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    Electronic element module and printed circuit board for the same
    91.
    发明授权
    Electronic element module and printed circuit board for the same 有权

    公开(公告)号：US11715821B2

    公开(公告)日：2023-08-01

    申请号：US17215756

    申请日：2021-03-29

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jun Oh Hwang

    IPC: H01L33/62 ,  G02F1/13357 ,  H05K1/18 ,  H05K1/11

    CPC classification number: H01L33/62 ,  G02F1/133603 ,  H05K1/115 ,  H05K1/183 ,  H05K2201/10106

    Abstract: The present disclosure relates to an electronic element module including a printed circuit board including a first insulating layer having a plurality of first openings, and a build-up structure disposed on one surface of the first insulating layer and having a first through-portion, wherein the plurality of first openings are disposed in the first through-portion on a plane; a conductive adhesive disposed in at least a portion of each of the plurality of first openings; and a first electronic element disposed in the first through-portion, and having a plurality of first electrode pads disposed. At least a portion of each of the plurality of first electrode pads is disposed in the plurality of first openings.

    CIRCUIT BOARD
    92.
    发明公开
    CIRCUIT BOARD 审中-公开

    公开(公告)号：US20230240005A1

    公开(公告)日：2023-07-27

    申请号：US17928703

    申请日：2021-06-10

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Yong Suk KIM ,  Jeong Han KIM ,  Moo Seong KIM

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/0296 ,  H05K1/115

    Abstract: A circuit board according to an embodiment comprises: an insulation layer; a circuit pattern disposed on the upper surface or under the lower surface of the insulation layer; and a buffer layer disposed on at least one surface of the upper surface and the lower surface of the insulation layer, wherein the buffer layer includes carbon, nitrogen, and oxygen, the ratio of the nitrogen to the carbon ((carbon/nitrogen)*100) is 5 to 15, and the ratio of the oxygen to the carbon ((carbon/oxygen)*100) is 15 to 30.

    Electronic component, voltage regulation module and voltage stabilizer
    93.
    发明授权
    Electronic component, voltage regulation module and voltage stabilizer 有权

    公开(公告)号：US11711893B2

    公开(公告)日：2023-07-25

    申请号：US17477534

    申请日：2021-09-17

    Applicant: SHENNAN CIRCUITS CO., LTD.

    Inventor： Lixiang Huang ,  Jin Dong ,  Hua Miao

    IPC: H05K1/18 ,  H05K1/11

    CPC classification number: H05K1/185 ,  H05K1/115 ,  H05K1/181

    Abstract: The present disclosure relates to an electronic component, a voltage regulation module and a voltage stabilizer. The electronic component may include a substrate, a first electronic element and a second electronic element. The substrate may be provided with a first surface and a second surface that are opposite to each other. The first electronic element may be embedded in the substrate, and may be provided with a first electrical connection terminal and a second electrical connection terminal. The first electrical connection terminal may connect with a first surface of the substrate, the second electrical connection terminal may connect with a second surface of the substrate. The second electronic element may be arranged on the second surface of the substrate and electrically connected to the second electrical connection terminal. The second electronic element may form a stack with the substrate along the first direction.

    SEMICONDUCTOR PACKAGE
    96.
    发明公开
    SEMICONDUCTOR PACKAGE 审中-公开

    公开(公告)号：US20230232544A1

    公开(公告)日：2023-07-20

    申请号：US18098578

    申请日：2023-01-18

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Myung Jae KWON ,  Sang Hyuck NAM ,  Jin Hyoung PARK

    IPC: H05K3/46 ,  H05K3/42 ,  H05K1/11

    CPC classification number: H05K3/4644 ,  H05K3/427 ,  H05K1/115 ,  H05K2201/0959

    Abstract: A semiconductor package according to an embodiment includes a first insulating layer including a through hole; an insulating member disposed in the through hole of the first insulating layer; a first electrode layer disposed on the insulating member; a second insulating layer disposed on the first electrode layer; and a first through electrode passing through the second insulating layer, wherein the first through electrode overlaps the first electrode layer and the insulating member in a vertical direction.

    FLEXIBLE CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE COMPRISING THE SAME
    98.
    发明公开
    FLEXIBLE CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE COMPRISING THE SAME 审中-公开

    公开(公告)号：US20230225048A1

    公开(公告)日：2023-07-13

    申请号：US18151698

    申请日：2023-01-09

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Seung Soo CHO ,  Hyung Kyu YOON ,  Sung Min CHAE

    IPC: H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/0296 ,  H05K1/028 ,  H05K1/115

    Abstract: A flexible circuit board comprises a substrate on which a chip mounting area is defined, a circuit pattern disposed on the substrate, and a protective layer on the circuit pattern, and the circuit pattern includes a plurality of first circuit patterns, a plurality of second circuit patterns, and a plurality of dummy patterns, and the first circuit pattern includes a first pad part, a second pad part, and a first wiring part connected to the first pad part and the second pad part, and the second circuit pattern includes a third pad part, a fourth pad part, and a second wiring part connected to the third pad part and the fourth pad part, and a through hole is disposed in an inner region of the first circuit pattern.

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