (12) and the second laser beam source (10) are transmitted and reflected by a selective mirror (14), respectively, and applied commonly via an optical system (18) to the workpiece surface (22) to be machined.
摘要:
In order to improve a semiconductor laser system with a plurality of semiconductor laser units comprising a laser oscillator, laser radiation exiting from each of these units, a light-conducting fiber associated with each semiconductor laser unit, a coupling element for coupling the laser radiation exiting from the respective semiconductor laser unit into the respective light-conducting fiber, and a fiber bundle comprising the fibers as light conductor system, a total laser radiation formed by the sum of the coherent laser radiation generated by the respective semiconductor laser units exiting from one end of the fiber bundle, this total laser radiation illuminating a target surface on an object to be irradiated during laser activity of all the semiconductor laser units, such that complex irradiation tasks can be performed with this system in a simple and as effective a manner as possible it is suggested that a control be provided for controlling the power of each individual semiconductor laser unit in a defined manner, and that an irradiation of different surface elements of the target surface with an intensity individually definable for each surface element be specifiable to the control.
摘要:
Apparatus for determining the focal plane of invisible laser-therapy radiation in ophthalmological instruments. A visible laser marking beam is split by simple means into four individual beams which share the instrument's optical path with the invisible laser radiation and are combined at the instrument's focal plane to form a single light spot.
摘要:
Apparatus for combining two laser beams each having a power level into a common colinear laser beam having a power level that is the sum of the power levels of the two laser beams comprising a support, a polarization selective device disposed on the support having a first surfaces upon which a first of the laser beams impinges for transmitting the first laser beam with substantially full power transmission along an axis and having a second surface upon which the second laser beam impinges for reflecting the second laser beam with substantially full power along the axis, resulting in a common colinear beam along the axis, and suitable optical and/or mechanical devices disposed on the support for providing the first and second laser beams to the polarization selective device, the first and second laser beams being substantially orthogonally polarized with respect to each other.
摘要:
When the power output of a continuous wave oscillated laser is changed to a pulsed laser by Q-switching, in the conventional method of Q-switching, if the pulse repetition rate is changed, the condition of oscillated excitation is changed and the pulse waveform or pulse peak power are simultaneously changed; and therefore, a stable dulling process is impracticable.The present invention decreases the cavity loss of a laser oscillator during a pulse off by decreasing power output of the radio-frequency signal applied to the Q-switch, and consequently, controls the pulse waveform to that required for the roll dulling process. In accordance with the method of the invention, the roughness of the dulled roll surface consists of innumerable small craters and is suitable for a high speed fine dulling process.
摘要:
A controlled depth laser drilling system for a workpiece containing metallic conductors is provided having at least one laser beam (56 and/or 57 of FIG. 5) where a portion of the laser beam (44) will be reflected from the workpiece and back to a drilling depth monitoring means (43) containing optical means capable of reflecting a portion of the original and reflected laser beams into radiation detector means (46', 46" and/or 45', 45"), where the detector means are capable of converting the radiation received into a measurable electrical signals.
摘要:
A laser beam device for cutting a workpiece in which two circularly polarized beams of opposite polarizations and of slightly different frequencies are combined into the cutting beam.
摘要:
Apparatus and method for directing a controlled number of laser pulses onto a work piece to be machined. More specifically, the laser machining apparatus includes an excitable laser and an excitation lamp for continuously exciting the laser to emit a sequence of laser pulses. The application of the laser pulses to the work piece is controlled by an inner-cavity shutter that is opened to permit a precise number of pulses to be directed onto the work piece. The frequency (REP RATE) and pulse width of the laser pulses are controlled by the excitation lamp and, in turn, are set to create a progressive weld of significant depth and structural integrity. In particular there is provided control means for counting the number of laser pulses applied to a machining site of the work piece, whereby a known controllable quantity of energy is imparted to each site. To this end, the counting of the laser pulses begins after the completion of a laser pulse, whereby the actuation of the inner-cavity shutter is not synchronized to the computer but rather to the laser emission so that only whole laser pulses will be applied to the site.
摘要:
A thermal processing apparatus and method in which a first laser source, for example, a CO2 emitting at 10.6 μm is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.
摘要:
Laser welding methods include focusing laser radiation onto a first metal sheet disposed on a metal part, optionally with one or more intervening metal sheets therebetween. The laser radiation is steered to trace at least one spiral path to spot-weld together the metal parts. The laser radiation includes a center beam and an annular beam to maintain a stable keyhole. One method is tailored to weld aluminum parts, e.g., with high gas content and/or dissimilar compositions, and the laser radiation traces first an outward spiral path and then an inward spiral path. The center beam is pulsed during one segment of the inward spiral path. Another method is tailored to weld steel or copper parts having a coating at an interface therebetween, and the laser radiation traces an inward spiral path. The interface may be a zero-gap interface, or a non-zero gap may exist.