SEMICONDUCTOR DEVICE, STORAGE DEVICE, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

    公开(公告)号:US20250056786A1

    公开(公告)日:2025-02-13

    申请号:US18723731

    申请日:2022-12-15

    Abstract: A semiconductor device that can be miniaturized or highly integrated is provided. The semiconductor device includes a transistor and a capacitor; the transistor includes an oxide, a first conductor and a second conductor over the oxide, a first insulator that is placed over the first conductor and the second conductor and includes a first opening and a second opening, a second insulator in the first opening of the first insulator, and a third conductor over the second insulator; the first opening in the first insulator includes a region overlapping with the oxide; the third conductor includes a region overlapping with the oxide with the second insulator therebetween; the capacitor includes the second conductor, a third insulator in the second opening of the first insulator, and a fourth conductor over the third insulator; and the distance between the first conductor and the second conductor is smaller than the width of the first opening in a cross-sectional view of the transistor in a channel length direction.

    ELECTRONIC DEVICE AND DISPLAY SYSTEM

    公开(公告)号:US20240402994A1

    公开(公告)日:2024-12-05

    申请号:US18683540

    申请日:2022-09-08

    Abstract: An electronic device with a novel structure is provided. In an electronic device including a semiconductor device, the semiconductor device includes a CPU, an accelerator, and a memory device. The CPU includes a scan flip-flop circuit and a backup circuit electrically connected to the scan flip-flop circuit. The backup circuit includes a first transistor. The accelerator includes an arithmetic circuit and a data retention circuit electrically connected to the arithmetic circuit. The data retention circuit includes a second transistor. The memory device includes a memory cell including a third transistor. The first transistor to the third transistor each include a semiconductor layer containing a metal oxide in a channel formation region.

    SEMICONDUCTOR DEVICE
    109.
    发明申请

    公开(公告)号:US20220149044A1

    公开(公告)日:2022-05-12

    申请号:US17579640

    申请日:2022-01-20

    Inventor: Kiyoshi KATO

    Abstract: An object is to provide a semiconductor device with a novel structure in which stored data can be held even when power is not supplied and there is no limit on the number of write operations. The semiconductor device includes a first memory cell including a first transistor and a second transistor, a second memory cell including a third transistor and a fourth transistor, and a driver circuit. The first transistor and the second transistor overlap at least partly with each other. The third transistor and the fourth transistor overlap at least partly with each other. The second memory cell is provided over the first memory cell. The first transistor includes a first semiconductor material. The second transistor, the third transistor, and the fourth transistor include a second semiconductor material.

    MEMORY DEVICE AND ELECTRONIC DEVICE
    110.
    发明申请

    公开(公告)号:US20210183860A1

    公开(公告)日:2021-06-17

    申请号:US17047143

    申请日:2019-04-11

    Abstract: A novel semiconductor device is provided. A semiconductor device includes a plurality of cell arrays and a plurality of peripheral circuits. The cell array includes a plurality of memory cells. The peripheral circuit includes a first driver circuit, a second driver circuit, a first amplifier circuit, a second amplifier circuit, a third amplifier circuit, and a fourth amplifier circuit. The first driver circuit and the second driver circuit each have a function of supplying a selection signal to the cell array. The first amplifier circuit and the second amplifier circuit each have a function of amplifying a potential input from the cell array. The third amplifier circuit and the fourth amplifier circuit each have a function of amplifying a potential input from the first amplifier circuit or the second amplifier circuit. The first driver circuit, the second driver circuit, the first amplifier circuit, the second amplifier circuit, the third amplifier circuit, and the fourth amplifier circuit have a region overlapping with the cell array. A transistor included in the memory cell includes a metal oxide in a channel formation region.

Patent Agency Ranking