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    Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices
    107.
    发明授权
    Packaged microelectronic devices with pressure release elements and methods for manufacturing and using such packaged microelectronic devices 失效
    具有压力释放元件的封装的微电子器件以及用于制造和使用这种封装的微电子器件的方法

    公开(公告)号：US06979595B1

    公开(公告)日：2005-12-27

    申请号：US09645640

    申请日：2000-08-24

    申请人： Stephen L. James ,  Chad A. Cobbley

    发明人： Stephen L. James ,  Chad A. Cobbley

    IPC分类号： H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

    CPC分类号： H01L23/564 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

    摘要： Packaged microelectronic devices, interconnecting units for packaged microelectronic devices, and methods and apparatuses for packaging microelectronic devices with pressure release elements. In one aspect of the invention, a packaged microelectronic device includes a microelectronic die, an interconnecting unit coupled to the die, and a protective casing over the die. The interconnecting unit can have a substrate with a first side and a second side to which the die is attached, a plurality of contact elements operatively coupled to corresponding bond-pads on the die, and a plurality of ball-pads on the first side of the substrate electrically coupled to the contact elements. The protective casing can have at least a first cover encapsulating the die on the first side of the substrate. The packaged microelectronic device can also include a pressure relief element through at least a portion of the first cover and/or the substrate. The pressure relief element can have an opening to an external environment and a passageway to an internal location within the packaged microelectronic device. In operation, the pressure relief element releases gases or other forms of moisture entrapped by the casing and/or the substrate during high temperature processing of the packaged microelectronic device.

    摘要翻译： 封装的微电子器件，用于封装的微电子器件的互连单元，以及用于封装具有压力释放元件的微电子器件的方法和装置。 在本发明的一个方面，封装的微电子器件包括微电子管芯，耦合到管芯的互连单元以及管芯上的保护套管。 互连单元可以具有基板，该基板具有连接芯片的第一侧和第二侧，多个接触元件可操作地连接到管芯上相应的接合焊盘，以及在第一侧上的多个球垫 所述基板电耦合到所述接触元件。 保护壳体可以具有至少第一盖，该第一盖在基板的第一侧封装模具。 封装的微电子器件还可以包括通过第一盖和/或基底的至少一部分的压力释放元件。 减压元件可以具有到外部环境的开口和通向包装的微电子器件内的内部位置的通道。 在操作中，压力释放元件在包装的微电子器件的高温处理期间释放由壳体和/或衬底截留的气体或其它形式的水分。

    Method for manufacturing flip-chip semiconductor assembly
    108.
    发明授权
    Method for manufacturing flip-chip semiconductor assembly 失效
    制造倒装芯片半导体组件的方法

    公开(公告)号：US06972200B2

    公开(公告)日：2005-12-06

    申请号：US10693286

    申请日：2003-10-23

    申请人： Chad A. Cobbley ,  John VanNortwick ,  Bret K. Street ,  Tongbi Jiang

    发明人： Chad A. Cobbley ,  John VanNortwick ,  Bret K. Street ,  Tongbi Jiang

    IPC分类号： G01R1/04 ,  H01L21/66

    CPC分类号： G01R1/0483 ,  Y10T29/4913 ,  Y10T29/49144

    摘要： Flip-chip semiconductor assemblies, each including integrated circuit (IC) dice and an associated substrate, are electrically tested before encapsulation using an in-line or in-situ test socket or probes at a die-attach station. Those assemblies using “wet” quick-cure epoxies for die-attachment may be tested prior to the epoxy being cured by pressing the integrated circuit (IC) dice against interconnection bumps on the substrate for electrical connection, while those assemblies using “dry” epoxies may be cured prior to testing. In either case, any failures in the dice or in the interconnections between the dice and the substrates can be easily fixed, and the need for the use of “known good dice” (KGD) rework procedures during repair is eliminated.

    摘要翻译： 每个包括集成电路（IC）裸片和相关衬底的倒装芯片半导体组件在封装之前使用在线或原位测试插座或芯片附接站的探针进行电测试。 在通过将集成电路（IC）芯片压在基板上的互连凸块以进行电连接的环氧树脂固化之前，可以测试使用“湿”快速固化环氧树脂进行芯片附着的那些组件，而使用“干”环氧树脂 可以在测试之前治愈。 在任一情况下，骰子或骰子与基板之间的互连中的任何故障都可以很容易地固定，并且在修理期间需要使用“已知的好的骰子”（KGD）返工程序。