Efficiently micro-transfer printing micro-scale devices onto large-format substrates

    公开(公告)号:US10217730B2

    公开(公告)日:2019-02-26

    申请号:US15440756

    申请日:2017-02-23

    Abstract: A method of making a micro-transfer printed system includes providing a source wafer having a plurality of micro-transfer printable source devices arranged at a source spatial density; providing an intermediate wafer having a plurality of micro-transfer printable intermediate supports arranged at an intermediate spatial density less than or equal to the source spatial density; providing a destination substrate; micro-transfer printing the source devices from the source wafer to the intermediate supports of the intermediate wafer with a source stamp having a plurality of posts at a source transfer density to make an intermediate device on each intermediate support; and micro-transfer printing the intermediate devices from the intermediate wafer to the destination substrate at a destination spatial density less than the source spatial density with an intermediate stamp having a plurality of posts at an intermediate transfer density less than the source transfer density.

    Color-filter device
    112.
    发明授权

    公开(公告)号:US10199546B2

    公开(公告)日:2019-02-05

    申请号:US15663437

    申请日:2017-07-28

    Abstract: A micro-transfer color-filter device comprises a color filter, an electrical conductor disposed in contact with the color filter, and at least a portion of a color-filter tether attached to the color filter or structures formed in contact with the color filter. In certain embodiments, a color filter is a variable color filter electrically controlled through one or more electrodes and can be responsive to heat, electrical current, or an electrical field to modify its optical properties, such as color, transparency, absorption, or reflection. In certain embodiments, A color-filter device includes connection posts and can be provided in or on a source wafer suitable for micro-transfer printing. In some embodiments, a color-filter device is disposed on a device substrate and can include a control circuit for controlling the color filter. An array of micro-transfer color-filter devices can be disposed on a display substrate in order to form a display.

    Display with micro-LED front light
    114.
    发明授权

    公开(公告)号:US10133426B2

    公开(公告)日:2018-11-20

    申请号:US14849242

    申请日:2015-09-09

    Abstract: A reflective display includes an array of reflective pixels in or beneath a display viewing area for viewing electronically displayed information. A layer is located on or over the display viewing area through which the display viewing area is viewed and a plurality of micro-LEDs is located on the layer in the display viewing area and arranged to emit light toward the display viewing area. A plurality of conductors is located on the layer and the conductors are electrically connected to the micro-LEDs. A controller is connected to the conductors to control the micro-LEDs to emit light illuminating the display viewing area.

    Pressure-activated electrical interconnection by micro-transfer printing

    公开(公告)号:US10103069B2

    公开(公告)日:2018-10-16

    申请号:US15461703

    申请日:2017-03-17

    Abstract: A printed electrical connection structure includes a substrate having one or more electrical connection pads and a micro-transfer printed component having one or more connection posts. Each connection post is in electrical contact with a connection pad. A resin is disposed between and in contact with the substrate and the component. The resin has a reflow temperature less than a cure temperature. The resin repeatedly flows at the reflow temperature when temperature-cycled between an operating temperature and the reflow temperature but does not flow after the resin is exposed to a cure temperature. A solder can be disposed on the connection post or the connection pad. After printing and reflow, the component can be tested and, if the component fails, another component is micro-transfer printed to the substrate, the resin is reflowed again, the other component is tested and, if it passes the test, the resin is finally cured.

    Layers of safety and failsafe capability for operation of class IV laser in consumer electronics devices

    公开(公告)号:US10027181B2

    公开(公告)日:2018-07-17

    申请号:US15280584

    申请日:2016-09-29

    Abstract: An optical power transfer device includes a transmitter circuit, including a laser light source that is configured to emit coherent light responsive to operation above a lasing threshold, and is configured to emit incoherent light responsive operation below the lasing threshold. A proximity sensor circuit is coupled to the transmitter circuit and is configured to output a detection signal therefrom responsive to authentication of an optical receiver including at least one photovoltaic cell having surface area of about 4 square millimeters or less within a proximity thereof. The transmitter circuit is configured to operate the laser light source below the lasing threshold to emit the incoherent light responsive to an absence of the detection signal from the proximity sensor circuit. Related devices and methods of operation are also discussed.

    Small-aperture-ratio display with electrical component

    公开(公告)号:US09991163B2

    公开(公告)日:2018-06-05

    申请号:US14754573

    申请日:2015-06-29

    CPC classification number: H01L21/77 G09F9/33 H01L25/0753 H01L25/167

    Abstract: A small-aperture-ratio display includes a display substrate and a plurality of spatially separated pixel elements distributed over the display substrate. Each pixel element includes one or more light emitters. An active electrical component is electrically connected to each of the pixel elements and each active electrical component is located on the display substrate at least partly between the pixel elements. The display substrate has a contiguous display substrate area that includes the pixel elements, the light emitters each have a light-emissive area, and the substrate area is greater than or equal to one-quarter the combined light-emissive areas of the light emitters.

    Serial row-select matrix-addressed system

    公开(公告)号:US09930277B2

    公开(公告)日:2018-03-27

    申请号:US15003721

    申请日:2016-01-21

    Inventor: Ronald S. Cok

    Abstract: A matrix-addressed system includes a system substrate and an array of pixels arranged in rows and columns disposed on the system substrate. A column-control circuit provides information to or receives information from the pixels. The column-control circuit includes a separate column-driver circuit connected to each column of pixels that provides information in common to all of the pixels in the column or receives information in common from all of the pixels in the column. A row-select circuit likewise disposed on the system substrate includes a serial shift register having a number of row storage elements equal to or larger than the number of rows in the array of pixels. Each row storage element in the shift register has a row-select line connected to all of the pixels in a row.

    ELECTRICALLY PARALLEL FUSED LEDS
    120.
    发明申请

    公开(公告)号:US20180007750A1

    公开(公告)日:2018-01-04

    申请号:US15704630

    申请日:2017-09-14

    Abstract: An LED component comprises a plurality of fused light-emitting diodes (LEDs) (e.g., micro-transfer printable or micro-transfer printed LEDs). Each fused LED comprises an LED with first and second LED electrical connections for providing power to the LED and a fuse with first and second fuse electrical connections. The first LED electrical connection is electrically connected to the first electrode. The first fuse electrical connection is electrically connected to the second LED electrical connection and the second fuse electrical connection is electrically connected to the second electrode. A fused LED source wafer comprises an LED wafer having a patterned sacrificial layer forming an array of sacrificial portions separated by anchors and a plurality of fused LED components, each fused LED component disposed entirely on or over a corresponding sacrificial portion. A light-emission system comprises a system substrate and a plurality of fused LED components disposed on or over the system substrate.

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