公开(公告)号：US10483609B2

公开(公告)日：2019-11-19

申请号：US15614969

申请日：2017-06-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Robert Floyd Payne ,  Gerd Schuppener ,  Juan Alejandro Herbsommer

IPC: H01P3/16 ,  H01P11/00

Abstract: A digital system has a dielectric core waveguide that is formed within a multilayer substrate. The dielectric waveguide has a longitudinal dielectric core member formed in the core layer having two adjacent longitudinal sides each separated from the core layer by a corresponding slot portion formed in the core layer The dielectric core member has the first dielectric constant value. A cladding surrounds the dielectric core member formed by a top layer and the bottom layer infilling the slot portions of the core layer. The cladding has a dielectric constant value that is lower than the first dielectric constant value.

公开(公告)号：US10390433B2

公开(公告)日：2019-08-20

申请号：US14674809

申请日：2015-03-31

Applicant: Texas Instruments Incorporated

Inventor： Benjamin S. Cook ,  Juan Alejandro Herbsommer

IPC: H05K1/16 ,  H05K1/09 ,  H05K3/30 ,  H01L23/522 ,  H01L27/08 ,  H01L23/498 ,  H01L21/48 ,  H05K3/12

Abstract: Described examples include methods of fabricating conductive and resistive structures by direct-write variable impedance patterning using nanoparticle-based metallization layers or chemical reaction-based deposition. In some examples, a low conductivity nanoparticle material is deposited over a surface. The nanoparticle material is selectively illuminated at different applied energy levels via illumination source power adjustments and/or scan rate adjustments for selective patterned sintering to create conductive circuit structures as well as resistive circuit structures including gradient resistive circuit structures having an electrical resistivity profile that varies along the structure length. Further examples include methods in which a non-conductive reactant layer is deposited or patterned, and a second solution is deposited in varying amounts using an additive deposition for reaction with the reactant layer to form controllably conductive structures.

公开(公告)号：US20190243065A1

公开(公告)日：2019-08-08

申请号：US16387843

申请日：2019-04-18

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Juan Alejandro Herbsommer ,  Benjamin S. Cook

IPC: G02B6/122 ,  H04B10/25 ,  G02B6/13 ,  G02B6/036 ,  B29C33/38 ,  G02B6/42

CPC classification number: G02B6/1221 ,  B29C33/38 ,  B33Y10/00 ,  B33Y80/00 ,  G02B6/036 ,  G02B6/13 ,  G02B6/42 ,  G02B6/4203 ,  H04B10/25

Abstract: A digital system has a dielectric core waveguide that has a longitudinal dielectric core member. The core member has a body portion and a transition region, with a cladding surrounding the dielectric core member. The body portion of the core member has a first dielectric constant. The transition region of the core member has a graduated dielectric constant value that gradually changes from the first dielectric constant value adjacent the body portion to a third dielectric constant.

公开(公告)号：US10364144B2

公开(公告)日：2019-07-30

申请号：US15815849

申请日：2017-11-17

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Adam Joseph Fruehling ,  Simon Joshua Jacobs

IPC: B81C1/00 ,  H03L7/26 ,  G04F5/14

Abstract: Disclosed examples provide gas cells and a method of fabricating a gas cell, including forming a cavity in a first substrate, forming a first conductive material on a sidewall of the cavity, forming a glass layer on the first conductive material, forming a second conductive material on a bottom side of a second substrate, etching the second conductive material to form apertures through the second conductive material, forming conductive coupling structures on a top side of the second substrate, and bonding a portion of the bottom side of the second substrate to a portion of the first side of the first substrate to seal the cavity.

公开(公告)号：US20190204786A1

公开(公告)日：2019-07-04

申请号：US16234492

申请日：2018-12-27

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Argyrios Dellis ,  Adam Joseph Fruehling

IPC: G04F5/14 ,  H03L7/26 ,  H03B17/00

Abstract: A clock apparatus, with: (i) a gas cell, including a cavity including a sealed interior for providing a signal waveguide; (ii) a first apparatus for providing a first electromagnetic wave to travel in the cavity and along a first direction; (iii) a second apparatus for providing a second electromagnetic wave to travel in the cavity and along a second direction opposite the first direction; (iv) a dipolar gas inside the sealed interior of the cavity; and (v) receiving apparatus for detecting an amount of energy in the second electromagnetic wave after the second electromagnetic wave passes through the dipolar gas.

公开(公告)号：US10302860B2

公开(公告)日：2019-05-28

申请号：US15608323

申请日：2017-05-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Juan Alejandro Herbsommer ,  Benjamin S. Cook

IPC: G02B6/122 ,  G02B6/42 ,  B29C33/38 ,  G02B6/036 ,  G02B6/13 ,  H04B10/25 ,  B33Y10/00 ,  B33Y80/00

Abstract: A digital system has a dielectric core waveguide that has a longitudinal dielectric core member. The core member has a body portion and a transition region, with a cladding surrounding the dielectric core member. The body portion of the core member has a first dielectric constant. The transition region of the core member has a graduated dielectric constant value that gradually changes from the first dielectric constant value adjacent the body portion to a third dielectric constant.

公开(公告)号：US20170261687A1

公开(公告)日：2017-09-14

申请号：US15608323

申请日：2017-05-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Juan Alejandro Herbsommer ,  Benjamin S. Cook

IPC: G02B6/122 ,  G02B6/13 ,  G02B6/036 ,  B29C33/38 ,  G02B6/42 ,  H04B10/25

CPC classification number: G02B6/1221 ,  B29C33/38 ,  B33Y10/00 ,  B33Y80/00 ,  G02B6/036 ,  G02B6/13 ,  G02B6/42 ,  G02B6/4203 ,  H04B10/25

Abstract: A digital system has a dielectric core waveguide that has a longitudinal dielectric core member. The core member has a body portion and a transition region, with a cladding surrounding the dielectric core member. The body portion of the core member has a first dielectric constant. The transition region of the core member has a graduated dielectric constant value that gradually changes from the first dielectric constant value adjacent the body portion to a third dielectric constant.

公开(公告)号：US09761950B2

公开(公告)日：2017-09-12

申请号：US14521443

申请日：2014-10-22

Applicant: Texas Instruments Incorporated

Inventor： Benjamin S. Cook ,  Juan Alejandro Herbsommer

IPC: H01Q1/50 ,  H01Q9/16 ,  H01P11/00 ,  H01P3/12 ,  H01P5/08 ,  H01Q1/40 ,  H01P3/16

CPC classification number: H01Q9/16 ,  H01P3/122 ,  H01P3/16 ,  H01P5/087 ,  H01P11/006 ,  H01Q1/40

Abstract: A digital system has a dielectric core waveguide that has a longitudinal dielectric core member. The core member has a body portion and may have a cladding surrounding the dielectric core member. A radiated radio frequency (RF) signal may be received on a first portion of a radiating structure embedded in the end of a dielectric waveguide (DWG). Simultaneously, a derivative RF signal may be launched into the DWG from a second portion of the radiating structure embedded in the DWG.

公开(公告)号：US09679864B2

公开(公告)日：2017-06-13

申请号：US15293075

申请日：2016-10-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen Cook ,  Juan Alejandro Herbsommer ,  Matthew David Romig ,  Steven Alfred Kummerl ,  Wei-Yan Shih

IPC: H01L21/44 ,  H01L23/00 ,  H01L21/768 ,  H01L23/528 ,  H01L21/48 ,  H01L23/552 ,  H01L23/538 ,  H01L23/66

CPC classification number: H01L24/27 ,  H01L21/4867 ,  H01L21/76838 ,  H01L23/528 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/66 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L2223/6627 ,  H01L2224/24998 ,  H01L2224/2732 ,  H01L2224/27848 ,  H01L2224/29026 ,  H01L2224/29076 ,  H01L2224/32227 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method forming a packaged semiconductor device includes providing a first semiconductor die (first die) having bond pads thereon mounted face-up on a package substrate or on a die pad of a lead frame (substrate), wherein the substrate includes terminals or contact pads (substrate pads). A first dielectric layer is formed including printing a first dielectric precursor layer including a first ink having a first liquid carrier solvent extending from the substrate pads to the bond pads. A first interconnect precursor layer is printed including a second ink having a second liquid carrier over the first dielectric layer extending from the substrate pads to the bond pads. Sintering or curing the first interconnect precursor layer removes at least the second liquid carrier to form an electrically conductive interconnect including an ink residue which connects respective substrate pads to respective bond pads.

公开(公告)号：US09647329B2

公开(公告)日：2017-05-09

申请号：US14585724

申请日：2014-12-30

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Matthew David Romig

IPC: H01Q1/50 ,  H01Q1/40 ,  H01L23/66 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01Q19/10 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01Q1/40 ,  H01L21/561 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/495 ,  H01L23/49517 ,  H01L23/66 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2223/6611 ,  H01L2223/6627 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/16265 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30111 ,  H01Q9/0407 ,  H01Q9/16 ,  H01Q19/108 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099

Abstract: An encapsulated integrated circuit has transceiver circuitry operable to produce and/or receive a radio frequency (RF) signal, wherein bond pads on the IC die are coupled to the transceiver input/output (IO) circuitry. An antenna structure is coupled to the IO circuitry via the bond pads. Mold material encapsulates the IC die and the antenna structure, wherein the antenna structure is positioned so as to be approximately in alignment with a core of a dielectric waveguide positioned adjacent the encapsulated IC.