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公开(公告)号：US08508034B2
公开(公告)日：2013-08-13
申请号：US13362644
申请日：2012-01-31
CPC分类号： H01L23/28 , B33Y80/00 , H01L21/4803 , H01L21/481 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/48 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L27/14683 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00011 , H01L2224/45099 , H01L2924/00
摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。
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2.发明授权Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor 有权制造用于光学交互式电子设备及其封装组件的封装组件的方法公开(公告)号：US08426954B2
公开(公告)日：2013-04-23
申请号：US13212579
申请日：2011-08-18
申请人： Todd O. Bolken , Chad A. Cobbley
发明人： Todd O. Bolken , Chad A. Cobbley
IPC分类号： H01L23/02
CPC分类号： H01L23/00 , B33Y80/00 , H01L21/50 , H01L23/02 , H01L23/3128 , H01L24/97 , H01L27/14618 , H01L27/14632 , H01L27/14636 , H01L27/14687 , H01L31/0203 , H01L2224/05573 , H01L2224/13025 , H01L2224/16235 , H01L2224/48091 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/05599
摘要： Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with back side conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier.
摘要翻译： 用于光学交互式装置的包装组件和以有效方式形成包装组件的方法，其消除或减少工艺污染物的发生。 在第一实施例中，透明盖附着到包含多个光学交互装置的半导体材料的晶片上。 晶片被分离，并且光学交互设备安装在插入器上并与引线键合电连接。 在第二实施例中，光学交互设备与背面导电元件电连接到插入器。 在第三实施例中，在附加透明盖之前，将光学交互式装置安装到插入器。 在该插入件上方形成一层密封材料，并且切断插入物和密封剂材料以提供单独的包装组件。 在第四实施例中，光学交互式装置安装在预先形成的无引线芯片载体中。
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3.发明申请公开(公告)号：US20110298077A1
公开(公告)日：2011-12-08
申请号：US13212579
申请日：2011-08-18
申请人： Todd O. Bolken , Chad A. Cobbley
发明人： Todd O. Bolken , Chad A. Cobbley
IPC分类号： H01L31/0203 , H01L31/18 , H01L21/82
CPC分类号： H01L23/00 , B33Y80/00 , H01L21/50 , H01L23/02 , H01L23/3128 , H01L24/97 , H01L27/14618 , H01L27/14632 , H01L27/14636 , H01L27/14687 , H01L31/0203 , H01L2224/05573 , H01L2224/13025 , H01L2224/16235 , H01L2224/48091 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/05599
摘要： Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with back side conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier.
摘要翻译： 用于光学交互式装置的包装组件和以有效方式形成包装组件的方法，其消除或减少工艺污染物的发生。 在第一实施例中，透明盖附着到包含多个光学交互装置的半导体材料的晶片上。 晶片被分离，并且光学交互设备安装在插入器上并与引线键合电连接。 在第二实施例中，光学交互设备与背面导电元件电连接到插入器。 在第三实施例中，在附加透明盖之前，将光学交互式装置安装到插入器。 在该插入件上方形成一层密封材料，并且切断插入物和密封剂材料以提供单独的包装组件。 在第四实施例中，光学交互式装置安装在预先形成的无引线芯片载体中。
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公开(公告)号：US06995462B2
公开(公告)日：2006-02-07
申请号：US10664845
申请日：2003-09-17
申请人： Todd O. Bolken , Chad A. Cobbley
发明人： Todd O. Bolken , Chad A. Cobbley
IPC分类号： H01L23/00
CPC分类号： H01L23/00 , B33Y80/00 , H01L21/50 , H01L23/02 , H01L23/3128 , H01L24/97 , H01L27/14618 , H01L27/14632 , H01L27/14636 , H01L27/14687 , H01L31/0203 , H01L2224/05573 , H01L2224/13025 , H01L2224/16235 , H01L2224/48091 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/16195 , H01L2924/16235 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2224/05599
摘要： Packaging assemblies for optically interactive devices and methods of forming the packaging assemblies in an efficient manner that eliminates or reduces the occurrence of process contaminants. In a first embodiment, a transparent cover is attached to a wafer of semiconductor material containing a plurality of optically interactive devices. The wafer is singulated, and the optically interactive devices are mounted on an interposer and electrically connected with wire bonds. In a second embodiment, the optically interactive devices are electrically connected to the interposer with backside conductive elements. In a third embodiment, the optically interactive devices are mounted to the interposer prior to attaching a transparent cover. A layer of encapsulant material is formed over the interposer, and the interposer and encapsulant material are cut to provide individual packaging assemblies. In a fourth embodiment, the optically interactive devices are mounted in a preformed leadless chip carrier.
摘要翻译： 用于光学交互式装置的包装组件和以有效方式形成包装组件的方法，其消除或减少工艺污染物的发生。 在第一实施例中，透明盖附着到包含多个光学交互装置的半导体材料的晶片上。 晶片被分离，并且光学交互设备安装在插入器上并与引线键合电连接。 在第二实施例中，光学交互式设备与背面导电元件电连接到插入器。 在第三实施例中，在附加透明盖之前，将光学交互式装置安装到插入器。 在该插入件上方形成一层密封材料，并且切断插入物和密封剂材料以提供单独的包装组件。 在第四实施例中，光学交互式装置安装在预先形成的无引线芯片载体中。
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公开(公告)号：US06518654B1
公开(公告)日：2003-02-11
申请号：US09834415
申请日：2001-04-13
IPC分类号： H01L2302
CPC分类号： H01L21/561 , H01L21/565 , H01L23/3107 , H01L24/32 , H01L24/48 , H01L24/97 , H01L2224/05599 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/30107 , H05K3/303 , H05K3/305 , H05K3/3436 , H05K2201/10568 , H05K2201/10734 , H05K2201/10977 , H05K2201/2036 , Y02P70/613 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A ball grid array assembly includes a package cover that encapsulates a die and a portion of a substrate to which the die is attached, including an edge of the substrate. Encapsulation of the substrate edge by the cover reduces penetration of moisture or other contaminants into the substrate. The cover includes a rib that extends to contact a circuit board to which the ball grid array assembly is connected. With such a rib, planarity between the circuit board and the substrate is maintained during soldering.
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公开(公告)号：US08629558B2
公开(公告)日：2014-01-14
申请号：US13490082
申请日：2012-06-06
申请人： Todd O. Bolken , Chad A. Cobbley
发明人： Todd O. Bolken , Chad A. Cobbley
IPC分类号： H01L21/00
CPC分类号： H01L25/50 , H01L23/3128 , H01L23/5383 , H01L24/10 , H01L24/13 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L2224/05599 , H01L2224/13 , H01L2224/13099 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/85424 , H01L2224/85444 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/15747 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： Techniques for fabricating multiple device components. Specifically, techniques for fabricating a stacked package comprising at least one I/C module and a multi-chip package. The multi-chip package includes a plurality of integrated circuit dice coupled to a carrier. The dice are encapsulated such that conductive elements are exposed through the encapsulant. The conductive elements are electrically coupled to the chips. The I/C module comprises an interposer having a plurality of integrated circuit dice disposed thereon. The dice of the I/C module are electrically coupled to the interposer via bondwires. The interposer is configured such that vias are aligned with the conductive elements on the multi-chip package. The multi-chip package and I/C module may be fabricated separately and subsequently coupled together to form a stacked package.
摘要翻译： 制造多器件组件的技术。 具体地，涉及用于制造包括至少一个I / C模块和多芯片封装的堆叠封装的技术。 多芯片封装包括耦合到载体的多个集成电路芯片。 骰子被封装，使得导电元件通过密封剂暴露。 导电元件电耦合到芯片。 I / C模块包括具有设置在其上的多个集成电路芯片的插入器。 I / C模块的裸片通过焊丝电耦合到插入器。 插入器被配置为使得通孔与多芯片封装上的导电元件对准。 多芯片封装和I / C模块可以单独制造，然后耦合在一起以形成堆叠封装。
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公开(公告)号：US08115296B2
公开(公告)日：2012-02-14
申请号：US12579187
申请日：2009-10-14
CPC分类号： H01L23/28 , B33Y80/00 , H01L21/4803 , H01L21/481 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/48 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L27/14683 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00011 , H01L2224/45099 , H01L2924/00
摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。
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公开(公告)号：US20100264532A1
公开(公告)日：2010-10-21
申请号：US12579187
申请日：2009-10-14
IPC分类号： H01L23/10
CPC分类号： H01L23/28 , B33Y80/00 , H01L21/4803 , H01L21/481 , H01L21/50 , H01L23/055 , H01L23/10 , H01L23/48 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L27/14618 , H01L27/14683 , H01L2224/0401 , H01L2224/05599 , H01L2224/16225 , H01L2224/16235 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/48997 , H01L2224/49171 , H01L2224/73204 , H01L2224/85399 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/00011 , H01L2224/45099 , H01L2924/00
摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.
摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的壳体结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。
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公开(公告)号：US07399657B2
公开(公告)日：2008-07-15
申请号：US10209753
申请日：2002-07-31
申请人： Todd O. Bolken , Chad A. Cobbley
发明人： Todd O. Bolken , Chad A. Cobbley
CPC分类号： H01L23/3128 , H01L21/56 , H01L21/561 , H01L23/367 , H01L23/4334 , H01L24/48 , H01L24/97 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/30107 , Y10S206/832 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： Ball grid array packages for semiconductor die include a thermally conductive container and a substrate that substantially enclose a semiconductor die. The die is positioned with respect to the container by thermally conductive supports formed in the container or attached to the container. The die contacts the supports so that the die and the container form a cavity that is at least partially filled with a thermally conductive material such as a conductive epoxy to promote thermal conduction between the die and the container. The die electrically connects to the substrate with bond wires that extend through an aperture in the substrate and attach to bond pads provided on the substrate. The aperture is typically filled with a protective layer of resin, epoxy, or other material that also encapsulates the bond wires. Solder balls are provided for electrical connection or the substrate and the die to a circuit board or other circuit element, and an encapsulant layer covers the surface of the substrate but permits electrical connection to the bond pads. Methods for packaging semiconductor die in such packages are also provided.
摘要翻译： 用于半导体管芯的球栅阵列封装包括基本上封装半导体管芯的导热容器和衬底。 模具通过形成在容器中或附接到容器的导热支撑件相对于容器定位。 模具接触支撑件，使得模具和容器形成至少部分地填充有诸如导电环氧树脂的导热材料的空腔，以促进模具和容器之间的热传导。 模具通过键合线电连接到衬底，接合线延伸穿过衬底中的孔并且附接到设置在衬底上的接合焊盘。 孔通常填充有树脂，环氧树脂或也封装接合线的其它材料的保护层。 提供用于电连接的焊球或基板和管芯到电路板或其它电路元件，并且密封剂层覆盖基板的表面，但允许电连接到接合焊盘。 还提供了用于将这种封装中的半导体管芯封装的方法。
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10.发明授权Semiconductor component having stacked, encapsulated dice and method of fabrication 有权半导体元件具有堆叠，封装的骰子和制造方法公开(公告)号：US07227252B2
公开(公告)日：2007-06-05
申请号：US11205572
申请日：2005-08-17
申请人： Todd O. Bolken , Chad A. Cobbley
发明人： Todd O. Bolken , Chad A. Cobbley
CPC分类号： H01L25/0657 , B33Y70/00 , B33Y80/00 , H01L21/565 , H01L23/3128 , H01L23/3135 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L25/03 , H01L25/0652 , H01L25/105 , H01L25/50 , H01L2224/05554 , H01L2224/05599 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/85424 , H01L2224/8547 , H01L2224/97 , H01L2225/0651 , H01L2225/06524 , H01L2225/06555 , H01L2225/06582 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/01087 , H01L2924/09701 , H01L2924/10161 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15184 , H01L2924/15311 , H01L2924/181 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor component includes a substrate and multiple stacked, encapsulated semiconductor dice on the substrate. A first die is back bonded to the substrate and encapsulated in a first encapsulant, and a second die is back bonded to the first encapsulant. The first encapsulant has a planar surface for attaching the second die, and can also include locking features for the second die. The component also includes a second encapsulant encapsulating the second die and forming a protective body for the component. A method for fabricating the component includes the steps of attaching the first die to the substrate, forming the first encapsulant on the first die, attaching the second die to the first encapsulant, and forming the second encapsulant on the second die.
摘要翻译： 半导体部件包括衬底和在衬底上的多个堆叠的，封装的半导体晶片。 将第一管芯重新结合到衬底并封装在第一密封剂中，并且将第二管芯重新结合到第一密封剂上。 第一密封剂具有用于附接第二模具的平坦表面，并且还可以包括用于第二模具的锁定特征。 该组件还包括封装第二模具的第二密封剂并且形成用于该部件的保护体。 一种制造该部件的方法包括以下步骤：将第一管芯附接到基板上，在第一管芯上形成第一密封剂，将第二管芯附接到第一密封剂，以及在第二管芯上形成第二密封剂。
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