公开(公告)号：US20100219523A1

公开(公告)日：2010-09-02

申请号：US12777023

申请日：2010-05-10

申请人： Seng Guan Chow ,  Heap Hoe Kuan ,  Dioscoro A. Merilo ,  Antonio B. Dimaano, JR.

发明人： Seng Guan Chow ,  Heap Hoe Kuan ,  Dioscoro A. Merilo ,  Antonio B. Dimaano, JR.

IPC分类号： H01L25/065 ,  H01L23/52

CPC分类号： H01L24/73 ,  H01L24/91 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06586 ,  H01L2225/06596 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2924/00

摘要： A stackable integrated circuit package system includes: a substrate having a first side and a second side opposite the first side, the substrate having a cavity provided therein; a first integrated circuit die in the cavity with a first interconnect extending out from the cavity without connection and a second interconnect connected to the first side; a first mold compound to cover the first integrated circuit die, the second interconnect, and a portion of the first interconnect; a second integrated circuit die mounted to the first integrated circuit die with a third interconnect connected to the second side; a second mold compound to cover the second integrated circuit die and the third interconnect; and external interconnects, not encapsulated by the second encapsulant, mounted on the second side.

摘要翻译： 一种可堆叠集成电路封装系统，包括：具有第一侧和与第一侧相对的第二侧的衬底，所述衬底具有设置在其中的空腔; 空腔中的第一集成电路裸片，具有从所述空腔延伸而不连接的第一互连和连接到所述第一侧的第二互连; 覆盖第一集成电路管芯，第二互连件和第一互连部分的第一模具化合物; 第二集成电路管芯，其安装到第一集成电路管芯，第三互连件连接到第二侧; 覆盖第二集成电路管芯和第三互连的第二模具化合物; 以及安装在第二侧上的未被第二密封剂封装的外部互连。

公开(公告)号：US20100065936A1

公开(公告)日：2010-03-18

申请号：US12623351

申请日：2009-11-20

申请人： Seng Guan Chow ,  Heap Hoe Kuan

发明人： Seng Guan Chow ,  Heap Hoe Kuan

IPC分类号： H01L31/0203

CPC分类号： H01L27/14618 ,  H01L2224/48227 ,  H01L2924/01067 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/10156 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package system is provided including providing a wafer including image sensor systems having interconnects connected thereto and encapsulating the image sensor systems and interconnects in a transparent encapsulant. The system includes removing a portion of the transparent encapsulant to expose portions of the interconnects and singulating the wafer to form image sensor devices including at least one of the image sensor systems and a number of the interconnects.

摘要翻译： 提供了一种集成电路封装系统，包括提供包括具有连接到其上的互连的图像传感器系统的晶片，并将图像传感器系统和互连封装在透明密封剂中。 该系统包括去除透明密封剂的一部分以暴露部分互连件并且分离晶片以形成包括图像传感器系统和多个互连件中的至少一个的图像传感器装置。

公开(公告)号：US20090309197A1

公开(公告)日：2009-12-17

申请号：US12137529

申请日：2008-06-11

申请人： Seng Guan Chow ,  Heap Hoe Kuan ,  Reza Argenty Pagaila

发明人： Seng Guan Chow ,  Heap Hoe Kuan ,  Reza Argenty Pagaila

IPC分类号： H01L23/552 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5387 ,  H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: fabricating an integrated circuit substrate; forming an internal stacking module coupled to the integrated circuit substrate including: forming a flexible substrate, coupling a stacking module integrated circuit to the flexible substrate, and bending a flexible extension over the stacking module integrated circuit; molding a package body on the integrated circuit substrate and the internal stacking module; and coupling an external integrated circuit to the internal stacking module exposed through the package body.

摘要翻译： 集成电路封装系统包括：制造集成电路基板; 形成耦合到所述集成电路基板的内部堆叠模块，包括：形成柔性基板，将堆叠模块集成电路耦合到所述柔性基板，以及在所述堆叠模块集成电路上弯曲柔性扩展; 在集成电路基板和内部堆叠模块上成型封装体; 并将外部集成电路耦合到通过封装主体暴露的内部堆叠模块。

公开(公告)号：US20090243077A1

公开(公告)日：2009-10-01

申请号：US12055642

申请日：2008-03-26

申请人： Seng Guan Chow ,  Linda Pei Ee Chua ,  Heap Hoe Kuan

发明人： Seng Guan Chow ,  Linda Pei Ee Chua ,  Heap Hoe Kuan

IPC分类号： H01L23/12 ,  H01L21/58

CPC分类号： H01L23/49503 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/4985 ,  H01L24/28 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48237 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: providing a protective layer having an opening; forming a conductive layer over the protective layer and filling the opening; patterning a rigid locking lead, having both a lead locking portion and a lead exposed portion, from the conductive layer; connecting an integrated circuit and the rigid locking lead; and forming an encapsulation over the integrated circuit with the lead locking portion in the encapsulation and the lead exposed portion exposed from the encapsulation.

摘要翻译： 集成电路封装系统包括：提供具有开口的保护层; 在保护层上形成导电层并填充开口; 从导电层图案化具有引线锁定部分和引线暴露部分的刚性锁定引线; 连接集成电路和刚性锁定引线; 以及在封装中的引线锁定部分和从封装暴露的引线暴露部分在集成电路上形成封装。

公开(公告)号：US20090179312A1

公开(公告)日：2009-07-16

申请号：US12409491

申请日：2009-03-24

申请人： Dioscoro A. Merilo ,  Heap Hoe Kuan ,  You Yang Ong ,  Seng Guan Chow ,  Ma. Shirley Asoy

发明人： Dioscoro A. Merilo ,  Heap Hoe Kuan ,  You Yang Ong ,  Seng Guan Chow ,  Ma. Shirley Asoy

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L23/49833 ,  H01L23/49861 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/078 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/0401

摘要： An integrated circuit package-on-package stacking method includes forming a leadframe interposer including: forming a leadframe having a lead; forming a molded base only supporting the lead; and singulating the leadframe interposer from the leadframe.

摘要翻译： 一种集成电路封装堆叠堆叠方法，包括形成引线框架插入器，包括：形成具有引线的引线框架; 形成仅支撑引线的模制基座; 并从引线框架中分离引线框架插入器。

公开(公告)号：US20080029858A1

公开(公告)日：2008-02-07

申请号：US11462320

申请日：2006-08-03

申请人： Dioscoro A. Merilo ,  Heap Hoe Kuan ,  You Yang Ong ,  Seng Guan Chow ,  Ma. Shirley Asoy

发明人： Dioscoro A. Merilo ,  Heap Hoe Kuan ,  You Yang Ong ,  Seng Guan Chow ,  Ma. Shirley Asoy

IPC分类号： H01L23/495

CPC分类号： H01L25/105 ,  H01L23/3128 ,  H01L23/49833 ,  H01L23/49861 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/078 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/0401

摘要： An integrated circuit package-on-package stacking system is provided including, forming a leadframe interposer including: forming a leadframe; forming a molded base on the leadframe; and singulating the leadframe interposer from the leadframe.

摘要翻译： 提供了一种集成电路封装堆叠堆叠系统，包括：形成引线框架中介层，包括：形成引线框架; 在引线框架上形成模制基座; 并从引线框架中分离引线框架插入器。

公开(公告)号：US09299648B2

公开(公告)日：2016-03-29

申请号：US12714291

申请日：2010-02-26

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Heap Hoe Kuan

IPC分类号： H01L23/02 ,  H01L23/498 ,  H01L23/31 ,  H01L25/10

CPC分类号： H01L23/49816 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49827 ,  H01L25/105 ,  H01L2224/14181 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/17519 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having a component side and a system side; depositing a solder resist layer on the component side of the package substrate; patterning groups of access openings and a die mount opening in the solder resist layer; attaching an integrated circuit die in the die mount opening; forming conductive contacts in the access openings; and attaching system interconnects to the system side of the package substrate including controlling a coplanarity of the system interconnects by the solder resist layer.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有元件侧和系统侧的封装基板; 在所述封装衬底的所述元件侧上沉积阻焊层; 在阻焊层中形成存取开口的组和模具安装开口; 将集成电路管芯安装在管芯安装口中; 在所述进入开口中形成导电触点; 以及将系统互连件附接到封装衬底的系统侧，包括通过阻焊层控制系统互连的共面性。

公开(公告)号：US09030006B2

公开(公告)日：2015-05-12

申请号：US13563598

申请日：2012-07-31

申请人： Seng Guan Chow ,  Heap Hoe Kuan ,  Reza Argenty Pagaila

发明人： Seng Guan Chow ,  Heap Hoe Kuan ,  Reza Argenty Pagaila

IPC分类号： H01L23/34 ,  H01L23/31 ,  H01L21/56 ,  H01L23/552 ,  H01L25/03 ,  H01L25/065 ,  H01L25/10 ,  H01L25/16 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5387 ,  H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: providing an integrated circuit substrate; forming an internal stacking module coupled to the integrated circuit substrate including: forming a flexible substrate, coupling a stacking module integrated circuit to the flexible substrate, and bending a flexible extension over the stacking module integrated circuit; and molding a package body on the integrated circuit substrate and the internal stacking module.

摘要翻译： 集成电路封装系统包括：提供集成电路基板; 形成耦合到所述集成电路基板的内部堆叠模块，包括：形成柔性基板，将堆叠模块集成电路耦合到所述柔性基板，以及在所述堆叠模块集成电路上弯曲柔性扩展; 以及在集成电路基板和内部堆叠模块上成型封装体。

公开(公告)号：US08852986B2

公开(公告)日：2014-10-07

申请号：US11749717

申请日：2007-05-16

申请人： Heap Hoe Kuan ,  Pei Ee Chua ,  Seng Guan Chow

发明人： Heap Hoe Kuan ,  Pei Ee Chua ,  Seng Guan Chow

IPC分类号： H01L23/31

CPC分类号： B29C45/14655 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/19107 ,  H01L2924/00014

摘要： An integrated circuit package system that includes: providing a support structure including a device and an electrical contact adjacent thereto; providing a mold system having a cavity, a recess channel, a recess integrally connected to the recess channel, and a resilient member that cooperatively engages the recess channel and the recess; engaging the mold system and the support structure with the cavity over the device and the resilient member between the device and the electrical contact; and injecting encapsulation material into the cavity.

摘要翻译： 一种集成电路封装系统，包括：提供包括与其相邻的器件和电触点的支撑结构; 提供具有空腔的模具系统，凹槽，与所述凹槽一体连接的凹部以及与所述凹槽和所述凹部配合地接合的弹性构件; 使所述模具系统和所述支撑结构与所述装置上的空腔和所述装置与所述电触头之间的所述弹性构件接合; 以及将包封材料注入到所述腔中。

公开(公告)号：US08604602B2

公开(公告)日：2013-12-10

申请号：US12777415

申请日：2010-05-11

申请人： Seng Guan Chow ,  Il Kwon Shim ,  Heap Hoe Kuan ,  Youngcheol Kim

发明人： Seng Guan Chow ,  Il Kwon Shim ,  Heap Hoe Kuan ,  Youngcheol Kim

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L21/00

CPC分类号： H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: fabricating a base package substrate having a component side and a system side; coupling stacking interconnects on the component side; and forming an integrated circuit receptacle, for receiving an integrated circuit device, by molding a reinforced encapsulant on the component side and exposing a portion of the stacking interconnects.

摘要翻译： 一种集成电路封装系统的制造方法，包括：制造具有元件侧和系统侧的基底封装基板; 在组件侧耦合堆叠互连; 以及形成用于接收集成电路器件的集成电路插座，通过在组件侧上模制增强的密封剂并暴露所述堆叠互连的一部分。