公开(公告)号：US10833058B2

公开(公告)日：2020-11-10

申请号：US16688646

申请日：2019-11-19

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L23/31 ,  H01L25/16 ,  H01L33/44 ,  H01L33/06 ,  H01L33/00 ,  H01L33/42 ,  H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L25/00 ,  H01L33/54 ,  H01L21/56

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US20200020095A1

公开(公告)日：2020-01-16

申请号：US16581683

申请日：2019-09-24

Applicant: Apple Inc.

Inventor： Patrick J. Czarnota ,  Paul Argus Parks ,  Nile A. Light ,  Stephen P. Bathurst ,  John H. Higginson ,  Stephen R. Deming ,  Robert B. Martin ,  Tsan Y. Chan ,  Andreas Bibl

IPC: G06T7/00

Abstract: An optical verification method and mass transfer system described. In an embodiments, a mass transfer sequence may be accompanied by optical imaging and inspection to detect pick and place errors. The optical imaging and inspection techniques may be performed in-situ.

公开(公告)号：US10516081B1

公开(公告)日：2019-12-24

申请号：US15908492

申请日：2018-02-28

Applicant: Apple Inc.

Inventor： Xiaobin Xin ,  Dmitry S. Sizov ,  Andreas Bibl ,  Ion Bita ,  Yuan Chen ,  Lai Wang ,  Zhibing Ge

IPC: H01L33/24 ,  H01L33/60 ,  H01L33/42 ,  H01L33/18 ,  H01L27/15 ,  H01L33/52

Abstract: Light emitting structures are described in which vertical inorganic semiconductor-based light emitting diodes (LEDs) with hexagon shaped sidewalls are mounted within corresponding circular reflective well structures. Diffuser layers may additionally laterally surround the hexagon shaped sidewalls within the circular reflective well structures.

公开(公告)号：US10411210B2

公开(公告)日：2019-09-10

申请号：US15828069

申请日：2017-11-30

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Charles R. Griggs ,  James Michael Perkins

IPC: H01L51/50 ,  H01L27/15 ,  H01L23/00 ,  G09G3/00 ,  H01L21/683 ,  H01L27/12 ,  G09G3/3208

Abstract: A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.

公开(公告)号：US20190259907A1

公开(公告)日：2019-08-22

申请号：US16399853

申请日：2019-04-30

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC: H01L33/06 ,  H01L33/04 ,  H01L33/28 ,  H01L27/15 ,  H01L29/06 ,  H01L33/30 ,  F21V7/00 ,  H01L33/00

Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.

公开(公告)号：US10256221B2

公开(公告)日：2019-04-09

申请号：US15850862

申请日：2017-12-21

Applicant: Apple Inc

Inventor： Andreas Bibl ,  Charles R. Griggs

IPC: H01L25/16 ,  H01L27/02 ,  H01L33/00 ,  H01L33/54 ,  H01L33/56 ,  H01L33/06 ,  H01L33/62 ,  H01L33/30 ,  H01L27/12 ,  H01L23/00 ,  H01L33/20 ,  H01L33/48 ,  H01L25/075 ,  H01L33/44 ,  H01L33/08 ,  H01L33/52 ,  H01L33/60

Abstract: Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.

公开(公告)号：US20190043845A1

公开(公告)日：2019-02-07

申请号：US16145879

申请日：2018-09-28

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Kapil V. Sakariya ,  Vikram Pavate

IPC: H01L25/16 ,  G06F3/041 ,  H01L25/075 ,  G06F3/042 ,  G06F1/16 ,  H01L23/538 ,  H01L23/31 ,  H01L33/44

Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.

公开(公告)号：US10192858B2

公开(公告)日：2019-01-29

申请号：US15911693

申请日：2018-03-05

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L29/205 ,  H01L25/16 ,  H01L33/44 ,  H01L23/31 ,  H01L33/06 ,  H01L33/00 ,  H01L33/42 ,  H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L25/00 ,  H01L33/54 ,  H01L21/56

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.

公开(公告)号：US10043776B2

公开(公告)日：2018-08-07

申请号：US15182272

申请日：2016-06-14

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  John A. Higginson ,  Andreas Bibl

IPC: B23P19/00 ,  H01L23/00 ,  H01L25/16 ,  H01L33/00

CPC classification number: H01L24/75 ,  H01L24/97 ,  H01L25/167 ,  H01L33/00 ,  H01L2224/75725 ,  H01L2224/75843 ,  H01L2224/7598 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/351 ,  Y10T279/23 ,  H01L2924/00

Abstract: A micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.

公开(公告)号：US20180197844A1

公开(公告)日：2018-07-12

申请号：US15911693

申请日：2018-03-05

Applicant: Apple Inc.

Inventor： John A. Higginson ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/16 ,  H01L33/06 ,  H01L25/075 ,  H01L25/00 ,  H01L33/62 ,  H01L33/54 ,  H01L23/31 ,  H01L27/12 ,  H01L33/42

CPC classification number: H01L25/167 ,  H01L21/56 ,  H01L23/3171 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/1214 ,  H01L27/1248 ,  H01L27/1262 ,  H01L33/005 ,  H01L33/06 ,  H01L33/42 ,  H01L33/44 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.